JP7309469B2 - リードピン及びリードピン付き配線基板 - Google Patents

リードピン及びリードピン付き配線基板 Download PDF

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Publication number
JP7309469B2
JP7309469B2 JP2019109834A JP2019109834A JP7309469B2 JP 7309469 B2 JP7309469 B2 JP 7309469B2 JP 2019109834 A JP2019109834 A JP 2019109834A JP 2019109834 A JP2019109834 A JP 2019109834A JP 7309469 B2 JP7309469 B2 JP 7309469B2
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JP
Japan
Prior art keywords
film
lead pins
wiring board
lead
tin
Prior art date
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Active
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JP2019109834A
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English (en)
Japanese (ja)
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JP2020202332A (ja
JP2020202332A5 (enExample
Inventor
直道 小山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinko Electric Industries Co Ltd
Original Assignee
Shinko Electric Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinko Electric Industries Co Ltd filed Critical Shinko Electric Industries Co Ltd
Priority to JP2019109834A priority Critical patent/JP7309469B2/ja
Priority to US16/891,350 priority patent/US11101202B2/en
Publication of JP2020202332A publication Critical patent/JP2020202332A/ja
Publication of JP2020202332A5 publication Critical patent/JP2020202332A5/ja
Application granted granted Critical
Publication of JP7309469B2 publication Critical patent/JP7309469B2/ja
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Anticipated expiration legal-status Critical

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
    • H01L21/4814—Conductive parts
    • H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
    • H01L21/4853—Connection or disconnection of other leads to or from a metallisation, e.g. pins, wires, bumps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49866—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials
    • H01L23/49894—Materials of the insulating layers or coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/1031—Surface mounted metallic connector elements
    • H05K2201/10318—Surface mounted metallic pins

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Ceramic Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
JP2019109834A 2019-06-12 2019-06-12 リードピン及びリードピン付き配線基板 Active JP7309469B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2019109834A JP7309469B2 (ja) 2019-06-12 2019-06-12 リードピン及びリードピン付き配線基板
US16/891,350 US11101202B2 (en) 2019-06-12 2020-06-03 Lead pin and wiring board having lead pin

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2019109834A JP7309469B2 (ja) 2019-06-12 2019-06-12 リードピン及びリードピン付き配線基板

Publications (3)

Publication Number Publication Date
JP2020202332A JP2020202332A (ja) 2020-12-17
JP2020202332A5 JP2020202332A5 (enExample) 2022-01-18
JP7309469B2 true JP7309469B2 (ja) 2023-07-18

Family

ID=73742930

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2019109834A Active JP7309469B2 (ja) 2019-06-12 2019-06-12 リードピン及びリードピン付き配線基板

Country Status (2)

Country Link
US (1) US11101202B2 (enExample)
JP (1) JP7309469B2 (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2024014314A1 (ja) * 2022-07-13 2024-01-18 ソニーセミコンダクタソリューションズ株式会社 半導体装置、実装基板及び電子機器

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000091487A (ja) 1998-07-15 2000-03-31 Fujitsu Takamisawa Component Ltd リードピンの部分めっき方法
JP2000223184A (ja) 1999-01-27 2000-08-11 Ngk Spark Plug Co Ltd 樹脂製基板
JP2001217341A (ja) 2000-02-03 2001-08-10 Ngk Spark Plug Co Ltd リードピン付き配線基板
JP2001358277A (ja) 2000-04-13 2001-12-26 Ngk Spark Plug Co Ltd ピン立設基板
JP2003293147A (ja) 2002-04-04 2003-10-15 Okuno Chem Ind Co Ltd 金めっき皮膜の後処理方法
JP2003338574A (ja) 2002-05-21 2003-11-28 Kyocera Corp ピン付き配線基板およびこれを用いた電子装置

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4518112A (en) * 1982-12-30 1985-05-21 International Business Machines Corporation Process for controlled braze joining of electronic packaging elements
JPS63121693A (ja) * 1986-11-10 1988-05-25 Hitachi Cable Ltd コネクタ−用端子
JPH0234798A (ja) 1988-07-26 1990-02-05 Fujitsu Ltd ピンのめっき方法
JPH0585051U (ja) * 1992-04-21 1993-11-16 株式会社東芝 Ｉｃパッケージ
JPH05343593A (ja) * 1992-06-11 1993-12-24 Nec Corp 接続端子
JPH0773121B2 (ja) * 1992-12-28 1995-08-02 日本電気株式会社 半導体装置用パッケージ及びその製造方法
JPH07320800A (ja) * 1994-05-18 1995-12-08 Star Micronics Co Ltd 端子及びその製造方法
JPH08153943A (ja) * 1994-09-26 1996-06-11 Matsushita Electric Works Ltd 回路基板のリード端子接合方法
JPH08316399A (ja) * 1995-05-18 1996-11-29 Ngk Spark Plug Co Ltd 電子部品用基板とその製造方法
US5916695A (en) * 1995-12-18 1999-06-29 Olin Corporation Tin coated electrical connector
US5780172A (en) * 1995-12-18 1998-07-14 Olin Corporation Tin coated electrical connector
US5816868A (en) * 1996-02-12 1998-10-06 Zierick Manufacturing Corp. Capillary action promoting surface mount connectors
US6300678B1 (en) * 1997-10-03 2001-10-09 Fujitsu Limited I/O pin having solder dam for connecting substrates
JPH11345672A (ja) * 1998-06-03 1999-12-14 Amp Japan Ltd 接続ピンの製造方法
US7340305B2 (en) * 2005-06-09 2008-03-04 Cardiac Pacemakers, Inc. Implantable medical device feedthrough assembly having a coated conductor
US8153900B2 (en) 2007-08-30 2012-04-10 Shinko Electric Industries Co., Ltd. Wiring substrate with lead pin and lead pin
JP4309948B2 (ja) 2007-08-30 2009-08-05 新光電気工業株式会社 リードピン付き配線基板およびリードピン
US9985372B2 (en) * 2015-03-20 2018-05-29 BIOTRONIK SE Co. KG Terminal pin and feedthrough

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000091487A (ja) 1998-07-15 2000-03-31 Fujitsu Takamisawa Component Ltd リードピンの部分めっき方法
JP2000223184A (ja) 1999-01-27 2000-08-11 Ngk Spark Plug Co Ltd 樹脂製基板
JP2001217341A (ja) 2000-02-03 2001-08-10 Ngk Spark Plug Co Ltd リードピン付き配線基板
JP2001358277A (ja) 2000-04-13 2001-12-26 Ngk Spark Plug Co Ltd ピン立設基板
JP2003293147A (ja) 2002-04-04 2003-10-15 Okuno Chem Ind Co Ltd 金めっき皮膜の後処理方法
JP2003338574A (ja) 2002-05-21 2003-11-28 Kyocera Corp ピン付き配線基板およびこれを用いた電子装置

Also Published As

Publication number Publication date
JP2020202332A (ja) 2020-12-17
US11101202B2 (en) 2021-08-24
US20200395277A1 (en) 2020-12-17

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