WO2022080372A1 - 表示素子封止材、有機ｅｌ素子封止材および表示素子封止シート - Google Patents

表示素子封止材、有機ｅｌ素子封止材および表示素子封止シート Download PDF

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WO2022080372A1
WO2022080372A1 PCT/JP2021/037751 JP2021037751W WO2022080372A1 WO 2022080372 A1 WO2022080372 A1 WO 2022080372A1 JP 2021037751 W JP2021037751 W JP 2021037751W WO 2022080372 A1 WO2022080372 A1 WO 2022080372A1
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resin
mass
display element
parts
organic
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PCT/JP2021/037751
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English (en)
French (fr)
Japanese (ja)
Inventor
正利 高木
宙 宮尾
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三井化学株式会社
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Priority to CN202180058171.8A priority Critical patent/CN116114383A/zh
Priority to JP2022557008A priority patent/JP7357807B2/ja
Priority to KR1020237001873A priority patent/KR20230027195A/ko
Publication of WO2022080372A1 publication Critical patent/WO2022080372A1/ja

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
    • C08G65/02—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring
    • C08G65/04—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring from cyclic ethers only
    • C08G65/06—Cyclic ethers having no atoms other than carbon and hydrogen outside the ring
    • C08G65/16—Cyclic ethers having four or more ring atoms
    • C08G65/18—Oxetanes
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/02—Details
    • H05B33/04—Sealing arrangements, e.g. against humidity
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations
    • H10K59/8731—Encapsulations multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers

Definitions

  • the present invention relates to a display element encapsulant, an organic EL element encapsulant, and a display element encapsulation sheet.
  • an image display device provided with a display element, for example, a liquid crystal display and an organic electroluminescence (hereinafter referred to as organic EL) display are known.
  • the display element is sealed by a sealing member. This prevents the display element from deteriorating due to moisture in the atmosphere or the like.
  • the sealing member is formed, for example, by embedding a display element in the sealing resin composition and then curing the sealing resin composition. Therefore, various compositions of the sealing resin composition have been studied in order to impart the required performance according to various uses to the sealing member.
  • a curable resin composition for encapsulating an organic EL display element containing a phenoxy resin, a cycloalkene oxide type alicyclic epoxy compound, and a curing agent has been proposed (see, for example, Patent Document 1).
  • these sealing resin compositions are cured by heating to seal the display element.
  • the seal member which is a cured product of the curable resin composition for encapsulating an organic EL display element described in Patent Document 1, has a high dielectric constant, and therefore, when used for a touch panel of an organic EL display, for example, the seal member The touch panel may malfunction due to the noise caused by the above.
  • the epoxy resin composition described in Patent Document 2 may flow before curing and may be displaced from a desired position and cured.
  • the present invention provides a display element encapsulant, an organic EL element encapsulant, and a display element encapsulation that can form a sealing member having a relatively low dielectric constant while improving initial curability and suppressing positional deviation with respect to the display element.
  • a sheet Provide a sheet.
  • the present invention [1] contains a resin component, an oxetane compound, and a curing agent, and the resin component contains an epoxidized polybutadiene resin, a biphenyl skeleton-containing epoxy resin, and a tackifier-imparting resin. Includes element encapsulant.
  • the content ratio of the epoxidized polybutadiene resin exceeds 20 parts by mass and is less than 35 parts by mass with respect to 100 parts by mass in total of the resin component and the oxetane compound.
  • the display element encapsulant described in 1] is included.
  • the content ratio of the biphenyl skeleton-containing epoxy resin exceeds 20 parts by mass with respect to 100 parts by mass in total of the resin component and the oxetane compound, according to the above [1] or [2].
  • the display element encapsulant according to.
  • the content ratio of the oxetane compound exceeds 5 parts by mass and is less than 20 parts by mass with respect to 100 parts by mass in total of the resin component and the oxetane compound [1].
  • the display element encapsulant according to any one of [3] is included.
  • the display element encapsulant according to any one of [1] to [4] above, wherein the tackifying resin contains an alicyclic hydrocarbon resin and / or a terpene phenol resin. including.
  • the present invention [6] includes an organic EL element encapsulant comprising the display element encapsulant according to any one of the above [1] to [5].
  • the present invention [7] includes a display element encapsulation sheet having a encapsulation layer made of the display element encapsulant according to any one of the above [1] to [5].
  • the display element encapsulant, the organic EL element encapsulant, and the display element encapsulation sheet of the present invention contain an epoxidized polybutadiene resin, a biphenyl skeleton-containing epoxy resin, an adhesiveness-imparting resin, and an oxetane compound. Therefore, the initial curability can be improved, and a seal member having a relatively low dielectric constant can be formed while suppressing the positional deviation with respect to the display element.
  • FIG. 1 is a side sectional view of a sealing sheet as an embodiment of the display element sealing sheet of the present invention.
  • FIG. 2 is a side sectional view of an organic EL display with a touch sensor as an embodiment (a mode having an in-cell structure or an on-cell structure) of an image display device including a sealing member formed from the sealing layer shown in FIG. .
  • FIG. 3 is a side sectional view of an organic EL display with a touch sensor as another embodiment of the image display device (a mode having an out-cell structure).
  • the display element encapsulant (hereinafter referred to as a encapsulant) of the present invention is a encapsulation resin composition (display element encapsulation resin composition) for encapsulating a display element provided in an image display device described later. It is a curable resin composition that forms a seal member described later by being cured.
  • the encapsulant contains a resin component, an oxetane compound, and a curing agent.
  • Resin component contains an epoxidized polybutadiene resin, a biphenyl skeleton-containing epoxy resin, and an adhesiveness-imparting resin as essential components.
  • Epoxidized polybutadiene resin is a polyfunctional epoxy resin having a polybutadiene skeleton and a plurality of epoxy groups.
  • the polyfunctional epoxy resin includes a bifunctional epoxy resin (the same applies hereinafter).
