JP7302350B2 - 銅ナノインク、プリント配線板用基板及び銅ナノインクの製造方法 - Google Patents

銅ナノインク、プリント配線板用基板及び銅ナノインクの製造方法 Download PDF

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JP7302350B2
JP7302350B2 JP2019135473A JP2019135473A JP7302350B2 JP 7302350 B2 JP7302350 B2 JP 7302350B2 JP 2019135473 A JP2019135473 A JP 2019135473A JP 2019135473 A JP2019135473 A JP 2019135473A JP 7302350 B2 JP7302350 B2 JP 7302350B2
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copper
nanoink
nanoparticles
copper nanoparticles
carboxylic acid
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JP2021017641A5 (enExample
JP2021017641A (ja
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浩樹 覚道
一誠 岡田
慧 平井
一弥 徳田
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Sumitomo Electric Industries Ltd
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Sumitomo Electric Industries Ltd
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    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P10/00Technologies related to metal processing
    • Y02P10/20Recycling

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  • Parts Printed On Printed Circuit Boards (AREA)
  • Laminated Bodies (AREA)
  • Manufacture Of Metal Powder And Suspensions Thereof (AREA)
  • Powder Metallurgy (AREA)
JP2019135473A 2019-07-23 2019-07-23 銅ナノインク、プリント配線板用基板及び銅ナノインクの製造方法 Active JP7302350B2 (ja)

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JP2019135473A JP7302350B2 (ja) 2019-07-23 2019-07-23 銅ナノインク、プリント配線板用基板及び銅ナノインクの製造方法

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JP2019135473A JP7302350B2 (ja) 2019-07-23 2019-07-23 銅ナノインク、プリント配線板用基板及び銅ナノインクの製造方法

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JP7153769B1 (ja) * 2021-06-15 2022-10-14 Jx金属株式会社 酸化銅含有粉末、導電性ペースト及び、酸化銅含有粉末の製造方法
WO2025205809A1 (ja) * 2024-03-28 2025-10-02 エレファンテック株式会社 インク組成物、回路基板製造方法、回路基板、プライマー、およびプライマー用コーティング剤

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007013393A1 (ja) 2005-07-25 2007-02-01 Sumitomo Metal Mining Co., Ltd. 銅微粒子分散液及びその製造方法
JP2012172135A (ja) 2011-02-24 2012-09-10 Toshiba Tec Corp ナノ粒子インク組成物及びその製造方法
JP2015180769A (ja) 2014-03-05 2015-10-15 古河電気工業株式会社 銅微粒子分散液
JP2016152405A (ja) 2015-02-19 2016-08-22 住友電工プリントサーキット株式会社 プリント配線板用基材、プリント配線板及びプリント配線板用基材の製造方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007013393A1 (ja) 2005-07-25 2007-02-01 Sumitomo Metal Mining Co., Ltd. 銅微粒子分散液及びその製造方法
JP2012172135A (ja) 2011-02-24 2012-09-10 Toshiba Tec Corp ナノ粒子インク組成物及びその製造方法
JP2015180769A (ja) 2014-03-05 2015-10-15 古河電気工業株式会社 銅微粒子分散液
JP2016152405A (ja) 2015-02-19 2016-08-22 住友電工プリントサーキット株式会社 プリント配線板用基材、プリント配線板及びプリント配線板用基材の製造方法

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