JP7289027B2 - 形状メトロロジのための基板保持装置及び方法 - Google Patents

形状メトロロジのための基板保持装置及び方法 Download PDF

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Publication number
JP7289027B2
JP7289027B2 JP2020549817A JP2020549817A JP7289027B2 JP 7289027 B2 JP7289027 B2 JP 7289027B2 JP 2020549817 A JP2020549817 A JP 2020549817A JP 2020549817 A JP2020549817 A JP 2020549817A JP 7289027 B2 JP7289027 B2 JP 7289027B2
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Prior art keywords
liquid
semiconductor wafer
membrane
substrate
wafer
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JP2020549817A
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Japanese (ja)
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JP2021518664A (ja
JP2021518664A5 (cg-RX-API-DMAC10.html
Inventor
カン，ホヨン
デヴィリアーズ，アントン
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Tokyo Electron Ltd
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Tokyo Electron Ltd
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25B—TOOLS OR BENCH DEVICES NOT OTHERWISE PROVIDED FOR, FOR FASTENING, CONNECTING, DISENGAGING, OR HOLDING
    • B25B11/00—Work holders not covered by any preceding group in the subclass, e.g. magnetic work holders, vacuum work holders
    • B25B11/005—Vacuum work holders
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0606—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7602—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a robot blade or gripped by a gripper for conveyance
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7608—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7611—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge profile or support profile
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7624—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/78—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using vacuum or suction, e.g. Bernoulli chucks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Robotics (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP2020549817A 2018-03-19 2019-03-19 形状メトロロジのための基板保持装置及び方法 Active JP7289027B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201862645128P 2018-03-19 2018-03-19
US62/645,128 2018-03-19
PCT/US2019/022859 WO2019183023A1 (en) 2018-03-19 2019-03-19 Substrate holding apparatus and method for shape metrology

Publications (3)

Publication Number Publication Date
JP2021518664A JP2021518664A (ja) 2021-08-02
JP2021518664A5 JP2021518664A5 (cg-RX-API-DMAC10.html) 2022-03-22
JP7289027B2 true JP7289027B2 (ja) 2023-06-09

Family

ID=67905048

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2020549817A Active JP7289027B2 (ja) 2018-03-19 2019-03-19 形状メトロロジのための基板保持装置及び方法

Country Status (6)

Country Link
US (2) US11247309B2 (cg-RX-API-DMAC10.html)
JP (1) JP7289027B2 (cg-RX-API-DMAC10.html)
KR (1) KR102719817B1 (cg-RX-API-DMAC10.html)
CN (1) CN111699548B (cg-RX-API-DMAC10.html)
TW (1) TWI803597B (cg-RX-API-DMAC10.html)
WO (1) WO2019183023A1 (cg-RX-API-DMAC10.html)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7289027B2 (ja) * 2018-03-19 2023-06-09 東京エレクトロン株式会社 形状メトロロジのための基板保持装置及び方法
US12469725B2 (en) 2021-06-27 2025-11-11 Delta Design, Inc. Method for determining corrective film pattern to reduce semiconductor wafer bow
KR102967876B1 (ko) * 2025-02-24 2026-05-20 김기욱 액체를 이용한 웨이퍼 얼라인먼트 장비

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002168739A (ja) 2000-11-29 2002-06-14 Seiko Epson Corp 薄板状被測定物の保持装置及び保持方法、水晶板のカット面検査装置及び検査方法、薄板状被測定物の平坦度測定装置及び測定方法

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JPS57141331A (en) * 1981-02-24 1982-09-01 Nec Home Electronics Ltd Thin plate piece conveying method
US5235995A (en) * 1989-03-27 1993-08-17 Semitool, Inc. Semiconductor processor apparatus with dynamic wafer vapor treatment and particulate volatilization
JPH06331339A (ja) * 1993-05-21 1994-12-02 Hitachi Cable Ltd 薄板の変形測定方法及びその装置
JPH0776774A (ja) 1993-06-24 1995-03-20 Nissin Electric Co Ltd 基板保持装置
JPH09258432A (ja) * 1996-03-21 1997-10-03 Toshiba Corp ガラスマスクの保持装置、及びこれを有する露光装置及び検査装置、並びにガラスマスクの保持方法、製造方法及び検査方法
US6439967B2 (en) * 1998-09-01 2002-08-27 Micron Technology, Inc. Microelectronic substrate assembly planarizing machines and methods of mechanical and chemical-mechanical planarization of microelectronic substrate assemblies
US6602380B1 (en) * 1998-10-28 2003-08-05 Micron Technology, Inc. Method and apparatus for releasably attaching a polishing pad to a chemical-mechanical planarization machine
JP2001196446A (ja) 2000-01-06 2001-07-19 Olympus Optical Co Ltd ホルダ装置
JP4108941B2 (ja) * 2000-10-31 2008-06-25 株式会社荏原製作所 基板の把持装置、処理装置、及び把持方法
JP2005019439A (ja) 2003-06-23 2005-01-20 Tokyo Seimitsu Co Ltd ウェーハ受渡し方法、ウェーハ受渡し装置及びそれを用いたウェーハ加工装置
JP4265306B2 (ja) 2003-06-27 2009-05-20 株式会社東京精密 ウェーハ受渡し装置
US7181132B2 (en) * 2003-08-20 2007-02-20 Asm International N.V. Method and system for loading substrate supports into a substrate holder
US7301623B1 (en) * 2003-12-16 2007-11-27 Nanometrics Incorporated Transferring, buffering and measuring a substrate in a metrology system
US10896842B2 (en) * 2009-10-20 2021-01-19 Tokyo Electron Limited Manufacturing method of sample table
JP5414602B2 (ja) * 2010-03-31 2014-02-12 株式会社日立ハイテクノロジーズ 検査装置
NL2007182A (en) * 2010-08-23 2012-02-27 Asml Netherlands Bv Fluid handling structure, module for an immersion lithographic apparatus, lithographic apparatus and device manufacturing method.
CN103278103B (zh) * 2013-05-18 2016-01-06 大连理工大学 一种薄基片变形的测量方法与装置
JP2015060852A (ja) * 2013-09-17 2015-03-30 株式会社東芝 半導体装置の製造方法及び製造装置
WO2015043638A1 (en) * 2013-09-26 2015-04-02 Süss Microtec Lithography Gmbh Chuck for suction and holding a wafer
JP7289027B2 (ja) 2018-03-19 2023-06-09 東京エレクトロン株式会社 形状メトロロジのための基板保持装置及び方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002168739A (ja) 2000-11-29 2002-06-14 Seiko Epson Corp 薄板状被測定物の保持装置及び保持方法、水晶板のカット面検査装置及び検査方法、薄板状被測定物の平坦度測定装置及び測定方法

Also Published As

Publication number Publication date
WO2019183023A1 (en) 2019-09-26
JP2021518664A (ja) 2021-08-02
US11484993B2 (en) 2022-11-01
TWI803597B (zh) 2023-06-01
TW201941361A (zh) 2019-10-16
US20220143786A1 (en) 2022-05-12
US11247309B2 (en) 2022-02-15
CN111699548A (zh) 2020-09-22
US20190283218A1 (en) 2019-09-19
CN111699548B (zh) 2023-12-05
KR102719817B1 (ko) 2024-10-18
KR20200124311A (ko) 2020-11-02

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