JPWO2021166880A1 - - Google Patents
Info
- Publication number
- JPWO2021166880A1 JPWO2021166880A1 JP2022501894A JP2022501894A JPWO2021166880A1 JP WO2021166880 A1 JPWO2021166880 A1 JP WO2021166880A1 JP 2022501894 A JP2022501894 A JP 2022501894A JP 2022501894 A JP2022501894 A JP 2022501894A JP WO2021166880 A1 JPWO2021166880 A1 JP WO2021166880A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D1/00—Resistors, capacitors or inductors
- H10D1/60—Capacitors
- H10D1/68—Capacitors having no potential barriers
- H10D1/692—Electrodes
- H10D1/696—Electrodes comprising multiple layers, e.g. comprising a barrier layer and a metal layer
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/005—Electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/005—Electrodes
- H01G4/008—Selection of materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/005—Electrodes
- H01G4/012—Form of non-self-supporting electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/08—Inorganic dielectrics
- H01G4/10—Metal-oxide dielectrics
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/224—Housing; Encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
- H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
- H01G4/252—Terminals the terminals being coated on the capacitive element
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/33—Thin- or thick-film capacitors (thin- or thick-film circuits; capacitors without a potential-jump or surface barrier specially adapted for integrated circuits, details thereof, multistep manufacturing processes therefor)
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
- H10D84/01—Manufacture or treatment
- H10D84/02—Manufacture or treatment characterised by using material-based technologies
- H10D84/03—Manufacture or treatment characterised by using material-based technologies using Group IV technology, e.g. silicon technology or silicon-carbide [SiC] technology
- H10D84/038—Manufacture or treatment characterised by using material-based technologies using Group IV technology, e.g. silicon technology or silicon-carbide [SiC] technology using silicon technology, e.g. SiGe
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Inorganic Chemistry (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Ceramic Capacitors (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Semiconductor Integrated Circuits (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020024563 | 2020-02-17 | ||
| JP2020024563 | 2020-02-17 | ||
| PCT/JP2021/005626 WO2021166880A1 (ja) | 2020-02-17 | 2021-02-16 | 半導体装置及びモジュール |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2021166880A1 true JPWO2021166880A1 (https=) | 2021-08-26 |
| JP7388536B2 JP7388536B2 (ja) | 2023-11-29 |
Family
ID=77392098
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022501894A Active JP7388536B2 (ja) | 2020-02-17 | 2021-02-16 | 半導体装置及びモジュール |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US12464740B2 (https=) |
| JP (1) | JP7388536B2 (https=) |
| CN (1) | CN115088071A (https=) |
| WO (1) | WO2021166880A1 (https=) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE112022002407T5 (de) * | 2021-05-03 | 2024-02-15 | KYOCERA AVX Components Corporation | Metalloxidhalbleiter-kondensator und leiterplatte, in der ein solcher eingebettet ist |
| JP7647933B2 (ja) * | 2021-12-08 | 2025-03-18 | 株式会社村田製作所 | 半導体装置、マッチング回路及びフィルタ回路 |
| JP7758341B2 (ja) * | 2022-03-07 | 2025-10-22 | 住友電工デバイス・イノベーション株式会社 | キャパシタおよびその製造方法 |
| CN118541810A (zh) * | 2022-04-24 | 2024-08-23 | 华为技术有限公司 | 电容器及其制备方法 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2016021529A1 (ja) * | 2014-08-06 | 2016-02-11 | 株式会社村田製作所 | 複合電子部品 |
| WO2017057422A1 (ja) * | 2015-10-02 | 2017-04-06 | 株式会社村田製作所 | 薄膜型ｌｃ部品およびその実装構造 |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5234521B2 (ja) | 2009-08-21 | 2013-07-10 | Ｔｄｋ株式会社 | 電子部品及びその製造方法 |
| CN205282460U (zh) * | 2013-05-31 | 2016-06-01 | 株式会社村田制作所 | 半导体装置及安装构造 |
| WO2016129304A1 (ja) * | 2015-02-12 | 2016-08-18 | 株式会社村田製作所 | 薄膜デバイス |
| JP7156369B2 (ja) * | 2018-04-27 | 2022-10-19 | 株式会社村田製作所 | キャパシタ集合体 |
| JP2020004886A (ja) * | 2018-06-29 | 2020-01-09 | 太陽誘電株式会社 | 半導体モジュール |
| JP7197001B2 (ja) * | 2019-05-13 | 2022-12-27 | 株式会社村田製作所 | キャパシタ |
-
2021
- 2021-02-16 WO PCT/JP2021/005626 patent/WO2021166880A1/ja not_active Ceased
- 2021-02-16 JP JP2022501894A patent/JP7388536B2/ja active Active
- 2021-02-16 CN CN202180014437.9A patent/CN115088071A/zh active Pending
-
2022
- 2022-08-03 US US17/880,113 patent/US12464740B2/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2016021529A1 (ja) * | 2014-08-06 | 2016-02-11 | 株式会社村田製作所 | 複合電子部品 |
| WO2017057422A1 (ja) * | 2015-10-02 | 2017-04-06 | 株式会社村田製作所 | 薄膜型ｌｃ部品およびその実装構造 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP7388536B2 (ja) | 2023-11-29 |
| CN115088071A (zh) | 2022-09-20 |
| WO2021166880A1 (ja) | 2021-08-26 |
| US12464740B2 (en) | 2025-11-04 |
| US20220376036A1 (en) | 2022-11-24 |
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