JP2020202332A5 - - Google Patents
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- Publication number
- JP2020202332A5 JP2020202332A5 JP2019109834A JP2019109834A JP2020202332A5 JP 2020202332 A5 JP2020202332 A5 JP 2020202332A5 JP 2019109834 A JP2019109834 A JP 2019109834A JP 2019109834 A JP2019109834 A JP 2019109834A JP 2020202332 A5 JP2020202332 A5 JP 2020202332A5
- Authority
- JP
- Japan
- Prior art keywords
- plating film
- lead pin
- head portion
- shaft portion
- pin according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000007747 plating Methods 0.000 claims 7
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims 2
- 239000004020 conductor Substances 0.000 claims 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims 1
- 239000010931 gold Substances 0.000 claims 1
- 229910052737 gold Inorganic materials 0.000 claims 1
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2019109834A JP7309469B2 (ja) | 2019-06-12 | 2019-06-12 | リードピン及びリードピン付き配線基板 |
| US16/891,350 US11101202B2 (en) | 2019-06-12 | 2020-06-03 | Lead pin and wiring board having lead pin |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2019109834A JP7309469B2 (ja) | 2019-06-12 | 2019-06-12 | リードピン及びリードピン付き配線基板 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2020202332A JP2020202332A (ja) | 2020-12-17 |
| JP2020202332A5 true JP2020202332A5 (enExample) | 2022-01-18 |
| JP7309469B2 JP7309469B2 (ja) | 2023-07-18 |
Family
ID=73742930
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2019109834A Active JP7309469B2 (ja) | 2019-06-12 | 2019-06-12 | リードピン及びリードピン付き配線基板 |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US11101202B2 (enExample) |
| JP (1) | JP7309469B2 (enExample) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2024014314A1 (ja) * | 2022-07-13 | 2024-01-18 | ソニーセミコンダクタソリューションズ株式会社 | 半導体装置、実装基板及び電子機器 |
Family Cites Families (24)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4518112A (en) * | 1982-12-30 | 1985-05-21 | International Business Machines Corporation | Process for controlled braze joining of electronic packaging elements |
| JPS63121693A (ja) * | 1986-11-10 | 1988-05-25 | Hitachi Cable Ltd | コネクタ−用端子 |
| JPH0234798A (ja) | 1988-07-26 | 1990-02-05 | Fujitsu Ltd | ピンのめっき方法 |
| JPH0585051U (ja) * | 1992-04-21 | 1993-11-16 | 株式会社東芝 | Ｉｃパッケージ |
| JPH05343593A (ja) * | 1992-06-11 | 1993-12-24 | Nec Corp | 接続端子 |
| JPH0773121B2 (ja) * | 1992-12-28 | 1995-08-02 | 日本電気株式会社 | 半導体装置用パッケージ及びその製造方法 |
| JPH07320800A (ja) * | 1994-05-18 | 1995-12-08 | Star Micronics Co Ltd | 端子及びその製造方法 |
| JPH08153943A (ja) * | 1994-09-26 | 1996-06-11 | Matsushita Electric Works Ltd | 回路基板のリード端子接合方法 |
| JPH08316399A (ja) * | 1995-05-18 | 1996-11-29 | Ngk Spark Plug Co Ltd | 電子部品用基板とその製造方法 |
| US5916695A (en) * | 1995-12-18 | 1999-06-29 | Olin Corporation | Tin coated electrical connector |
| US5780172A (en) * | 1995-12-18 | 1998-07-14 | Olin Corporation | Tin coated electrical connector |
| US5816868A (en) * | 1996-02-12 | 1998-10-06 | Zierick Manufacturing Corp. | Capillary action promoting surface mount connectors |
| US6300678B1 (en) * | 1997-10-03 | 2001-10-09 | Fujitsu Limited | I/O pin having solder dam for connecting substrates |
| JPH11345672A (ja) * | 1998-06-03 | 1999-12-14 | Amp Japan Ltd | 接続ピンの製造方法 |
| JP4079527B2 (ja) * | 1998-07-15 | 2008-04-23 | 富士通コンポーネント株式会社 | リードピンの部分めっき方法 |
| JP3160583B2 (ja) * | 1999-01-27 | 2001-04-25 | 日本特殊陶業株式会社 | 樹脂製基板 |
| JP3378550B2 (ja) * | 2000-02-03 | 2003-02-17 | 日本特殊陶業株式会社 | リードピン付き配線基板 |
| JP3550355B2 (ja) * | 2000-04-13 | 2004-08-04 | 日本特殊陶業株式会社 | ピン立設基板 |
| JP2003293147A (ja) * | 2002-04-04 | 2003-10-15 | Okuno Chem Ind Co Ltd | 金めっき皮膜の後処理方法 |
| JP2003338574A (ja) * | 2002-05-21 | 2003-11-28 | Kyocera Corp | ピン付き配線基板およびこれを用いた電子装置 |
| US7340305B2 (en) * | 2005-06-09 | 2008-03-04 | Cardiac Pacemakers, Inc. | Implantable medical device feedthrough assembly having a coated conductor |
| US8153900B2 (en) | 2007-08-30 | 2012-04-10 | Shinko Electric Industries Co., Ltd. | Wiring substrate with lead pin and lead pin |
| JP4309948B2 (ja) | 2007-08-30 | 2009-08-05 | 新光電気工業株式会社 | リードピン付き配線基板およびリードピン |
| US9985372B2 (en) * | 2015-03-20 | 2018-05-29 | BIOTRONIK SE Co. KG | Terminal pin and feedthrough |
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2019
- 2019-06-12 JP JP2019109834A patent/JP7309469B2/ja active Active
-
2020
- 2020-06-03 US US16/891,350 patent/US11101202B2/en active Active