JP7346268B2 - インプリント用のテンプレート、テンプレートを用いたインプリント方法 - Google Patents

インプリント用のテンプレート、テンプレートを用いたインプリント方法 Download PDF

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Publication number
JP7346268B2
JP7346268B2 JP2019220762A JP2019220762A JP7346268B2 JP 7346268 B2 JP7346268 B2 JP 7346268B2 JP 2019220762 A JP2019220762 A JP 2019220762A JP 2019220762 A JP2019220762 A JP 2019220762A JP 7346268 B2 JP7346268 B2 JP 7346268B2
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JP
Japan
Prior art keywords
pattern
template
imprint
outer edge
light shielding
Prior art date
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Active
Application number
JP2019220762A
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English (en)
Japanese (ja)
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JP2021090020A5 (enExample
JP2021090020A (ja
Inventor
義夫 須崎
智美 舩吉
敏彦 西田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to JP2019220762A priority Critical patent/JP7346268B2/ja
Priority to KR1020200165297A priority patent/KR102811295B1/ko
Priority to US17/110,089 priority patent/US11415882B2/en
Publication of JP2021090020A publication Critical patent/JP2021090020A/ja
Publication of JP2021090020A5 publication Critical patent/JP2021090020A5/ja
Application granted granted Critical
Publication of JP7346268B2 publication Critical patent/JP7346268B2/ja
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/42—Moulds or cores; Details thereof or accessories therefor characterised by the shape of the moulding surface, e.g. ribs or grooves
    • B29C33/424—Moulding surfaces provided with means for marking or patterning
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0015—Production of aperture devices, microporous systems or stamps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/42—Moulds or cores; Details thereof or accessories therefor characterised by the shape of the moulding surface, e.g. ribs or grooves
    • B29C33/424—Moulding surfaces provided with means for marking or patterning
    • B29C2033/426—Stampers

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
JP2019220762A 2019-12-05 2019-12-05 インプリント用のテンプレート、テンプレートを用いたインプリント方法 Active JP7346268B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2019220762A JP7346268B2 (ja) 2019-12-05 2019-12-05 インプリント用のテンプレート、テンプレートを用いたインプリント方法
KR1020200165297A KR102811295B1 (ko) 2019-12-05 2020-12-01 임프린트용 템플릿 및 템플릿을 사용한 임프린트 방법
US17/110,089 US11415882B2 (en) 2019-12-05 2020-12-02 Template for imprint and imprint method using template

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2019220762A JP7346268B2 (ja) 2019-12-05 2019-12-05 インプリント用のテンプレート、テンプレートを用いたインプリント方法

Publications (3)

Publication Number Publication Date
JP2021090020A JP2021090020A (ja) 2021-06-10
JP2021090020A5 JP2021090020A5 (enExample) 2022-10-27
JP7346268B2 true JP7346268B2 (ja) 2023-09-19

Family

ID=76209811

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2019220762A Active JP7346268B2 (ja) 2019-12-05 2019-12-05 インプリント用のテンプレート、テンプレートを用いたインプリント方法

Country Status (3)

Country Link
US (1) US11415882B2 (enExample)
JP (1) JP7346268B2 (enExample)
KR (1) KR102811295B1 (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11562924B2 (en) * 2020-01-31 2023-01-24 Canon Kabushiki Kaisha Planarization apparatus, planarization process, and method of manufacturing an article
US12195382B2 (en) * 2021-12-01 2025-01-14 Canon Kabushiki Kaisha Superstrate and a method of using the same

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080303187A1 (en) 2006-12-29 2008-12-11 Molecular Imprints, Inc. Imprint Fluid Control
JP2015144193A (ja) 2014-01-31 2015-08-06 株式会社東芝 インプリント方法、テンプレートおよびインプリント装置
JP2018006553A (ja) 2016-06-30 2018-01-11 キヤノン株式会社 モールド、インプリント方法、インプリント装置および物品製造方法
JP2018056545A (ja) 2016-05-25 2018-04-05 大日本印刷株式会社 テンプレート及びテンプレートブランクス、並びにインプリント用テンプレート基板の製造方法、インプリント用テンプレートの製造方法、及び、テンプレート

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5182470B2 (ja) * 2007-07-17 2013-04-17 大日本印刷株式会社 インプリントモールド
JP4799575B2 (ja) 2008-03-06 2011-10-26 株式会社東芝 インプリント方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080303187A1 (en) 2006-12-29 2008-12-11 Molecular Imprints, Inc. Imprint Fluid Control
JP2015144193A (ja) 2014-01-31 2015-08-06 株式会社東芝 インプリント方法、テンプレートおよびインプリント装置
JP2018056545A (ja) 2016-05-25 2018-04-05 大日本印刷株式会社 テンプレート及びテンプレートブランクス、並びにインプリント用テンプレート基板の製造方法、インプリント用テンプレートの製造方法、及び、テンプレート
JP2018006553A (ja) 2016-06-30 2018-01-11 キヤノン株式会社 モールド、インプリント方法、インプリント装置および物品製造方法

Also Published As

Publication number Publication date
KR102811295B1 (ko) 2025-05-23
US11415882B2 (en) 2022-08-16
KR20210070918A (ko) 2021-06-15
US20210173302A1 (en) 2021-06-10
JP2021090020A (ja) 2021-06-10

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