JP7353209B2 - ダミーウエハ - Google Patents
ダミーウエハ Download PDFInfo
- Publication number
- JP7353209B2 JP7353209B2 JP2020027481A JP2020027481A JP7353209B2 JP 7353209 B2 JP7353209 B2 JP 7353209B2 JP 2020027481 A JP2020027481 A JP 2020027481A JP 2020027481 A JP2020027481 A JP 2020027481A JP 7353209 B2 JP7353209 B2 JP 7353209B2
- Authority
- JP
- Japan
- Prior art keywords
- dummy wafer
- plates
- temperature distribution
- aluminum alloy
- silicon wafer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 229910000838 Al alloy Inorganic materials 0.000 claims description 31
- 229910052782 aluminium Inorganic materials 0.000 claims description 10
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 10
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims description 6
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 5
- 235000012431 wafers Nutrition 0.000 description 85
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 49
- 229910052710 silicon Inorganic materials 0.000 description 49
- 239000010703 silicon Substances 0.000 description 49
- 238000009826 distribution Methods 0.000 description 37
- 238000010438 heat treatment Methods 0.000 description 37
- 238000000034 method Methods 0.000 description 13
- 239000000463 material Substances 0.000 description 12
- 239000000853 adhesive Substances 0.000 description 11
- 230000001070 adhesive effect Effects 0.000 description 11
- 239000000758 substrate Substances 0.000 description 9
- 229920001721 polyimide Polymers 0.000 description 8
- 230000020169 heat generation Effects 0.000 description 7
- 238000005488 sandblasting Methods 0.000 description 7
- 238000001931 thermography Methods 0.000 description 7
- 238000010586 diagram Methods 0.000 description 6
- 238000012360 testing method Methods 0.000 description 5
- 238000005422 blasting Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 239000010935 stainless steel Substances 0.000 description 4
- 229910001220 stainless steel Inorganic materials 0.000 description 4
- 239000011888 foil Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 229910052749 magnesium Inorganic materials 0.000 description 2
- 239000011777 magnesium Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- -1 specific heat Chemical compound 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 1
- 238000007792 addition Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000012217 deletion Methods 0.000 description 1
- 230000037430 deletion Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000000523 sample Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000005496 tempering Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
- H01L22/34—Circuits for electrically characterising or monitoring manufacturing processes, e. g. whole test die, wafers filled with test structures, on-board-devices incorporated on each die, process control monitors or pad structures thereof, devices in scribe line
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67248—Temperature monitoring
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/0003—Radiation pyrometry, e.g. infrared or optical thermometry for sensing the radiant heat transfer of samples, e.g. emittance meter
- G01J5/0007—Radiation pyrometry, e.g. infrared or optical thermometry for sensing the radiant heat transfer of samples, e.g. emittance meter of wafers or semiconductor substrates, e.g. using Rapid Thermal Processing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
