JP7262170B2 - 半導体処理ツールとの随意の統合を伴うスマートバイブレーションウエハ - Google Patents

半導体処理ツールとの随意の統合を伴うスマートバイブレーションウエハ Download PDF

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JP7262170B2
JP7262170B2 JP2018016053A JP2018016053A JP7262170B2 JP 7262170 B2 JP7262170 B2 JP 7262170B2 JP 2018016053 A JP2018016053 A JP 2018016053A JP 2018016053 A JP2018016053 A JP 2018016053A JP 7262170 B2 JP7262170 B2 JP 7262170B2
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acceleration
accelerometer
magnitude
axis
along
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JP2018129509A (ja
JP2018129509A5 (enExample
Inventor
ピーター・エス．・タウラド
アルセルバム・シモン・ジェヤパラン
リチャード・エム．・ブランク
タイソン・リー・リンゴールド
ザ サード ビクター・エデュアルド・エスピノサ・
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Lam Research Corp
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Lam Research Corp
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/18—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration in two or more dimensions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Manipulator (AREA)
  • General Engineering & Computer Science (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Apparatuses For Generation Of Mechanical Vibrations (AREA)
JP2018016053A 2017-02-06 2018-02-01 半導体処理ツールとの随意の統合を伴うスマートバイブレーションウエハ Active JP7262170B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US15/425,921 2017-02-06
US15/425,921 US10509052B2 (en) 2017-02-06 2017-02-06 Smart vibration wafer with optional integration with semiconductor processing tool

Publications (3)

Publication Number Publication Date
JP2018129509A JP2018129509A (ja) 2018-08-16
JP2018129509A5 JP2018129509A5 (enExample) 2021-03-11
JP7262170B2 true JP7262170B2 (ja) 2023-04-21

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ID=63037664

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JP2018016053A Active JP7262170B2 (ja) 2017-02-06 2018-02-01 半導体処理ツールとの随意の統合を伴うスマートバイブレーションウエハ

Country Status (4)

Country Link
US (1) US10509052B2 (enExample)
JP (1) JP7262170B2 (enExample)
KR (1) KR102533845B1 (enExample)
TW (2) TWI849465B (enExample)

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US10403539B2 (en) * 2017-08-04 2019-09-03 Kawasaki Jukogyo Kabushiki Kaisha Robot diagnosing method
JP7119455B2 (ja) * 2018-03-19 2022-08-17 セイコーエプソン株式会社 センサーモジュール、計測システム、電子機器、及び移動体
US11404296B2 (en) * 2018-09-04 2022-08-02 Applied Materials, Inc. Method and apparatus for measuring placement of a substrate on a heater pedestal
KR102743954B1 (ko) * 2019-07-08 2024-12-18 삼성전자주식회사 비전 센서, 이를 이용한 반도체 공정 챔버의 검사방법, 및 이를 이용한 반도체 소자의 제조방법
JP7705388B2 (ja) * 2019-11-01 2025-07-09 ラム リサーチ コーポレーション 重力場センサを備えたウエハハンドリングロボット
JP7530779B2 (ja) * 2020-09-10 2024-08-08 東京エレクトロン株式会社 実行装置及び実行方法
KR102584513B1 (ko) 2020-12-31 2023-10-06 세메스 주식회사 온도 변화가 수반되는 분위기에 제공되는 기판 지지 부재의 수평 측정용 기판형 센서, 이를 이용한 수평 측정 방법 및 비일시적 컴퓨터 판독가능 매체
KR102650610B1 (ko) * 2021-05-31 2024-03-26 세메스 주식회사 기판 처리 장치 및 기판 처리 시스템
US11817724B2 (en) * 2022-03-02 2023-11-14 Applied Materials, Inc. Enclosure system with charging assembly
CN116741685B (zh) * 2023-08-14 2023-10-13 泓浒(苏州)半导体科技有限公司 一种晶圆安全传输控制方法及系统

Citations (6)

