JP7284339B2 - セラミックヒータ及びその製法 - Google Patents

セラミックヒータ及びその製法 Download PDF

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Publication number
JP7284339B2
JP7284339B2 JP2022503600A JP2022503600A JP7284339B2 JP 7284339 B2 JP7284339 B2 JP 7284339B2 JP 2022503600 A JP2022503600 A JP 2022503600A JP 2022503600 A JP2022503600 A JP 2022503600A JP 7284339 B2 JP7284339 B2 JP 7284339B2
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JP
Japan
Prior art keywords
heating element
resistance heating
section
groove
ceramic
Prior art date
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Active
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JP2022503600A
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English (en)
Japanese (ja)
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JPWO2021172262A1 (https=
JPWO2021172262A5 (https=
Inventor
隆嘉 赤尾
夏樹 平田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NGK Insulators Ltd
Original Assignee
NGK Insulators Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NGK Insulators Ltd filed Critical NGK Insulators Ltd
Publication of JPWO2021172262A1 publication Critical patent/JPWO2021172262A1/ja
Publication of JPWO2021172262A5 publication Critical patent/JPWO2021172262A5/ja
Application granted granted Critical
Publication of JP7284339B2 publication Critical patent/JP7284339B2/ja
Active legal-status Critical Current
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/10—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor
    • H05B3/12—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material
    • H05B3/14—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material the material being non-metallic
    • H05B3/141—Conductive ceramics, e.g. metal oxides, metal carbides, barium titanate, ferrites, zirconia, vitrous compounds
    • H05B3/143—Conductive ceramics, e.g. metal oxides, metal carbides, barium titanate, ferrites, zirconia, vitrous compounds applied to semiconductors, e.g. wafers heating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B1/00—Details of electric heating devices
    • H05B1/02—Automatic switching arrangements specially adapted to apparatus ; Control of heating devices
    • H05B1/0227—Applications
    • H05B1/023—Industrial applications
    • H05B1/0233—Industrial applications for semiconductors manufacturing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/02—Details
    • H05B3/06—Heater elements structurally combined with coupling elements or holders
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/10—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor
    • H05B3/18—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor the conductor being embedded in an insulating material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/20—Heating elements having extended surface area substantially in a two-dimensional [2D] plane, e.g. plate-heater
    • H05B3/22—Heating elements having extended surface area substantially in a two-dimensional [2D] plane, e.g. plate-heater non-flexible
    • H05B3/28—Heating elements having extended surface area substantially in a two-dimensional [2D] plane, e.g. plate-heater non-flexible heating conductor embedded in insulating material
    • H05B3/283—Heating elements having extended surface area substantially in a two-dimensional [2D] plane, e.g. plate-heater non-flexible heating conductor embedded in insulating material the insulating material being an inorganic material, e.g. ceramic
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
    • H05B2203/002—Heaters using a particular layout for the resistive material or resistive elements
    • H05B2203/003—Heaters using a particular layout for the resistive material or resistive elements using serpentine layout
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
    • H05B2203/017—Manufacturing methods or apparatus for heaters

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Resistance Heating (AREA)
  • Surface Heating Bodies (AREA)
JP2022503600A 2020-02-26 2021-02-22 セラミックヒータ及びその製法 Active JP7284339B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020030725 2020-02-26
JP2020030725 2020-02-26
PCT/JP2021/006589 WO2021172262A1 (ja) 2020-02-26 2021-02-22 セラミックヒータ及びその製法

Publications (3)

Publication Number Publication Date
JPWO2021172262A1 JPWO2021172262A1 (https=) 2021-09-02
JPWO2021172262A5 JPWO2021172262A5 (https=) 2022-09-20
JP7284339B2 true JP7284339B2 (ja) 2023-05-30

Family

ID=77491124

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022503600A Active JP7284339B2 (ja) 2020-02-26 2021-02-22 セラミックヒータ及びその製法

Country Status (6)

Country Link
US (1) US12557183B2 (https=)
JP (1) JP7284339B2 (https=)
KR (1) KR102777792B1 (https=)
CN (1) CN115152322B (https=)
TW (1) TWI768727B (https=)
WO (1) WO2021172262A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2024119117A (ja) * 2023-02-22 2024-09-03 日本特殊陶業株式会社 保持部材および保持部材の製造方法
KR102731017B1 (ko) 2023-10-30 2024-11-19 주식회사 미코세라믹스 세라믹 서셉터

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002190373A (ja) 2000-12-19 2002-07-05 Ibiden Co Ltd セラミックヒータの製造方法
JP2006228633A (ja) 2005-02-18 2006-08-31 Ngk Insulators Ltd 基板加熱装置の製造方法及び基板加熱装置

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU693152B2 (en) * 1994-01-31 1998-06-25 Nippon Tungsten Co., Ltd. Flat PTC heater and resistance value regulating method for the same
WO2001031978A1 (en) * 1999-10-22 2001-05-03 Ibiden Co., Ltd. Ceramic heater
JP2004296445A (ja) * 2000-07-06 2004-10-21 Ibiden Co Ltd セラミックヒータ、セラミックヒータの製造方法およびセラミックヒータの製造システム
KR100463434B1 (ko) * 2001-12-04 2004-12-23 삼성전기주식회사 매립된 레지스터를 갖는 인쇄회로기판 및 이의 제조방법
US7361865B2 (en) 2003-08-27 2008-04-22 Kyocera Corporation Heater for heating a wafer and method for fabricating the same
JP2006054125A (ja) * 2004-08-12 2006-02-23 Kyocera Corp ヒータとその製造方法、及びこれを用いたウェハ加熱装置
JP5458050B2 (ja) * 2011-03-30 2014-04-02 日本碍子株式会社 静電チャックの製法
JP2013153129A (ja) * 2011-09-29 2013-08-08 Rohm Co Ltd チップ抵抗器および抵抗回路網を有する電子機器
JP6049509B2 (ja) * 2012-03-28 2016-12-21 日本碍子株式会社 セラミックヒーター、ヒーター電極及びセラミックヒーターの製法
JP6049510B2 (ja) * 2013-03-21 2016-12-21 日本碍子株式会社 セラミックヒータ及びその製法
JP6804828B2 (ja) * 2015-04-20 2020-12-23 日本特殊陶業株式会社 セラミックヒータ及び静電チャック
KR101771212B1 (ko) * 2015-09-02 2017-09-05 정권열 고데기
JP6584286B2 (ja) * 2015-10-26 2019-10-02 日本発條株式会社 ヒータユニット
US10681778B2 (en) * 2017-11-21 2020-06-09 Watlow Electric Manufacturing Company Integrated heater and method of manufacture

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002190373A (ja) 2000-12-19 2002-07-05 Ibiden Co Ltd セラミックヒータの製造方法
JP2006228633A (ja) 2005-02-18 2006-08-31 Ngk Insulators Ltd 基板加熱装置の製造方法及び基板加熱装置

Also Published As

Publication number Publication date
JPWO2021172262A1 (https=) 2021-09-02
US12557183B2 (en) 2026-02-17
WO2021172262A1 (ja) 2021-09-02
TWI768727B (zh) 2022-06-21
CN115152322A (zh) 2022-10-04
CN115152322B (zh) 2026-02-17
US20220377850A1 (en) 2022-11-24
KR20220124780A (ko) 2022-09-14
KR102777792B1 (ko) 2025-03-10
TW202143362A (zh) 2021-11-16

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