KR102811295B1 - 임프린트용 템플릿 및 템플릿을 사용한 임프린트 방법 - Google Patents

임프린트용 템플릿 및 템플릿을 사용한 임프린트 방법 Download PDF

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Publication number
KR102811295B1
KR102811295B1 KR1020200165297A KR20200165297A KR102811295B1 KR 102811295 B1 KR102811295 B1 KR 102811295B1 KR 1020200165297 A KR1020200165297 A KR 1020200165297A KR 20200165297 A KR20200165297 A KR 20200165297A KR 102811295 B1 KR102811295 B1 KR 102811295B1
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South Korea
Prior art keywords
template
pattern
light
outer edge
pattern surface
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English (en)
Korean (ko)
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KR20210070918A (ko
Inventor
요시오 스쟈키
도모미 후나요시
도시히코 니시다
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캐논 가부시끼가이샤
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/42—Moulds or cores; Details thereof or accessories therefor characterised by the shape of the moulding surface, e.g. ribs or grooves
    • B29C33/424—Moulding surfaces provided with means for marking or patterning
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0015—Production of aperture devices, microporous systems or stamps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/42—Moulds or cores; Details thereof or accessories therefor characterised by the shape of the moulding surface, e.g. ribs or grooves
    • B29C33/424—Moulding surfaces provided with means for marking or patterning
    • B29C2033/426—Stampers

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
KR1020200165297A 2019-12-05 2020-12-01 임프린트용 템플릿 및 템플릿을 사용한 임프린트 방법 Active KR102811295B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2019-220762 2019-12-05
JP2019220762A JP7346268B2 (ja) 2019-12-05 2019-12-05 インプリント用のテンプレート、テンプレートを用いたインプリント方法

Publications (2)

Publication Number Publication Date
KR20210070918A KR20210070918A (ko) 2021-06-15
KR102811295B1 true KR102811295B1 (ko) 2025-05-23

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KR1020200165297A Active KR102811295B1 (ko) 2019-12-05 2020-12-01 임프린트용 템플릿 및 템플릿을 사용한 임프린트 방법

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US (1) US11415882B2 (enExample)
JP (1) JP7346268B2 (enExample)
KR (1) KR102811295B1 (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11562924B2 (en) * 2020-01-31 2023-01-24 Canon Kabushiki Kaisha Planarization apparatus, planarization process, and method of manufacturing an article
US12195382B2 (en) * 2021-12-01 2025-01-14 Canon Kabushiki Kaisha Superstrate and a method of using the same

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009023113A (ja) 2007-07-17 2009-02-05 Dainippon Printing Co Ltd インプリントモールド
JP2015144193A (ja) * 2014-01-31 2015-08-06 株式会社東芝 インプリント方法、テンプレートおよびインプリント装置
JP2018056545A (ja) 2016-05-25 2018-04-05 大日本印刷株式会社 テンプレート及びテンプレートブランクス、並びにインプリント用テンプレート基板の製造方法、インプリント用テンプレートの製造方法、及び、テンプレート

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200842934A (en) * 2006-12-29 2008-11-01 Molecular Imprints Inc Imprint fluid control
JP4799575B2 (ja) 2008-03-06 2011-10-26 株式会社東芝 インプリント方法
JP6748496B2 (ja) * 2016-06-30 2020-09-02 キヤノン株式会社 モールド、インプリント方法、インプリント装置および物品製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009023113A (ja) 2007-07-17 2009-02-05 Dainippon Printing Co Ltd インプリントモールド
JP2015144193A (ja) * 2014-01-31 2015-08-06 株式会社東芝 インプリント方法、テンプレートおよびインプリント装置
JP2018056545A (ja) 2016-05-25 2018-04-05 大日本印刷株式会社 テンプレート及びテンプレートブランクス、並びにインプリント用テンプレート基板の製造方法、インプリント用テンプレートの製造方法、及び、テンプレート

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Publication number Publication date
JP7346268B2 (ja) 2023-09-19
KR20210070918A (ko) 2021-06-15
JP2021090020A (ja) 2021-06-10
US11415882B2 (en) 2022-08-16
US20210173302A1 (en) 2021-06-10

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