  • the polybutadiene skeleton is a molecular chain (main chain) composed of a polymer of 1,3-butadiene.
  • the polybutadiene skeleton contains a 1,2-polybutadiene molecular structure and has a side chain branched from the above molecular chain.
  • the epoxy group is located in the side chain of the polybutadiene skeleton.
  • the epoxy group is introduced by oxidizing the vinyl group of 1,2-polybutadiene contained in the polybutadiene skeleton.
  • the epoxidized polybutadiene resin is compatible with the tackifying resin.
  • the solubility parameter (hereinafter referred to as SP value) of the epoxidized polybutadiene resin is, for example, 9.0 (cal / cm 3 ) 1/2 or more and 10.0 (cal / cm 3 ) 1/2 or less.
  • the SP value can be calculated by the calculation software CHEOPS (version 4.0) manufactured by Million Zillion Software (the same applies hereinafter). The calculation method used in the calculation software is described in Computational Materials Science of Polymers (A.A. Askadskii, Cambridge Industry Pub (2005/12/30)) Chapter XII.
  • the number average molecular weight (Mn) of the epoxidized polybutadiene resin is, for example, 3,000 or more, preferably 5,000 or more, and for example, 10,000 or less, preferably 8,000 or less.
  • the number average molecular weight (Mn) can be determined by gel permeation chromatography (GPC) using polystyrene as a standard substance (the same applies hereinafter).
  • the epoxy equivalent in the epoxidized polybutadiene resin is, for example, 100 g / eq. As mentioned above, preferably 150 g / eq. Further, for example, 300 g / eq. Hereinafter, preferably 250 g / eq. It is as follows. Epoxy equivalents can be measured in accordance with JIS K7236: 2001 (same below).
  • Such epoxidized polybutadiene resin can be used alone or in combination of two or more.
  • the content ratio of the epoxidized polybutadiene resin exceeds, for example, 5 parts by mass or more, preferably 10 parts by mass or more, and more preferably 20 parts by mass with respect to 100 parts by mass of the total of the resin component and the oxetane compound. More preferably, it is 22 parts by mass or more, and for example, 60 parts by mass or less, preferably 50 parts by mass or less, more preferably 40 parts by mass or less, particularly preferably less than 35 parts by mass, and particularly preferably 30 parts by mass. Less than parts, most preferably 28 parts by mass or less.
  • the content ratio of the epoxidized polybutadiene resin is within the above range, the initial curability of the encapsulant can be surely improved, and the dielectric constant of the sealing member, which will be described later, can be surely reduced.
  • the biphenyl skeleton-containing epoxy resin is, for example, a polyfunctional epoxy resin having a plurality of biphenyl skeletons and a plurality of epoxy groups.
  • the biphenyl skeleton-containing epoxy resin is preferably a bifunctional epoxy resin having a molecular chain containing a plurality of biphenyl skeletons and an epoxy group bonded to both ends of the molecular chain.
  • the biphenyl skeleton-containing epoxy resin is more preferably represented by the following formula (1).
  • Equation (1) [In formula (1), I, II and III are constituent units, each of I and III represents a terminal unit, and II represents a repeating unit.
  • R 1 represents a hydrogen atom or an alkyl group having 1 to 6 carbon atoms.
  • the biphenyl skeleton-containing epoxy resin represented by the above formula (1) is a copolymer of a dihydroxybiphenyl derivative and epichlorohydrin, and binds to a molecular chain containing a plurality of biphenyl skeletons and both ends of the molecular chain. It has a glycidyl ether unit.
  • Examples of the alkyl group represented by R 1 in the above formula (1) include a linear alkyl group having 1 to 6 carbon atoms and a branched alkyl group having 3 to 6 carbon atoms.
  • Examples of the linear alkyl group having 1 to 6 carbon atoms include methyl, ethyl, propyl, butyl, pentyl, and hexyl.
  • Examples of the branched alkyl group having 3 to 6 carbon atoms include isopropyl, isobutyl, and tert-butyl.
  • R 1 of the above formula (1) a hydrogen atom and a methyl group are preferably mentioned. Further, the plurality of R 1s in the equation (1) may be the same or different from each other.
  • the R 1 bonded to the 3rd and 5th positions of the benzene ring is preferably a methyl group.
  • R 1 bonded to the 2-position and the 6-position of the benzene ring is preferably a hydrogen atom.
  • the biphenyl skeleton-containing epoxy resin represented by the above formula (1) may contain other structural units in addition to the structural units I to III.
  • other constituent units include a polyol unit derived from a divalent or higher-valent polyol, a bisphenol unit derived from bisphenol, and the like.
  • the weight average molecular weight (Mw) of the biphenyl skeleton-containing epoxy resin is, for example, 200 or more, preferably 250 or more, and for example, 100,000 or less, preferably 90,000 or less.
  • the weight average molecular weight (Mw) can be determined by gel permeation chromatography (GPC) using polystyrene as a standard substance (the same applies hereinafter).
  • the epoxy equivalent in the epoxy resin containing a biphenyl skeleton is, for example, 500 g / eq. As mentioned above, preferably 1,000 g / eq. As mentioned above, for example, 20,000 g / eq. Hereinafter, preferably, 16,000 g / eq. It is as follows.
  • Such a biphenyl skeleton-containing epoxy resin can be used alone or in combination of two or more.
  • the content ratio of the biphenyl skeleton-containing epoxy resin exceeds, for example, 5 parts by mass or more, preferably 15 parts by mass or more, and more preferably 20 parts by mass with respect to 100 parts by mass of the total of the resin component and the oxetane compound. More preferably, it is 22 parts by mass or more, and for example, 50 parts by mass or less, preferably 40 parts by mass or less, and more preferably 30 parts by mass or less.
  • the initial curability of the encapsulant can be improved more reliably, and the dielectric constant of the sealing member, which will be described later, can be more reliably reduced. can.
  • (1-3) Adhesive-imparting resin By containing the adhesive-imparting resin in the encapsulant, it is possible to impart tackiness to the encapsulant while maintaining the dielectric constant of the sealing member described later.