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JP2006155362A (ja) 2004-11-30 2006-06-15 Fanuc Ltd 回転軸制御装置
JP2006310349A (ja) 2005-04-26 2006-11-09 Renesas Technology Corp 半導体装置の製造システム及び製造方法
JP2009012107A (ja) 2007-07-03 2009-01-22 Nec Electronics Corp 基板処理装置のための設置・搬送情報教示治具及び教示方法
JP2011253844A (ja) 2010-05-31 2011-12-15 Tokyo Electron Ltd 基板処理装置のデータ取得方法及びセンサ用基板
US20150214091A1 (en) 2014-01-28 2015-07-30 Lam Research Corporation Wafer handling traction control system
JP2016146416A (ja) 2015-02-09 2016-08-12 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理システム

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US5444637A (en) 1993-09-28 1995-08-22 Advanced Micro Devices, Inc. Programmable semiconductor wafer for sensing, recording and retrieving fabrication process conditions to which the wafer is exposed
US6244121B1 (en) 1998-03-06 2001-06-12 Applied Materials, Inc. Sensor device for non-intrusive diagnosis of a semiconductor processing system
IL147692A0 (en) 2002-01-17 2002-08-14 Innersense Ltd Machine and environment analyzer
US7757574B2 (en) 2002-01-24 2010-07-20 Kla-Tencor Corporation Process condition sensing wafer and data analysis system
US6889568B2 (en) 2002-01-24 2005-05-10 Sensarray Corporation Process condition sensing wafer and data analysis system
US20050224899A1 (en) 2002-02-06 2005-10-13 Ramsey Craig C Wireless substrate-like sensor
US7289230B2 (en) 2002-02-06 2007-10-30 Cyberoptics Semiconductors, Inc. Wireless substrate-like sensor
US6807503B2 (en) 2002-11-04 2004-10-19 Brion Technologies, Inc. Method and apparatus for monitoring integrated circuit fabrication
US7135852B2 (en) 2002-12-03 2006-11-14 Sensarray Corporation Integrated process condition sensing wafer and data analysis system
US7151366B2 (en) 2002-12-03 2006-12-19 Sensarray Corporation Integrated process condition sensing wafer and data analysis system
US7171334B2 (en) 2004-06-01 2007-01-30 Brion Technologies, Inc. Method and apparatus for synchronizing data acquisition of a monitored IC fabrication process
US7676342B2 (en) 2004-12-23 2010-03-09 Asml Netherlands B.V. Sensor assembly, digital serial bus and protocol, sensor network, and lithographic apparatus and system
US20070113652A1 (en) 2005-10-07 2007-05-24 Renken Wayne G Wireless Position Sensing Wafer
TW200733264A (en) * 2005-11-25 2007-09-01 Matsushita Electric Works Ltd Method of producing wafer-level package structure
JP5120258B2 (ja) * 2006-09-12 2013-01-16 株式会社安川電機 ワーク搬送装置
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US8752872B2 (en) * 2009-09-14 2014-06-17 Fabworx Solutions, Inc. Edge grip end effector
US10330491B2 (en) * 2011-10-10 2019-06-25 Texas Instruments Incorporated Robust step detection using low cost MEMS accelerometer in mobile applications, and processing methods, apparatus and systems
JP6380737B2 (ja) * 2014-04-18 2018-08-29 セイコーエプソン株式会社 電子デバイス、電子機器、および移動体

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006155362A (ja) 2004-11-30 2006-06-15 Fanuc Ltd 回転軸制御装置
JP2006310349A (ja) 2005-04-26 2006-11-09 Renesas Technology Corp 半導体装置の製造システム及び製造方法
JP2009012107A (ja) 2007-07-03 2009-01-22 Nec Electronics Corp 基板処理装置のための設置・搬送情報教示治具及び教示方法
JP2011253844A (ja) 2010-05-31 2011-12-15 Tokyo Electron Ltd 基板処理装置のデータ取得方法及びセンサ用基板
US20150214091A1 (en) 2014-01-28 2015-07-30 Lam Research Corporation Wafer handling traction control system
JP2016146416A (ja) 2015-02-09 2016-08-12 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理システム

Also Published As

Publication number Publication date
KR102533845B1 (ko) 2023-05-17
US10509052B2 (en) 2019-12-17
JP2018129509A (ja) 2018-08-16
US20180224500A1 (en) 2018-08-09
KR20180091714A (ko) 2018-08-16
TWI849465B (zh) 2024-07-21
TW202314271A (zh) 2023-04-01
TW201842344A (zh) 2018-12-01
TWI775807B (zh) 2022-09-01

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