- B32B15/016—Layered products comprising a layer of metal all layers being exclusively metallic all layers being formed of aluminium or aluminium alloys
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/0096—Radiation pyrometry, e.g. infrared or optical thermometry for measuring wires, electrical contacts or electronic systems
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/20—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2255/00—Coating on the layer surface
- B32B2255/06—Coating on the layer surface on metal layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2255/00—Coating on the layer surface
- B32B2255/20—Inorganic coating
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J2005/0077—Imaging
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
- H05B2203/002—Heaters using a particular layout for the resistive material or resistive elements
- H05B2203/005—Heaters using a particular layout for the resistive material or resistive elements using multiple resistive elements or resistive zones isolated from each other
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Automation & Control Theory (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Radiation Pyrometers (AREA)
- Investigating Or Analyzing Materials Using Thermal Means (AREA)
- Surface Heating Bodies (AREA)
- Resistance Heating (AREA)
Description
110A、110B プレート
120 面状ヒータ
121 フィルム
122 発熱体
Claims (6)
- 面状ヒータと、
前記面状ヒータを挟持するアルミニウム合金製、アルミニウム製、又は炭化珪素製の一対の板状部材と
を含む、ダミーウエハ。 - 前記アルミニウム合金は、5052系又は6061系のアルミニウム合金である、請求項1に記載のダミーウエハ。
- 前記一対の板状部材は、アルミニウム合金製、又は、アルミニウム製であり、表面にアルマイト処理による酸化被膜を有する、請求項1又は2に記載のダミーウエハ。
- 前記酸化被膜は、黒色である、請求項3に記載のダミーウエハ。
- 前記酸化被膜は、つや消し黒色である、請求項3に記載のダミーウエハ。
- 前記一対の板状部材の少なくとも前記面状ヒータに当接する面は、ブラスト処理が施されている面である、請求項1又は2に記載のダミーウエハ。
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2020027481A JP7353209B2 (ja) | 2020-02-20 | 2020-02-20 | ダミーウエハ |
TW110104626A TW202135193A (zh) | 2020-02-20 | 2021-02-08 | 仿真晶圓 |
CN202110174227.8A CN113280923B (zh) | 2020-02-20 | 2021-02-09 | 仿真晶片 |
KR1020210018941A KR102651748B1 (ko) | 2020-02-20 | 2021-02-10 | 더미 웨이퍼 |
EP21157403.3A EP3869543B1 (en) | 2020-02-20 | 2021-02-16 | Dummy wafer |
US17/177,687 US11776829B2 (en) | 2020-02-20 | 2021-02-17 | Dummy wafer |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2020027481A JP7353209B2 (ja) | 2020-02-20 | 2020-02-20 | ダミーウエハ |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2021132162A JP2021132162A (ja) | 2021-09-09 |
JP7353209B2 true JP7353209B2 (ja) | 2023-09-29 |
Family
ID=74666461
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2020027481A Active JP7353209B2 (ja) | 2020-02-20 | 2020-02-20 | ダミーウエハ |
Country Status (6)
Country | Link |
---|---|
US (1) | US11776829B2 (ja) |
EP (1) | EP3869543B1 (ja) |
JP (1) | JP7353209B2 (ja) |
KR (1) | KR102651748B1 (ja) |
CN (1) | CN113280923B (ja) |
TW (1) | TW202135193A (ja) |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002289330A (ja) | 2001-03-23 | 2002-10-04 | Nippon Dennetsu Co Ltd | 加熱体 |
JP2003100422A (ja) | 2001-09-25 | 2003-04-04 | Toshiba Ceramics Co Ltd | 箔状の抵抗発熱素子及び面状セラミックスヒーター |
JP2004193114A (ja) | 2002-11-25 | 2004-07-08 | Ibiden Co Ltd | 金属ヒータ |
JP2005123000A (ja) | 2003-10-16 | 2005-05-12 | Sumitomo Electric Ind Ltd | ヒータ |
US20180313697A1 (en) | 2015-10-19 | 2018-11-01 | Novena Tec Inc. | Process monitoring device |
JP2018182280A (ja) | 2017-04-19 | 2018-11-15 | 日本特殊陶業株式会社 | セラミックス部材 |
JP2019071349A (ja) | 2017-10-10 | 2019-05-09 | 住友電気工業株式会社 | ウエハ加熱用ヒータユニット |