  • the tackifying resin contains a ring skeleton (aliphatic ring and / or aromatic ring) and does not contain an epoxy group.
  • tackifying resin examples include petroleum-based resin, terpene resin, phenol resin, and rosin resin.
  • Examples of the petroleum-based resin include the petroleum resins described in paragraphs [0056] and [0057] of International Publication No. 2020/031941.
  • terpene resin examples include the terpene-based resin described in paragraph [0058] of International Publication No. 2020/031941.
  • phenol resin examples include the phenol resin described in paragraph [0059] of International Publication No. 2020/031941.
  • rosin resin examples include the rosin resin described in paragraph [0060] of International Publication No. 2020/031941.
  • adhesive-imparting resins petroleum-based resins and terpene resins are preferable.
  • the petroleum-based resin preferably includes an alicyclic hydrocarbon resin, and more preferably an ester-modified hydrocarbon resin.
  • the ester-modified hydrocarbon resin has an ester group introduced into the petroleum-based hydrocarbon resin.
  • the petroleum-based hydrocarbon resin uses dicyclopentadiene extracted from the C5 distillate obtained by naphtha decomposition as a main raw material.
  • the petroleum-based hydrocarbon resin preferably includes a homopolymer of dicyclopentadiene.
  • the ester-modified hydrocarbon resin has an aliphatic ring derived from dicyclopentadiene and an atomic group containing an ester group.
  • the atomic group containing an ester group include a vinyl acetate unit derived from vinyl acetate.
  • the weight average molecular weight (Mw) of the ester-modified hydrocarbon resin is, for example, 500 or more, and for example, less than 10,000, preferably 4,000 or less.
  • the Ken value of the ester-modified hydrocarbon resin is, for example, 100 mgKOH / g or more and 200 mgKOH / g or less.
  • the Ken value can be measured according to the method described in JIS K0070.
  • the terpene resin is preferably a terpene phenol resin.
  • the terpene phenol resin is a copolymer (reactant) of a terpene compound and a phenol compound.
  • the terpene phenol resin is prepared by reacting a terpene compound and a phenol compound at 20 ° C. to 150 ° C. for 1 to 20 hours in the presence of an acidic catalyst.
  • Acid catalysts include, for example, hydrochloric acid, sulfuric acid and cation exchange resins.
  • the terpene compound has a hydrocarbon having isoprene (C5 H 8 ) as a constituent unit as a main skeleton.
  • examples of the terpene compound include ⁇ -pinene, ⁇ -pinene, dipentene, limonene, ⁇ -pherandrene, ⁇ -pherandrene, ⁇ -terpinene, ⁇ -terpinene, ⁇ -terpinene, terpinene, milsen, aloosimene, 1,8-.
  • terpene compound can be used alone or in combination of two or more.
  • phenol compound examples include phenol, cresol, xylenol, propylphenol, nonylphenol, hydroquinone, resorcin, methoxyphenol, bromophenol, bisphenol A, and bisphenol F.
  • the phenol compound can be used alone or in combination of two or more. Among the phenol compounds, phenol is preferable.
  • the range of the weight average molecular weight (Mw) of the terpene phenol resin is the same as the range of the weight average molecular weight (Mw) of the ester-modified hydrocarbon resin described above.
  • Such an adhesive resin can be used alone or in combination of two or more.
  • the tackifying resin preferably contains an alicyclic hydrocarbon resin and / or a terpene phenol resin, and more preferably consists of an alicyclic hydrocarbon resin and / or a terpene phenol resin.
  • the tackifying resin preferably contains an alicyclic hydrocarbon resin and a terpene phenol resin from the viewpoint of reducing the dielectric constant of the sealing member described later. Further, the tackifying resin is preferably made of an alicyclic hydrocarbon resin from the viewpoint of improving the initial curability of the encapsulant.
  • the SP value of the tackifying resin is, for example, 8.8 (cal / cm 3 ) 1/2 or more, preferably 9.0 (cal / cm 3 ) 1/2 or more, and for example, 11.5 ( cal / cm 3 ) 1/2 or less, preferably 10.0 (cal / cm 3 ) 1/2 or less, more preferably 9.5 (cal / cm 3 ) 1/2 or less, still more preferably 9 .2 (cal / cm 3 ) 1/2 or less.
  • the content ratio of the tackifying resin is, for example, 5 parts by mass or more, preferably 10 parts by mass or more, more preferably 20 parts by mass or more, and more preferably 20 parts by mass or more, based on 100 parts by mass of the total of the resin component and the oxetane compound. For example, it is 50 parts by mass or less, preferably 40 parts by mass or less, and more preferably 30 parts by mass or less.
  • the resin component can further contain a bisphenol skeleton-containing epoxy resin as an optional component.
  • the bisphenol skeleton-containing epoxy resin is a polyfunctional epoxy resin having a plurality of bisphenol skeletons and a plurality of epoxy groups.
  • the bisphenol skeleton-containing epoxy resin is preferably a bifunctional epoxy resin having a molecular chain containing a plurality of bisphenol skeletons and a glycidyl ether unit bonded to both ends of the molecular chain.
  • the bisphenol skeleton-containing epoxy resin is, for example, a copolymer of bisphenol and epichlorohydrin.
  • bisphenol examples include bisphenol A and bisphenol F, preferably bisphenol F.
  • the weight average molecular weight (Mw) of the bisphenol skeleton-containing epoxy resin is, for example, 800 or more, preferably 900 or more and less than 10,000, preferably 8,000 or less.
  • the epoxy equivalent in the bisphenol skeleton-containing epoxy resin is, for example, 100 g / eq. As mentioned above, preferably 150 g / eq. As mentioned above, for example, 2,000 g / eq. Hereinafter, preferably 1500 g / eq. It is as follows.
  • the SP value of the bisphenol skeleton-containing epoxy resin is, for example, 11.5 (cal / cm 3 ) 1/2 or more and 13.0 (cal / cm 3 ) 1/2 or less.
