JP7357807B2 - 表示素子封止材、有機ｅｌ素子封止材および表示素子封止シート - Google Patents

表示素子封止材、有機ｅｌ素子封止材および表示素子封止シート Download PDF

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JP7357807B2
JP7357807B2 JP2022557008A JP2022557008A JP7357807B2 JP 7357807 B2 JP7357807 B2 JP 7357807B2 JP 2022557008 A JP2022557008 A JP 2022557008A JP 2022557008 A JP2022557008 A JP 2022557008A JP 7357807 B2 JP7357807 B2 JP 7357807B2
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resin
mass
sealing
parts
display element
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Japanese (ja)
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JPWO2022080372A1 (ko
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正利 高木
宙 宮尾
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Mitsui Chemicals Inc
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Mitsui Chemicals Inc
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/02—Details
    • H05B33/04—Sealing arrangements, e.g. against humidity
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
    • C08G65/02—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring
    • C08G65/04—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring from cyclic ethers only
    • C08G65/06—Cyclic ethers having no atoms other than carbon and hydrogen outside the ring
    • C08G65/16—Cyclic ethers having four or more ring atoms
    • C08G65/18—Oxetanes
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations
    • H10K59/8731—Encapsulations multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Optics & Photonics (AREA)
  • Electroluminescent Light Sources (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
JP2022557008A 2020-10-13 2021-10-12 表示素子封止材、有機ｅｌ素子封止材および表示素子封止シート Active JP7357807B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020172351 2020-10-13
JP2020172351 2020-10-13
PCT/JP2021/037751 WO2022080372A1 (ja) 2020-10-13 2021-10-12 表示素子封止材、有機ｅｌ素子封止材および表示素子封止シート

Publications (2)

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JPWO2022080372A1 JPWO2022080372A1 (ko) 2022-04-21
JP7357807B2 true JP7357807B2 (ja) 2023-10-06

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JP2022557008A Active JP7357807B2 (ja) 2020-10-13 2021-10-12 表示素子封止材、有機ｅｌ素子封止材および表示素子封止シート

Country Status (5)

Country Link
JP (1) JP7357807B2 (ko)
KR (1) KR20230027195A (ko)
CN (1) CN116114383A (ko)
TW (1) TW202221097A (ko)
WO (1) WO2022080372A1 (ko)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014225380A (ja) 2013-05-16 2014-12-04 積水化学工業株式会社 有機エレクトロルミネッセンス表示素子用封止剤及び有機エレクトロルミネッセンス表示素子の製造方法
JP2015185272A (ja) 2014-03-20 2015-10-22 積水化学工業株式会社 有機光デバイスの製造方法及び硬化性樹脂組成物

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4941295B2 (ja) 2005-03-29 2012-05-30 株式会社スリーボンド 有機ｅｌ素子封止用フィルム及び有機ｅｌ素子の封止構造体
WO2015129670A1 (ja) 2014-02-27 2015-09-03 積水化学工業株式会社 有機エレクトロルミネッセンス表示素子封止用硬化性樹脂組成物、有機エレクトロルミネッセンス表示素子封止用硬化性樹脂シート、及び、有機エレクトロルミネッセンス表示素子
JP2017031383A (ja) * 2015-08-06 2017-02-09 Jsr株式会社 有機電子デバイス用素子の封止用樹脂組成物

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014225380A (ja) 2013-05-16 2014-12-04 積水化学工業株式会社 有機エレクトロルミネッセンス表示素子用封止剤及び有機エレクトロルミネッセンス表示素子の製造方法
JP2015185272A (ja) 2014-03-20 2015-10-22 積水化学工業株式会社 有機光デバイスの製造方法及び硬化性樹脂組成物

Also Published As

Publication number Publication date
CN116114383A (zh) 2023-05-12
JPWO2022080372A1 (ko) 2022-04-21
WO2022080372A1 (ja) 2022-04-21
TW202221097A (zh) 2022-06-01
KR20230027195A (ko) 2023-02-27

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