JP7354321B2 - ハイパーブランチポリマー、金属回収剤、金属回収方法及び触媒活性妨害剤 - Google Patents
ハイパーブランチポリマー、金属回収剤、金属回収方法及び触媒活性妨害剤 Download PDFInfo
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- JP7354321B2 JP7354321B2 JP2022024858A JP2022024858A JP7354321B2 JP 7354321 B2 JP7354321 B2 JP 7354321B2 JP 2022024858 A JP2022024858 A JP 2022024858A JP 2022024858 A JP2022024858 A JP 2022024858A JP 7354321 B2 JP7354321 B2 JP 7354321B2
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Description
式(1)において、A1は芳香環を含む基であり、A2はアミド基を含む基であり、A3は硫黄を含む基であり、R0は、水素又は炭素数1~10個の置換若しくは無置換の炭化水素基であり、m1は0.5~11であり、n1は5~100である。
式(3)において、R1は炭素数が1~5である置換若しくは無置換のアルキレン基、又は単結合であり、R2及びR3は、それぞれ、炭素数が1~10である置換若しくは無置換のアルキル基又は水素である。また、式(3)において、R1は単結合であることが好ましく、R2は水素であることが好ましく、R3はイソプロピル基であることが好ましい。
<ポリマーA1の合成>
式(6)で表される、市販のハイパーブランチポリマー(ポリマーD)にアミド基を有する基を導入して、式(5)で表されるポリマーA1を合成した。式(5)で表されるポリマーA1は、式(1)で表されるポリマーであり、式(1)において、A1が式(2)で表される基であり;A2が式(3)で表される基であって、R1が単結合であり、R2が水素であり、R3がイソプロピル基であり;A3が式(4)で表されるジチオカルバメート基であり、R4及びR5がエチル基であり、R0がビニル基又はエチル基である。
(N/S)=(IP1-IP2)/(IP2/2)
IP1:Peak1のピーク面積
IP2:Peak2のピーク面積
図3に、ポリマーA1の構造の模式図を併せて示す。Peak1は、ポリマーA1の末端基における、硫黄を含む基(A3)中の2個の水素(b)及びアミド基を含む基(A2)中の1個の水素(c)に由来するピークであり、Peak2は、硫黄を含む基(A3)中の2個の水素(a)に由来するピークである。
<ポリマーA2の合成>
NIPAMを2.20g、反応時間を24時間とした以外は、実施例1と同様の方法により、ポリマーA2を合成した。実施例1と同様の方法により、生成物(ポリマーA2)の1H‐NMR測定、IR測定及び分子量測定を行った。この結果、ポリマーA2は、ポリマーA1と同様に式(5)で表されるハイパーブランチポリマーであることが確認できた。また、モル比(N/S)は、1.22であり、数平均分子量(Mn)=10,700、重量平均分子量(Mw)=25,200であった。
<ポリマーA3の合成>
反応時間を8時間とした以外は、実施例1と同様の方法により、ポリマーA3を合成した。実施例1と同様の方法により、生成物(ポリマーA3)の1H‐NMR測定、IR測定及び分子量測定を行った。この結果、ポリマーA3は、ポリマーA1と同様に式(5)で表されるハイパーブランチポリマーであることが確認できた。また、モル比(N/S)は、0.78であり、数平均分子量(Mn)=9,400、重量平均分子量(Mw)=24,000であった。
実施例1で合成したポリマーA1~A3について、以下に記載する評価を行った。
表1に示す4種類の溶媒に、濃度が2重量%となるようにポリマーA1~A3を加え、溶解するか試験した。試験は室温で行った。結果を表1に示す。
ハイパーブランチポリマー層を形成した基材に、無電解メッキ触媒(Pd)の付与及び無電解メッキ処理を行い、ハイパーブランチポリマーの金属捕捉能力を評価した。金属捕捉能力が高い場合、ハイパーブランチポリマーは多くの無電解メッキ触媒を強固に吸着(トラップ)するため、無電解メッキ反応が生じ難い。一方、金属捕捉能力が低い場合、ハイパーブランチポリマーが吸着する無電解メッキ触媒の数は少なく、また、吸着も強固ではないため、無電解メッキ反応が生じ易い。このように、ハイパーブランチポリマー層上のメッキ反応性は、ハイパーブランチポリマーの金属捕捉能力によって決定される。本評価では、ハイパーブランチポリマーを触媒活性妨害剤として用い、触媒活性妨害剤の効果の高いポリマーを金属捕捉能力が高いと評価した。本評価は、比較の為に、ポリマーA1~A3に加えて、ポリマーDについても同様の評価を行った。
ポリマーA1をトルエンに溶解して、ポリマー濃度0.5重量%のポリマー溶液を調製した。樹脂基材(ポリアミド、東洋紡製、バイロアミド)に、ポリマーA1の溶液をディップコートして、乾燥し、ポリマーA1のポリマー層を形成した。同様の方法により、ポリマーA2、A3及びDを用いて、樹脂基材上にポリマーA2、A3及びDのポリマー層を形成した。
○:無電解メッキ膜が生成しなかった。したがって、金属捕捉能力は高い。
×:無電解メッキ膜が生成した。したがって、金属捕捉能力は低い。
ハイパーブランチポリマー層を形成した基材を金属が溶解している液体に浸漬して金属の回収を行い、ハイパーブランチポリマーの金属捕捉能力を評価した。即ち、本評価では、ハイパーブランチポリマーを金属回収剤として用いた。
まず、金属が溶解している液体として、以下の3種類の溶液を用意した。それぞれの溶液中の金属濃度は、150ppmである。
Pd溶液:市販のPd水溶液(奥野製薬工業製、アクチベータ)
Pt溶液:テトラクロロ白金(II)酸カリウム水溶液
Ag溶液:硝酸銀水溶液
Claims (8)
- 式(4)において、R4及びR5がエチル基であることを特徴とする請求項2に記載のハイパーブランチポリマー。
- 式(1)において、
ジチオカルバメート基であるA3のモル数に対する、A2に含まれるアミド基の総モル数の比率が、0.5~1.5であることを特徴とする請求項1~3のいずれか一項に記載のハイパーブランチポリマー。 - 式(1)において、R0が、ビニル基であることを特徴とする請求項1~4のいずれか一項に記載のハイパーブランチポリマー。
- 前記ハイパーブランチポリマーが、上記式(1)において、R0がビニル基のハイパーブランチポリマーと、R0がエチル基のハイパーブランチポリマーとの混合物であることを特徴とする請求項1~4のいずれか一項に記載のハイパーブランチポリマー。
- 金属が溶解している液体中の前記金属を回収する金属回収剤であって、請求項1~6のいずれか一項に記載のハイパーブランチポリマーを含むことを特徴とする金属回収剤。
- 無電解メッキ触媒の触媒活性を妨げる触媒活性妨害剤であって、請求項1~6のいずれか一項に記載のハイパーブランチポリマーを含むことを特徴とする触媒活性妨害剤。
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