  • the content ratio of the bisphenol skeleton-containing epoxy resin is, for example, 5 parts by mass or more, preferably 10 parts by mass or more, and for example, 40 parts by mass or less, preferably, with respect to 100 parts by mass of the total of the resin component and the oxetane compound. Is 30 parts by mass or less.
  • the resin component is other than the above-mentioned specific resin component (epoxidized polybutadiene resin, biphenyl skeleton-containing epoxy resin, tackifier resin, and bisphenol skeleton-containing epoxy resin) as long as the effect of the present invention is not impaired.
  • Examples of other resin components include an alicyclic skeleton-containing epoxy resin, a styrene-based oligomer, a polyolefin, a polychloroprene, a polyamide, a polyamide-imide, a polyurethane, a polyether, a polyester, and a silicone resin. These other resin components can be used alone or in combination of two or more. In the resin component, the content ratio of the other resin component is, for example, 10% by mass or less, preferably 5% by mass or less.
  • the resin component is particularly preferably free of other resin components, and is composed of an epoxidized polybutadiene resin, a biphenyl skeleton-containing epoxy resin, an adhesive-imparting resin, and, if necessary, a bisphenol skeleton-containing epoxy resin. Become.
  • the oxetane compound has an oxetanyl group as a cationically polymerizable group.
  • oxetane compound examples include the oxetane compounds described in paragraphs [0037] to [0053] of International Publication No. 2020/031941.
  • the oxetane compound represented by the following formula (2) is preferably mentioned.
  • Y represents an oxygen atom, a sulfur atom or a single bond.
  • R2 represents a hydrogen atom, a fluorine atom, an alkyl group having 1 to 6 carbon atoms, a fluoroalkyl group having 1 to 6 carbon atoms, an allyl group, an aryl group having 6 to 18 carbon atoms, a frill group or an ethynyl group.
  • R 3 has a hydrogen atom, an alkyl group having 1 to 10 carbon atoms, an alkenyl group having 2 to 6 carbon atoms, an aralkyl group having 7 to 18 carbon atoms, an alkylcarbonyl group having 2 to 6 carbon atoms, and 2 to 6 carbon atoms.
  • An alkoxycarbonyl group, an N-alkylcarbamoyl group having 2 to 6 carbon atoms, a (meth) acryloyl group, or an oxetanyl group-containing atomic group represented by the following formula (3) is shown.
  • m represents an integer of 1 or more and 5 or less.
  • examples of the (meth) acryloyl group include an acryloyl group and a methacryloyl group.
  • oxygen atom and sulfur atom are preferably mentioned, and oxygen atom is more preferable.
  • a hydrogen atom, a fluorine atom, an alkyl group having 1 to 6 carbon atoms, a fluoroalkyl group having 1 to 6 carbon atoms, an aryl group having 6 to 18 carbon atoms, and a frill are preferable.
  • Examples include groups and ethynyl groups, more preferably alkyl groups having 1 to 6 carbon atoms.
  • an oxetanyl group-containing atomic group represented by the following formula (3) is preferably mentioned.
  • R 2 represents the same functional group as R 2 in the above formula (2).
  • m represents an integer of 1 or more and 5 or less.
  • M in the above equations (2) and (3) preferably indicates 1.
  • oxetane compounds include 3-ethyl-3-hydroxymethyloxetane, 3- (meth) allyloxymethyl-3-ethyloxetane, (3-ethyl-3-oxetanylmethoxy) methylbenzene, and 4-fluoro-.
  • Such an oxetane compound can be used alone or in combination of two or more.
  • the molecular weight of the oxetane compound is, for example, 180 or more, preferably 190 or more, more preferably 200 or more, and for example, 400 or less.
  • the oxygen atom content of the oxetane compound is, for example, 15% by mass or more, and for example, 30% by mass or less, preferably 25% by mass or less, and more preferably 20% by mass or less.
  • the oxygen atom content can be calculated by the following formula (4).
  • Oxygen atom content (mass%) total mass / molecular weight of oxygen atoms in one molecule x 100 ... (4)
  • the dielectric constant of the seal member which will be described later, can be stably reduced.
  • the content ratio of the oxetane compound is, for example, 1 part by mass or more, preferably 3 parts by mass or more, more preferably more than 5 parts by mass, and more preferably more than 100 parts by mass with respect to the total of 100 parts by mass of the resin component and the oxetane compound. Is 8 parts by mass or more, and for example, 30 parts by mass or less, preferably less than 20 parts by mass, more preferably less than 15 parts by mass, still more preferably 12 parts by mass or less.
  • the initial curability of the seal member described later can be improved more reliably, and the dielectric constant of the seal member described later can be further reduced. can.
  • the curing agent polymerizes the resin component to cure the encapsulant.
  • the curing agent is not particularly limited as long as the encapsulant can be cured.
  • Examples of the curing agent include an amine-based curing agent, an imidazole-based curing agent, an acid anhydride-based curing agent, a thermal-cationic-based curing agent, and a photocation-based curing agent.
  • a thermal cation-based curing agent and a photocation-based curing agent are preferable.
  • Each of the thermal cation-based curing agent and the photocation-based curing agent initiates the polymerization of the above-mentioned epoxidized polybutadiene resin, the above-mentioned biphenyl skeleton-containing epoxy resin, and, if necessary, the above-mentioned bisphenol skeleton-containing epoxy resin.
  • the compound is not particularly limited as long as it can be used.
  • the thermal cation-based curing agent is a thermal acid generator that generates an acid (cation) by heating.
  • the thermal cationic curing agent is preferably a compound capable of initiating polymerization at 120 ° C. or lower, which is the heat resistant temperature of the display element.
  • thermal cationic polymerization initiator can be used as the thermal cationic curing agent.
  • thermal cationic polymerization initiator include sulfonium salts, phosphonium salts, quaternary ammonium salts, diazonium salts, and iodonium salts having the following as counter anions.
