JP7388536B2 - 半導体装置及びモジュール - Google Patents

半導体装置及びモジュール Download PDF

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Publication number
JP7388536B2
JP7388536B2 JP2022501894A JP2022501894A JP7388536B2 JP 7388536 B2 JP7388536 B2 JP 7388536B2 JP 2022501894 A JP2022501894 A JP 2022501894A JP 2022501894 A JP2022501894 A JP 2022501894A JP 7388536 B2 JP7388536 B2 JP 7388536B2
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Japan
Prior art keywords
external electrode
semiconductor substrate
wall portion
layer
semiconductor device
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JP2022501894A
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English (en)
Japanese (ja)
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JPWO2021166880A1 (https=
Inventor
弘 松原
真臣 原田
武史 香川
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Murata Manufacturing Co Ltd
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Murata Manufacturing Co Ltd
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D1/00—Resistors, capacitors or inductors
    • H10D1/60—Capacitors
    • H10D1/68—Capacitors having no potential barriers
    • H10D1/692—Electrodes
    • H10D1/696—Electrodes comprising multiple layers, e.g. comprising a barrier layer and a metal layer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/005—Electrodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/005—Electrodes
    • H01G4/012—Form of non-self-supporting electrodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/018—Dielectrics
    • H01G4/06—Solid dielectrics
    • H01G4/08—Inorganic dielectrics
    • H01G4/10—Metal-oxide dielectrics
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/224—Housing; Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals
    • H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals
    • H01G4/252—Terminals the terminals being coated on the capacitive element
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/30—Stacked capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/33—Thin- or thick-film capacitors (thin- or thick-film circuits; capacitors without a potential-jump or surface barrier specially adapted for integrated circuits, details thereof, multistep manufacturing processes therefor)
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/01—Manufacture or treatment
    • H10D84/02—Manufacture or treatment characterised by using material-based technologies
    • H10D84/03—Manufacture or treatment characterised by using material-based technologies using Group IV technology, e.g. silicon technology or silicon-carbide [SiC] technology
    • H10D84/038—Manufacture or treatment characterised by using material-based technologies using Group IV technology, e.g. silicon technology or silicon-carbide [SiC] technology using silicon technology, e.g. SiGe
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/005—Electrodes
    • H01G4/008—Selection of materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Ceramic Capacitors (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Semiconductor Integrated Circuits (AREA)
JP2022501894A 2020-02-17 2021-02-16 半導体装置及びモジュール Active JP7388536B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020024563 2020-02-17
JP2020024563 2020-02-17
PCT/JP2021/005626 WO2021166880A1 (ja) 2020-02-17 2021-02-16 半導体装置及びモジュール

Publications (2)

Publication Number Publication Date
JPWO2021166880A1 JPWO2021166880A1 (https=) 2021-08-26
JP7388536B2 true JP7388536B2 (ja) 2023-11-29

Family

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Application Number Title Priority Date Filing Date
JP2022501894A Active JP7388536B2 (ja) 2020-02-17 2021-02-16 半導体装置及びモジュール

Country Status (4)

Country Link
US (1) US12464740B2 (https=)
JP (1) JP7388536B2 (https=)
CN (1) CN115088071A (https=)
WO (1) WO2021166880A1 (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE112022002407T5 (de) * 2021-05-03 2024-02-15 KYOCERA AVX Components Corporation Metalloxidhalbleiter-kondensator und leiterplatte, in der ein solcher eingebettet ist
JP7647933B2 (ja) * 2021-12-08 2025-03-18 株式会社村田製作所 半導体装置、マッチング回路及びフィルタ回路
JP7758341B2 (ja) * 2022-03-07 2025-10-22 住友電工デバイス・イノベーション株式会社 キャパシタおよびその製造方法
CN118541810A (zh) * 2022-04-24 2024-08-23 华为技术有限公司 电容器及其制备方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016021529A1 (ja) 2014-08-06 2016-02-11 株式会社村田製作所 複合電子部品
WO2017057422A1 (ja) 2015-10-02 2017-04-06 株式会社村田製作所 薄膜型ｌｃ部品およびその実装構造

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5234521B2 (ja) 2009-08-21 2013-07-10 Ｔｄｋ株式会社 電子部品及びその製造方法
CN205282460U (zh) * 2013-05-31 2016-06-01 株式会社村田制作所 半导体装置及安装构造
WO2016129304A1 (ja) * 2015-02-12 2016-08-18 株式会社村田製作所 薄膜デバイス
JP7156369B2 (ja) * 2018-04-27 2022-10-19 株式会社村田製作所 キャパシタ集合体
JP2020004886A (ja) * 2018-06-29 2020-01-09 太陽誘電株式会社 半導体モジュール
JP7197001B2 (ja) * 2019-05-13 2022-12-27 株式会社村田製作所 キャパシタ

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016021529A1 (ja) 2014-08-06 2016-02-11 株式会社村田製作所 複合電子部品
WO2017057422A1 (ja) 2015-10-02 2017-04-06 株式会社村田製作所 薄膜型ｌｃ部品およびその実装構造

Also Published As

Publication number Publication date
CN115088071A (zh) 2022-09-20
WO2021166880A1 (ja) 2021-08-26
JPWO2021166880A1 (https=) 2021-08-26
US12464740B2 (en) 2025-11-04
US20220376036A1 (en) 2022-11-24

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