TW202221097A - 顯示元件密封材、有機ｅｌ元件密封材及顯示元件密封片 - Google Patents

顯示元件密封材、有機ｅｌ元件密封材及顯示元件密封片 Download PDF

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Publication number
TW202221097A
TW202221097A TW110137926A TW110137926A TW202221097A TW 202221097 A TW202221097 A TW 202221097A TW 110137926 A TW110137926 A TW 110137926A TW 110137926 A TW110137926 A TW 110137926A TW 202221097 A TW202221097 A TW 202221097A
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TW
Taiwan
Prior art keywords
resin
mass
sealing material
display element
sealing
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TW110137926A
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English (en)
Chinese (zh)
Inventor
高木正利
宮尾宙
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日商三井化學股份有限公司
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Application filed by 日商三井化學股份有限公司 filed Critical 日商三井化學股份有限公司
Publication of TW202221097A publication Critical patent/TW202221097A/zh

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
    • C08G65/02—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring
    • C08G65/04—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring from cyclic ethers only
    • C08G65/06—Cyclic ethers having no atoms other than carbon and hydrogen outside the ring
    • C08G65/16—Cyclic ethers having four or more ring atoms
    • C08G65/18—Oxetanes
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/02—Details
    • H05B33/04—Sealing arrangements, e.g. against humidity
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations
    • H10K59/8731—Encapsulations multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Electroluminescent Light Sources (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
TW110137926A 2020-10-13 2021-10-13 顯示元件密封材、有機ｅｌ元件密封材及顯示元件密封片 TW202221097A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020172351 2020-10-13
JP2020-172351 2020-10-13

Publications (1)

Publication Number Publication Date
TW202221097A true TW202221097A (zh) 2022-06-01

Family

ID=81208207

Family Applications (1)

Application Number Title Priority Date Filing Date
TW110137926A TW202221097A (zh) 2020-10-13 2021-10-13 顯示元件密封材、有機ｅｌ元件密封材及顯示元件密封片

Country Status (5)

Country Link
JP (1) JP7357807B2 (ko)
KR (1) KR20230027195A (ko)
CN (1) CN116114383A (ko)
TW (1) TW202221097A (ko)
WO (1) WO2022080372A1 (ko)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4941295B2 (ja) 2005-03-29 2012-05-30 株式会社スリーボンド 有機ｅｌ素子封止用フィルム及び有機ｅｌ素子の封止構造体
JP6200203B2 (ja) 2013-05-16 2017-09-20 積水化学工業株式会社 有機エレクトロルミネッセンス表示素子用封止剤及び有機エレクトロルミネッセンス表示素子の製造方法
WO2015129670A1 (ja) 2014-02-27 2015-09-03 積水化学工業株式会社 有機エレクトロルミネッセンス表示素子封止用硬化性樹脂組成物、有機エレクトロルミネッセンス表示素子封止用硬化性樹脂シート、及び、有機エレクトロルミネッセンス表示素子
JP6247125B2 (ja) 2014-03-20 2017-12-13 積水化学工業株式会社 有機光デバイスの製造方法
JP2017031383A (ja) * 2015-08-06 2017-02-09 Jsr株式会社 有機電子デバイス用素子の封止用樹脂組成物

Also Published As

Publication number Publication date
JPWO2022080372A1 (ko) 2022-04-21
CN116114383A (zh) 2023-05-12
JP7357807B2 (ja) 2023-10-06
KR20230027195A (ko) 2023-02-27
WO2022080372A1 (ja) 2022-04-21

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