  • counter anion include AsF 6- , SbF 6- , PF 6- , BF 4- , B (C 6 F 5 ) 4- , and CF 3 SO 3- .
  • the photocationic curing agent is a photoacid generator that generates an acid (cation) by light irradiation.
  • a known photocationic polymerization initiator can be used as the photocationic curing agent.
  • Examples of the photocationic curing agent include CPI-210S (manufactured by San-Apro) and IK-1 (manufactured by San-Apro).
  • Such a curing agent can be used alone or in combination of two or more.
  • thermocationic curing agent is particularly preferable, and a quaternary ammonium salt is particularly preferable. That is, the curing agent particularly preferably contains at least a thermal cationic curing agent, and may further contain a photocationic curing agent or may not contain a photocationic curing agent.
  • the content ratio of the curing agent is, for example, 0.3 parts by mass or more, preferably 0.5 parts by mass or more, and for example, 10 parts by mass or less, based on 100 parts by mass of the total of the resin component and the oxetane compound. It is preferably 5 parts by mass or less.
  • the encapsulant may contain a silane coupling agent as another additive, if necessary.
  • silane coupling agent examples include an epoxy group-containing silane coupling agent, an amino group-containing silane coupling agent, and a methacryloyl group-containing silane coupling agent.
  • the silane coupling agent can be used alone or in combination of two or more.
  • silane coupling agents an epoxy group-containing silane coupling agent is preferable.
  • epoxy group-containing silane coupling agent examples include ⁇ -glycidoxypropyltrimethoxysilane, ⁇ -glycidoxypropyltriethoxysilane, and ⁇ - (3,4-epoxycyclohexyl) ethyltrimethoxysilane. , More preferably, ⁇ -glycidoxypropyltrimethoxysilane.
  • the content ratio of the silane coupling agent is, for example, 0.05 parts by mass or more, preferably 0.1 parts by mass or more, for example, 30 parts by mass or less, based on 100 parts by mass of the total of the resin component and the oxetane compound. It is preferably 5 parts by mass or less.
  • the encapsulant may be used as another additive such as a leveling agent, a filler, a polymerization initiation aid, an antiaging agent, a wettability improver, a surfactant, a plasticizer, and an ultraviolet absorber.
  • a leveling agent such as a filler, a polymerization initiation aid, an antiaging agent, a wettability improver, a surfactant, a plasticizer, and an ultraviolet absorber.
  • Preservatives, antibacterial agents, colorants (dye, pigment) and the like may be contained in an appropriate ratio.
  • the above-mentioned encapsulant contains an epoxidized polybutadiene resin, a biphenyl skeleton-containing epoxy resin, an adhesive-imparting resin, and an oxetane compound. Therefore, the initial curability can be improved, and a seal member having a relatively low dielectric constant can be formed while suppressing the positional deviation with respect to the display element.
  • the above-mentioned encapsulant can be distributed as it is and is an industrially usable product, but is preferably distributed as a display element encapsulation sheet from the viewpoint of handleability.
  • sealing sheet 1 as an embodiment of the display element sealing sheet of the present invention will be described.
  • the sealing sheet 1 includes a sealing layer 2 made of the above-mentioned sealing material, a base film 3, and a release film 4.
  • the sealing sheet 1 is a component for manufacturing an image display device.
  • the sealing sheet 1 does not include a display element and a substrate on which the display element is mounted, and specifically includes a sealing layer 2, a base film 3, and a release film 4.
  • the sealing sheet 1 is a device that is distributed as a single component and can be used industrially.
  • the sealing layer 2 is protected by the base film 3 and the release film 4 when the sealing sheet 1 is stored.
  • the base film 3 and the release film 4 are peeled off.
  • the sealing layer 2 is a dried product of the above-mentioned sealing material and has a film shape (flat plate shape). Specifically, the sealing layer 2 has a predetermined thickness, extends in a predetermined direction orthogonal to the thickness direction, and has a flat front surface and a flat back surface.
  • the thickness of the sealing layer 2 is, for example, 1 ⁇ m or more, preferably 5 ⁇ m or more, for example, 100 ⁇ m or less, preferably 30 ⁇ m or less.
  • the base film 3 is detachably attached to the back surface of the sealing layer 2 in order to support and protect the sealing layer 2 until the sealing sheet 1 is used for forming a sealing member described later. .. That is, the base film 3 is laminated on the back surface of the sealing layer 2 so as to cover the back surface of the sealing layer 2 at the time of shipping, transporting, and storing the sealing sheet 1.
  • the base film 3 is a flexible film that can be peeled off from the back surface of the sealing layer 2 so as to be curved in a substantially U shape immediately before the use of the sealing sheet 1.
  • the base film 3 has a flat plate shape, specifically, has a predetermined thickness, extends in a predetermined direction orthogonal to the thickness direction, and has a flat front surface and a flat back surface.
  • the sticking surface (surface) of the base film 3 is peeled off if necessary.
  • Examples of the material of the base film 3 include a resin material.
  • Examples of the resin material include polyester and polyolefin.
  • Examples of the polyester include polyethylene terephthalate (PET).
  • Examples of the polyolefin include polyethylene and polypropylene.
  • the resin components polyethylene terephthalate is preferable.
  • a film having a moisture barrier property or a gas barrier property is preferable, and a film made of polyethylene terephthalate is more preferable.
  • the thickness of the base film 3 is appropriately selected depending on the material of the film, but can be, for example, about 25 ⁇ m to 150 ⁇ m because it has the ability to follow a material to be sealed such as a display element.
  • the release film 4 is detachably attached to the surface of the sealing layer 2 in order to protect the sealing layer 2 until the sealing sheet 1 is used for forming the sealing member. That is, the release film 4 is laminated on the surface of the sealing layer 2 so as to cover the surface of the sealing layer 2 at the time of shipping, transporting, and storing the sealing sheet 1.
  • the release film 4 is a flexible film that can be peeled off from the surface of the sealing layer 2 so as to be curved in a substantially U shape immediately before the use of the sealing sheet 1.