US20200126824A1 (en) | 2018-10-17 | 2020-04-23 | Kuo Yang Ma | Super thin heating disk |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH08316283A (ja) * | 1995-05-19 | 1996-11-29 | Kobe Steel Ltd | ダミーウエハー |
JPH1012692A (ja) * | 1996-06-25 | 1998-01-16 | Nisshinbo Ind Inc | ダミーウエハ |
US5770324A (en) * | 1997-03-03 | 1998-06-23 | Saint-Gobain Industrial Ceramics, Inc. | Method of using a hot pressed silicon carbide dummy wafer |
JP3907401B2 (ja) * | 2000-12-05 | 2007-04-18 | 株式会社巴川製紙所 | ダミーウェハー |
JP2003231203A (ja) * | 2001-08-21 | 2003-08-19 | Toshiba Corp | 炭素膜被覆部材 |
US7060622B2 (en) * | 2002-09-27 | 2006-06-13 | Oki Electric Industry Co., Ltd. | Method of forming dummy wafer |
JP2004146568A (ja) * | 2002-10-24 | 2004-05-20 | Sumitomo Electric Ind Ltd | 半導体製造装置用セラミックスヒーター |
US20060199135A1 (en) * | 2002-11-25 | 2006-09-07 | Ibiden Co., Ltd. | Metal heater |
JP2010519768A (ja) | 2007-02-23 | 2010-06-03 | ケーエルエー−テンカー・コーポレーション | プロセス条件測定デバイス |
JP5459907B2 (ja) * | 2010-01-27 | 2014-04-02 | 東京エレクトロン株式会社 | 基板載置装置の評価装置、及びその評価方法、並びにそれに用いる評価用基板 |
KR101178234B1 (ko) * | 2010-07-14 | 2012-08-30 | 서울시립대학교 산학협력단 | 이트륨나이트레이트 및 그 화합물 중 적어도 어느 하나를 포함하는 탄화규소 세라믹스 제조용 조성물, 탄화규소 세라믹스 및 그 제조방법 |
KR101620510B1 (ko) * | 2014-08-22 | 2016-05-13 | 서울시립대학교 산학협력단 | 고인성 고경도 상압소결 탄화규소 소재 제조용 조성물, 탄화규소 소재 및 소재의 제조방법 |
US10730082B2 (en) * | 2016-10-26 | 2020-08-04 | Varian Semiconductor Equipment Associates, Inc. | Apparatus and method for differential in situ cleaning |
US9953933B1 (en) * | 2017-03-30 | 2018-04-24 | Stmicroelectronics, Inc. | Flow over wire die attach film and conductive molding compound to provide an electromagnetic interference shield for a semiconductor die |
US11043401B2 (en) * | 2017-04-19 | 2021-06-22 | Ngk Spark Plug Co., Ltd. | Ceramic member |
JP6510128B1 (ja) | 2018-08-13 | 2019-05-08 | 東芝インフラシステムズ株式会社 | 料金所データ処理装置、情報処理装置、料金所データ処理装置の車線端末制御機構の設定方法、情報処理装置の端末制御機構の設定方法、及び設定プログラム |
-
2020
- 2020-02-20 JP JP2020027481A patent/JP7353209B2/ja active Active
-
2021
- 2021-02-08 TW TW110104626A patent/TW202135193A/zh unknown
- 2021-02-09 CN CN202110174227.8A patent/CN113280923B/zh active Active
- 2021-02-10 KR KR1020210018941A patent/KR102651748B1/ko active IP Right Grant
- 2021-02-16 EP EP21157403.3A patent/EP3869543B1/en active Active
- 2021-02-17 US US17/177,687 patent/US11776829B2/en active Active
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002289330A (ja) | 2001-03-23 | 2002-10-04 | Nippon Dennetsu Co Ltd | 加熱体 |
JP2003100422A (ja) | 2001-09-25 | 2003-04-04 | Toshiba Ceramics Co Ltd | 箔状の抵抗発熱素子及び面状セラミックスヒーター |
JP2004193114A (ja) | 2002-11-25 | 2004-07-08 | Ibiden Co Ltd | 金属ヒータ |
JP2005123000A (ja) | 2003-10-16 | 2005-05-12 | Sumitomo Electric Ind Ltd | ヒータ |
US20180313697A1 (en) | 2015-10-19 | 2018-11-01 | Novena Tec Inc. | Process monitoring device |
JP2018182280A (ja) | 2017-04-19 | 2018-11-15 | 日本特殊陶業株式会社 | セラミックス部材 |
JP2019071349A (ja) | 2017-10-10 | 2019-05-09 | 住友電気工業株式会社 | ウエハ加熱用ヒータユニット |
US20200126824A1 (en) | 2018-10-17 | 2020-04-23 | Kuo Yang Ma | Super thin heating disk |
Also Published As
Publication number | Publication date |
---|---|
US20210265183A1 (en) | 2021-08-26 |
JP2021132162A (ja) | 2021-09-09 |
TW202135193A (zh) | 2021-09-16 |
EP3869543B1 (en) | 2023-12-20 |
CN113280923A (zh) | 2021-08-20 |
KR102651748B1 (ko) | 2024-03-28 |
CN113280923B (zh) | 2024-04-09 |
US11776829B2 (en) | 2023-10-03 |
KR20210106358A (ko) | 2021-08-30 |
EP3869543A1 (en) | 2021-08-25 |
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