JP7294806B2 - イメージング装置における歪み補正に関する方法、システム及び装置 - Google Patents

イメージング装置における歪み補正に関する方法、システム及び装置 Download PDF

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JP7294806B2
JP7294806B2 JP2018500832A JP2018500832A JP7294806B2 JP 7294806 B2 JP7294806 B2 JP 7294806B2 JP 2018500832 A JP2018500832 A JP 2018500832A JP 2018500832 A JP2018500832 A JP 2018500832A JP 7294806 B2 JP7294806 B2 JP 7294806B2
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image
substrate
imaging
distortion
imaging device
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JP2018517146A (ja
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パウロウィッチ，クリストファー
ソーキン，アレキサンダー
マーティンチビッチ，ウラジミール
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テックインサイツ インコーポレイテッド
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N23/00—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00
    • G01N23/22—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by measuring secondary emission from the material
    • G01N23/225—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by measuring secondary emission from the material using electron or ion
    • G01N23/2251—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by measuring secondary emission from the material using electron or ion using incident electron beams, e.g. scanning electron microscopy [SEM]
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/70—Determining position or orientation of objects or cameras
    • G06T7/73—Determining position or orientation of objects or cameras using feature-based methods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/02—Details
    • H01J37/22—Optical, image processing or photographic arrangements associated with the tube
    • H01J37/222—Image processing arrangements associated with the tube
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/26—Electron or ion microscopes; Electron or ion diffraction tubes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/26—Electron or ion microscopes; Electron or ion diffraction tubes
    • H01J37/28—Electron or ion microscopes; Electron or ion diffraction tubes with scanning beams
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
    • H01J37/304—Controlling tubes by information coming from the objects or from the beam, e.g. correction signals
    • H01J37/3045—Object or beam position registration
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/60—Noise processing, e.g. detecting, correcting, reducing or removing noise
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2223/00—Investigating materials by wave or particle radiation
    • G01N2223/40—Imaging
    • G01N2223/418—Imaging electron microscope
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/10—Image acquisition modality
    • G06T2207/10056—Microscopic image
    • G06T2207/10061—Microscopic image from scanning electron microscope
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/20—Special algorithmic details
    • G06T2207/20068—Projection on vertical or horizontal image axis
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30141—Printed circuit board [PCB]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/22—Treatment of data
    • H01J2237/226—Image reconstruction
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/26—Electron or ion microscopes
    • H01J2237/28—Scanning microscopes
    • H01J2237/2813—Scanning microscopes characterised by the application
    • H01J2237/2817—Pattern inspection

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  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • General Health & Medical Sciences (AREA)
  • Biochemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Theoretical Computer Science (AREA)
  • Analysing Materials By The Use Of Radiation (AREA)
  • Image Processing (AREA)
JP2018500832A 2015-03-23 2016-03-22 イメージング装置における歪み補正に関する方法、システム及び装置 Active JP7294806B2 (ja)

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US201562137078P 2015-03-23 2015-03-23
US62/137,078 2015-03-23
PCT/CA2016/050328 WO2016149817A1 (en) 2015-03-23 2016-03-22 Methods, systems and devices relating to distortion correction in imaging devices

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JP2018517146A JP2018517146A (ja) 2018-06-28
JP2018517146A5 JP2018517146A5 (enExample) 2019-05-09
JP7294806B2 true JP7294806B2 (ja) 2023-06-20

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US (1) US10469777B2 (enExample)
EP (2) EP3274698A4 (enExample)
JP (1) JP7294806B2 (enExample)
CN (1) CN107533017B (enExample)
CA (1) CA2980201C (enExample)
WO (1) WO2016149817A1 (enExample)

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JP6867015B2 (ja) * 2017-03-27 2021-04-28 株式会社日立ハイテクサイエンス 自動加工装置
GB201715902D0 (en) * 2017-09-29 2017-11-15 Oxford Instr Plc Improved system for electron diffraction analysis
WO2019099638A1 (en) * 2017-11-15 2019-05-23 Butterfly Network, Inc. Ultrasound apparatuses and methods for fabricating ultrasound devices
JP6934811B2 (ja) * 2017-11-16 2021-09-15 株式会社ミツトヨ 三次元測定装置
DE102018204683B3 (de) * 2018-03-27 2019-08-08 Carl Zeiss Microscopy Gmbh Elektronenstrahlmikroskop
US10410372B1 (en) * 2018-06-14 2019-09-10 The University Of North Carolina At Chapel Hill Methods, systems, and computer-readable media for utilizing radial distortion to estimate a pose configuration
DE102018124401A1 (de) * 2018-10-02 2020-04-02 Carl Zeiss Smt Gmbh Verfahren zum Aufnehmen eines Bildes mit einem Teilchenmikroskop
FR3087928B1 (fr) 2018-10-29 2020-11-06 Texplained Procede de traitement d'une pluralite d'images elementaires acquises sur un circuit integre
US10834306B2 (en) * 2019-01-15 2020-11-10 International Business Machines Corporation Method for a remote control of a radiation detection apparatus
KR102608797B1 (ko) * 2023-04-10 2023-12-01 부산대학교 산학협력단 후방산란 엑스선 영상의 왜곡 보정 장치 및 방법
CN116416160A (zh) * 2023-04-12 2023-07-11 东方晶源微电子科技(上海)有限公司 图像矫正方法及装置
CN116580117B (zh) * 2023-04-13 2025-08-15 杭州瑞利超声科技有限公司 一种超声c扫描图像错位矫正算法

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CA2980201C (en) 2023-06-27
CN107533017B (zh) 2021-01-08
CN107533017A (zh) 2018-01-02
JP2018517146A (ja) 2018-06-28
EP3274698A4 (en) 2018-12-26
CA2980201A1 (en) 2016-09-29
EP3274698A1 (en) 2018-01-31
EP4009042A1 (en) 2022-06-08
WO2016149817A1 (en) 2016-09-29
US20180054575A1 (en) 2018-02-22
US10469777B2 (en) 2019-11-05

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