  • the release film 4 has a flat plate shape, specifically, has a predetermined thickness, extends in a predetermined direction orthogonal to the thickness direction, and has a flat front surface and a flat back surface. Further, the sticking surface (back surface) of the release film 4 is peeled off if necessary.
  • the material of the release film 4 include the same resin material as the base film 3.
  • the thickness of the release film 4 is appropriately selected depending on the material of the film, but can be, for example, about 25 ⁇ m to 150 ⁇ m because it has the ability to follow a material to be sealed such as a display element.
  • the above-mentioned sealing material is prepared, and the sealing material is applied to the surface of the base film 3 by a known method.
  • the encapsulant is prepared by mixing the above-mentioned resin component, oxetane compound, curing agent and additive in the above-mentioned ratio. Further, in the production of the sealing sheet 1, the sealing material is preferably diluted with an organic solvent to prepare a varnish for the sealing material.
  • the organic solvent is not particularly limited as long as the resin component and the curing agent can be uniformly dispersed or dissolved.
  • examples of the organic solvent include aromatic hydrocarbons, ketones, ethers, esters, and nitrogen-containing compounds.
  • the organic solvent can be used alone or in combination of two or more.
  • ketones are preferable.
  • the ketones include acetone, methyl ethyl ketone, and methyl isobutyl ketone, and preferred examples include methyl ethyl ketone.
  • the organic solvent contains ketones, the resin component can be uniformly dissolved.
  • the solid content concentration of the encapsulant in the varnish is, for example, 30% by mass or more, preferably 40% by mass or more, for example, 70% by mass or less, preferably 60% by mass or less.
  • Each component can be mixed, for example, by dispersing with a ball mill, charging into a flask and stirring, or kneading with three rolls.
  • examples of the method for applying the encapsulant include screen printing, a dispenser, and an application roll.
  • the encapsulant is dried and, if necessary, the organic solvent is volatilized to form a coating film.
  • the heating temperature is the temperature at which the encapsulant dries without hardening.
  • the heating temperature is, for example, 20 ° C. or higher, preferably 90 ° C. or higher, and for example, 120 ° C. or lower, preferably less than 100 ° C.
  • the heating time is, for example, 1 minute or more, preferably 2 minutes or more, for example, 30 minutes or less, preferably 15 minutes or less.
  • the coating film dries, and the sealing layer 2 formed from the sealing material is prepared.
  • the release film 4 is attached to the surface of the sealing layer 2.
  • the sealing sheet 1 is manufactured.
  • Such a sealing sheet 1 is suitably used for sealing a display element of an image display device.
  • the display element include an organic EL element.
  • An organic EL display with a touch sensor hereinafter referred to as an organic EL display 10) as an embodiment of an image display device will be described with reference to FIG. 2.
  • the encapsulant is an organic EL element encapsulant
  • the encapsulation sheet 1 is an organic EL element encapsulation sheet.
  • the organic EL element encapsulating material is made of the above-mentioned encapsulant
  • the organic EL element encapsulating sheet is made of the encapsulating sheet 1.
  • the organic EL display with a touch sensor is mentioned as the image display device, but the image display device is not particularly limited.
  • the image display device include a liquid crystal display (including a liquid crystal display with a touch sensor) and an organic EL display (including an organic EL display with a touch sensor).
  • the organic EL display 10 includes an element mounting unit 11, a sealing member 14, and a cover glass or a barrier film 15.
  • the element mounting unit 11 includes a substrate 13, an organic EL element 12 as an example of a display element, a barrier layer 16, and an electrode (not shown).
  • the substrate 13 supports the organic EL element 12.
  • the substrate 13 preferably has flexibility.
  • the organic EL element 12 is a known organic EL element and is mounted on the substrate 13. Although not shown, the organic EL element 12 includes a cathode reflecting electrode, an organic EL layer, and an anode transparent electrode.
  • the barrier layer 16 covers the organic EL element 12 and suppresses the contact of moisture in the atmosphere with the organic EL element 12.
  • the barrier layer 16 includes a first inorganic barrier layer 17, a flattening layer 19, and a second inorganic barrier layer 18.
  • the first inorganic barrier layer 17 is arranged on the upper surface and the side surface of the organic EL element 12 so as to surround the organic EL element 12.
  • Examples of the material of the first inorganic barrier layer 17 include metal oxides and metal nitrides.
  • Examples of the metal oxide include aluminum oxide, silicon oxide, and copper oxide.
  • Examples of the metal nitride include aluminum nitride and silicon nitride.
  • the material of the first inorganic barrier layer 17 can be used alone or in combination of two or more.
  • metal nitride is preferable, and silicon nitride is more preferable.
  • the flattening layer 19 is arranged on the upper surface of the first inorganic barrier layer 17.
  • Examples of the material of the flattening layer 19 include known resin materials.
  • the second inorganic barrier layer 18 is arranged on the upper surface and the side surface of the flattening layer 19 so as to surround the flattening layer 19.
  • the material of the second inorganic barrier layer 18 for example, the same material as the first inorganic barrier layer 17 can be mentioned.
  • Electrodes not shown constitute a sensor for an organic EL display with a touch sensor.
  • An electrode (not shown) is located between the substrate 13 and the sealing member 14.
  • the electrode (not shown) may be located in the substrate 13 or may be located on the organic EL element 12.
  • the sealing member 14 is a cured product of the sealing layer 2 (sealing material) and seals the organic EL element 12 coated on the barrier layer 16.
  • the sealing member 14 is formed from a sealing layer 2 from which the base film 3 and the release film 4 have been peeled off.
  • the sealing layer 2 from which the base film 3 and the release film 4 have been peeled off is attached to the substrate 13 so as to embed the organic EL element 12 coated on the barrier layer 16, and then the sealing layer.
  • a cover glass or a barrier film 15 is attached to the upper surface of 2.
  • the sealing layer 2 is heated and cured.
