TWI768727B - 陶瓷加熱器以及其製造方法 - Google Patents

陶瓷加熱器以及其製造方法 Download PDF

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Publication number
TWI768727B
TWI768727B TW110106267A TW110106267A TWI768727B TW I768727 B TWI768727 B TW I768727B TW 110106267 A TW110106267 A TW 110106267A TW 110106267 A TW110106267 A TW 110106267A TW I768727 B TWI768727 B TW I768727B
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TW
Taiwan
Prior art keywords
resistance heating
heating element
groove
ceramic
convex portion
Prior art date
Application number
TW110106267A
Other languages
English (en)
Chinese (zh)
Other versions
TW202143362A (zh
Inventor
赤尾𨺓嘉
平田夏樹
Original Assignee
日商日本碍子股份有限公司
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Publication date
Application filed by 日商日本碍子股份有限公司 filed Critical 日商日本碍子股份有限公司
Publication of TW202143362A publication Critical patent/TW202143362A/zh
Application granted granted Critical
Publication of TWI768727B publication Critical patent/TWI768727B/zh

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/10—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor
    • H05B3/12—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material
    • H05B3/14—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material the material being non-metallic
    • H05B3/141—Conductive ceramics, e.g. metal oxides, metal carbides, barium titanate, ferrites, zirconia, vitrous compounds
    • H05B3/143—Conductive ceramics, e.g. metal oxides, metal carbides, barium titanate, ferrites, zirconia, vitrous compounds applied to semiconductors, e.g. wafers heating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B1/00—Details of electric heating devices
    • H05B1/02—Automatic switching arrangements specially adapted to apparatus ; Control of heating devices
    • H05B1/0227—Applications
    • H05B1/023—Industrial applications
    • H05B1/0233—Industrial applications for semiconductors manufacturing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/02—Details
    • H05B3/06—Heater elements structurally combined with coupling elements or holders
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/10—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor
    • H05B3/18—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor the conductor being embedded in an insulating material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/20—Heating elements having extended surface area substantially in a two-dimensional [2D] plane, e.g. plate-heater
    • H05B3/22—Heating elements having extended surface area substantially in a two-dimensional [2D] plane, e.g. plate-heater non-flexible
    • H05B3/28—Heating elements having extended surface area substantially in a two-dimensional [2D] plane, e.g. plate-heater non-flexible heating conductor embedded in insulating material
    • H05B3/283—Heating elements having extended surface area substantially in a two-dimensional [2D] plane, e.g. plate-heater non-flexible heating conductor embedded in insulating material the insulating material being an inorganic material, e.g. ceramic
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
    • H05B2203/002—Heaters using a particular layout for the resistive material or resistive elements
    • H05B2203/003—Heaters using a particular layout for the resistive material or resistive elements using serpentine layout
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
    • H05B2203/017—Manufacturing methods or apparatus for heaters

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Resistance Heating (AREA)
  • Surface Heating Bodies (AREA)
TW110106267A 2020-02-26 2021-02-23 陶瓷加熱器以及其製造方法 TWI768727B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020-030725 2020-02-26
JP2020030725 2020-02-26

Publications (2)

Publication Number Publication Date
TW202143362A TW202143362A (zh) 2021-11-16
TWI768727B true TWI768727B (zh) 2022-06-21

Family

ID=77491124

Family Applications (1)

Application Number Title Priority Date Filing Date
TW110106267A TWI768727B (zh) 2020-02-26 2021-02-23 陶瓷加熱器以及其製造方法

Country Status (6)

Country Link
US (1) US12557183B2 (https=)
JP (1) JP7284339B2 (https=)
KR (1) KR102777792B1 (https=)
CN (1) CN115152322B (https=)
TW (1) TWI768727B (https=)
WO (1) WO2021172262A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2024119117A (ja) * 2023-02-22 2024-09-03 日本特殊陶業株式会社 保持部材および保持部材の製造方法
KR102731017B1 (ko) 2023-10-30 2024-11-19 주식회사 미코세라믹스 세라믹 서셉터

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002190373A (ja) * 2000-12-19 2002-07-05 Ibiden Co Ltd セラミックヒータの製造方法
US20030000937A1 (en) * 1999-10-22 2003-01-02 Ibiden Co. Ltd. Ceramic heater
TW201703581A (zh) * 2015-04-20 2017-01-16 日本特殊陶業股份有限公司 陶瓷加熱器及靜電夾頭
TW201715614A (zh) * 2015-10-26 2017-05-01 日本發條股份有限公司 加熱單元
TW201926599A (zh) * 2017-11-21 2019-07-01 美商瓦特洛威電子製造公司 積體式加熱器及製造方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU693152B2 (en) * 1994-01-31 1998-06-25 Nippon Tungsten Co., Ltd. Flat PTC heater and resistance value regulating method for the same
JP2004296445A (ja) * 2000-07-06 2004-10-21 Ibiden Co Ltd セラミックヒータ、セラミックヒータの製造方法およびセラミックヒータの製造システム
KR100463434B1 (ko) * 2001-12-04 2004-12-23 삼성전기주식회사 매립된 레지스터를 갖는 인쇄회로기판 및 이의 제조방법
US7361865B2 (en) 2003-08-27 2008-04-22 Kyocera Corporation Heater for heating a wafer and method for fabricating the same
JP2006054125A (ja) * 2004-08-12 2006-02-23 Kyocera Corp ヒータとその製造方法、及びこれを用いたウェハ加熱装置
JP2006228633A (ja) 2005-02-18 2006-08-31 Ngk Insulators Ltd 基板加熱装置の製造方法及び基板加熱装置
JP5458050B2 (ja) * 2011-03-30 2014-04-02 日本碍子株式会社 静電チャックの製法
JP2013153129A (ja) * 2011-09-29 2013-08-08 Rohm Co Ltd チップ抵抗器および抵抗回路網を有する電子機器
JP6049509B2 (ja) * 2012-03-28 2016-12-21 日本碍子株式会社 セラミックヒーター、ヒーター電極及びセラミックヒーターの製法
JP6049510B2 (ja) * 2013-03-21 2016-12-21 日本碍子株式会社 セラミックヒータ及びその製法
KR101771212B1 (ko) * 2015-09-02 2017-09-05 정권열 고데기

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030000937A1 (en) * 1999-10-22 2003-01-02 Ibiden Co. Ltd. Ceramic heater
JP2002190373A (ja) * 2000-12-19 2002-07-05 Ibiden Co Ltd セラミックヒータの製造方法
TW201703581A (zh) * 2015-04-20 2017-01-16 日本特殊陶業股份有限公司 陶瓷加熱器及靜電夾頭
TW201715614A (zh) * 2015-10-26 2017-05-01 日本發條股份有限公司 加熱單元
TW201926599A (zh) * 2017-11-21 2019-07-01 美商瓦特洛威電子製造公司 積體式加熱器及製造方法

Also Published As

Publication number Publication date
JPWO2021172262A1 (https=) 2021-09-02
US12557183B2 (en) 2026-02-17
JP7284339B2 (ja) 2023-05-30
WO2021172262A1 (ja) 2021-09-02
CN115152322A (zh) 2022-10-04
CN115152322B (zh) 2026-02-17
US20220377850A1 (en) 2022-11-24
KR20220124780A (ko) 2022-09-14
KR102777792B1 (ko) 2025-03-10
TW202143362A (zh) 2021-11-16

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