  • the heating temperature of the sealing layer 2 is, for example, 90 ° C. or higher, preferably 100 ° C. or higher, and for example, 130 ° C. or lower, preferably 120 ° C. or lower.
  • the sealing layer 2 is rapidly cured, and the sealing member 14 is formed at a desired position without being displaced with respect to the organic EL element 12 and the substrate 13.
  • the sealing member 14 can be formed at a desired position only by thermosetting without temporarily fixing the sealing layer 2 by, for example, UV irradiation. As a result, it is possible to improve the manufacturing efficiency of the image display device.
  • the dielectric constant of the seal member 14 is, for example, 3.00 or more, preferably 3.10 or more, for example, 3.50 or less, preferably 3.40 or less, and more preferably 3.20 or less.
  • the dielectric constant can be measured according to the method described in Examples described later.
  • the dielectric constant of the sealing member 14 is at least the above lower limit, the degree of freedom in material selection can be improved.
  • the dielectric constant of the seal member 14 is not more than the above upper limit, it is possible to suppress the occurrence of malfunction in an organic EL display with a touch sensor or the like.
  • the haze value of the seal member 14 is, for example, 0.1% or more, for example, 15.0% or less, preferably 10.0% or less, more preferably 5.0% or less, still more preferably 1.0. % Or less, particularly preferably 0.5% or less.
  • the haze value can be measured according to the method described in Examples described later.
  • the haze value of the seal member 14 is not more than the above upper limit, the visibility of the display (including the display with the touch sensor) can be improved.
  • the cover glass or the barrier film 15 is arranged on the upper surface of the sealing member 14.
  • the cover glass or the barrier film 15 includes a glass plate and electrodes provided on the lower surface of the glass plate and constituting the sensor of the organic EL display with a touch sensor.
  • the organic EL element 12 has an in-cell structure arranged between two electrodes constituting the sensor, or one of the two electrodes constituting the sensor is arranged on the organic EL element 12. It has an on-cell structure.
  • the sealing sheet 1 includes a sealing layer 2, a base film 3, and a release film 4, but the display element sealing sheet is not limited thereto.
  • the display element encapsulation sheet may not include the base film 3 and / or the release film 4 as long as it includes the encapsulation layer 2. That is, the display element encapsulation sheet may be composed of only the encapsulation layer 2, or may include the encapsulation layer 2 and either the base film 3 or the release film 4.
  • the organic EL display 10 includes, but is not limited to, the barrier layer 16.
  • the organic EL display 10 does not have to include the barrier layer 16.
  • the organic EL display 10 has an in-cell structure in which the organic EL element 12 is arranged between two electrodes constituting the sensor, or one of the two electrodes is arranged on the organic EL element 12. It has an on-cell structure, but is not limited to this.
  • the organic EL display 20 may have an out-cell structure in which two electrodes constituting the sensor are arranged above the seal member 14.
  • the organic EL display 20 includes the above-mentioned element mounting unit 11, the above-mentioned sealing member 14, and the sensor unit 25.
  • the sensor unit 25 is arranged on the seal member 14.
  • the sensor unit 25 includes electrodes constituting the sensor of the organic EL display with a touch sensor. In the organic EL display 20, the substrate 13 does not have an electrode.
  • Example 1 Epoxidized polybutadiene resin (trade name: Epolide PB3600, manufactured by Daicel, number average molecular weight: 5,900, SP value 9.3, epoxy equivalent: 200 g / eq.) And a methyl ethyl ketone solution of a biphenyl skeleton-containing epoxy resin (trade name). : JER-YX6954B35, solid content concentration 35% by mass, epoxy equivalent: 3,000 to 16,000 g / eq., Manufactured by Mitsubishi Chemical Co., Ltd.) and alicyclic hydrocarbon resin (adhesion-imparting resin, SP value 9.
  • Example 2 A varnish as a sealing material was prepared in the same manner as in Example 1.
  • the terpene phenol resin (trade name: YS Polystar K125) was not added, and the amount of the alicyclic hydrocarbon resin (trade name: Quintone1500) added was changed to the value shown in Table 1.
  • Examples 3-5 A varnish as a sealing material was prepared in the same manner as in Example 2.
  • the addition amount of the methyl ethyl ketone solution (trade name: jER-YX6954B35) of the biphenyl skeleton-containing epoxy resin was changed to the value shown in Table 1, and the addition amount of the oxetane compound (trade name: OXT-221) was changed.
  • the addition amount of the oxetane compound (trade name: OXT-221) was changed.
  • OXT-221 oxetane compound
  • Example 6 A varnish as a sealing material was prepared in the same manner as in Example 2.
  • the alicyclic hydrocarbon resin (trade name: Quintone 1500) was changed to a terpene phenol resin (trade name: YS Polystar G125).
  • Example 7 A varnish as a sealing material was prepared in the same manner as in Example 1.
  • the terpene phenol resin (trade name: YS Polystar K125) was changed to a terpene phenol resin (trade name: YS Polystar G125, SP value 9.1, manufactured by Yasuhara Chemical Co., Ltd.).
  • Example 8 A varnish as a sealing material was prepared in the same manner as in Example 1.
  • the terpene phenol resin (trade name: YS Polystar K125) was changed to a terpene phenol resin (adhesive-imparting resin, trade name: YS Polystar T130, SP value 8.8, manufactured by Yasuhara Chemical Co., Ltd.).
  • Comparative Example 1 A varnish as a sealing material was prepared in the same manner as in Example 2.
  • a methyl ethyl ketone solution (trade name: jER-YX6954B35) of a biphenyl skeleton-containing epoxy resin contains a bisphenol skeleton-containing epoxy resin (trade name: jER-4275, manufactured by Mitsubishi Chemical Corporation, bisphenol A skeleton and bisphenol F skeleton).
  • Epoxy equivalent 8,400-9,200 g / eq.
  • Comparative Example 2 A varnish as a sealing material was prepared in the same manner as in Example 2.
  • the alicyclic hydrocarbon resin (trade name: Quintone1500) was not added, and the amount of the bisphenol skeleton-containing epoxy resin (trade name: jER-4005P) added was changed to the value shown in Table 1.
  • Comparative Example 3 A varnish as a sealing material was prepared in the same manner as in Example 2.
  • the oxetane compound (trade name: OXT-221) was not added, and the amount of the bisphenol skeleton-containing epoxy resin (trade name: jER-4005P) added was changed to the value shown in Table 1.
  • Comparative Example 4 A varnish as a sealing material was prepared in the same manner as in Example 2.
  • the amount of the bisphenol skeleton-containing epoxy resin (trade name: jER-4005P) added was changed to the value shown in Table 1 without adding the epoxidized polybutadiene resin (trade name: Epolide PB3600), and the oxetane compound was added.
  • the amount of (trade name: OXT-221) added was changed to the value shown in Table 1.
  • Comparative Example 5 A varnish as a sealing material was prepared in the same manner as in Comparative Example 4.
  • the oxetane compound (trade name: OXT-221) was used as an alicyclic skeleton-containing epoxy resin (cycloalkene oxide type epoxy resin, trade name: seroxide 2021P, 3,4-epoxycyclohexylmethyl (3,4-epoxy).
  • Comparative Example 6 A varnish as a sealing material was prepared in the same manner as in Comparative Example 4.
  • the oxetane compound (trade name: OXT-221) was used as an alicyclic skeleton-containing epoxy resin (trade name: jER-YX8000, hydrogenated bisphenol A skeleton-containing epoxy resin, manufactured by Mitsubishi Chemical Corporation, epoxy equivalent: 205 g / eq.) was changed.
  • Comparative Example 7 A varnish as a sealing material was prepared in the same manner as in Comparative Example 5.
  • the alicyclic hydrocarbon resin (trade name: Quintone1500) was not added, and the amount of the bisphenol skeleton-containing epoxy resin (trade name: jER-4005P) added was changed to the value shown in Table 1.
  • a PET film (release-treated PET film (trade name: Purex A31, manufactured by Teijin DuPont Film Co., Ltd., thickness: 38 ⁇ m, release film)) was bonded to the sealing layer at 80 ° C. by a thermal laminator. ..
  • a sealing sheet including a base film, a sealing layer, and a release film was prepared.
  • two sealing sheets were prepared for each example and comparative example.
  • the two sealing layers are bonded to each other in the thickness direction, and the thickness thereof is 30 ⁇ m. And said.
  • the heat generation start temperature and the heat generation amount of the uncured sealed layer were specified by DSC at a temperature rise rate of 5 ° C./min and a measurement temperature range of 20 ° C. to 300 ° C.
  • the calorific value of the sealed layer in the cured state was specified by DSC at a heating rate of 5 ° C./min and a measurement temperature range of 20 ° C. to 300 ° C. Then, from the measured calorific value, the epoxy reaction rate (%) at a curing temperature of 110 ° C. was determined from the formula shown below.
  • Epoxy reaction rate (%) (calorific value of uncured sealing layer-calorific value of cured sealing layer) / calorific value of uncured sealing layer) x 100
  • PB3600 Epoxy-polybutadiene resin, trade name Epolide PB3600, manufactured by Daicel, Inc.
  • jER-YX6954B35 Methyl ethyl ketone solution of epoxy resin containing biphenyl skeleton, manufactured by Mitsubishi Chemical Corporation
  • Quintone 1500 Adhesive-imparting resin, alicyclic hydrocarbon resin, SP value 9.0, manufactured by Nippon Zeon Corporation
  • K125 Adhesive-imparting resin, terpene phenol resin, SP value 9.3, trade name YS Polystar K125, manufactured by Yasuhara Chemical Co., Ltd.
  • G125 Adhesive-imparting resin, terpene phenol resin, SP value 9.1, trade name YS Polystar G125, manufactured by Yasuhara Chemical Co., Ltd.
  • T130 Adhesive-imparting resin, terpene phenol resin, SP value 8.8, trade name YS Poly
  • the display element encapsulant, the organic EL element encapsulant, and the display element encapsulation sheet of the present invention are suitably used, for example, in encapsulation of a display element (organic EL element).

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PCT/JP2021/037751 2020-10-13 2021-10-12 表示素子封止材、有機ｅｌ素子封止材および表示素子封止シート WO2022080372A1 (ja)

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JP2014225380A (ja) * 2013-05-16 2014-12-04 積水化学工業株式会社 有機エレクトロルミネッセンス表示素子用封止剤及び有機エレクトロルミネッセンス表示素子の製造方法
JP2015185272A (ja) * 2014-03-20 2015-10-22 積水化学工業株式会社 有機光デバイスの製造方法及び硬化性樹脂組成物
JP2017031383A (ja) * 2015-08-06 2017-02-09 Jsr株式会社 有機電子デバイス用素子の封止用樹脂組成物

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WO2006104078A1 (ja) 2005-03-29 2006-10-05 Three Bond Co., Ltd. 有機ｅｌ素子封止用フィルム及び有機ｅｌ素子の封止構造体
JP6549984B2 (ja) 2014-02-27 2019-07-24 積水化学工業株式会社 有機エレクトロルミネッセンス表示素子封止用硬化性樹脂組成物、有機エレクトロルミネッセンス表示素子封止用硬化性樹脂シート、及び、有機エレクトロルミネッセンス表示素子

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Publication number Priority date Publication date Assignee Title
JP2014225380A (ja) * 2013-05-16 2014-12-04 積水化学工業株式会社 有機エレクトロルミネッセンス表示素子用封止剤及び有機エレクトロルミネッセンス表示素子の製造方法
JP2015185272A (ja) * 2014-03-20 2015-10-22 積水化学工業株式会社 有機光デバイスの製造方法及び硬化性樹脂組成物
JP2017031383A (ja) * 2015-08-06 2017-02-09 Jsr株式会社 有機電子デバイス用素子の封止用樹脂組成物

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