JP7256675B2 - 低誘電膜の形成方法及び半導体素子の形成方法 - Google Patents
低誘電膜の形成方法及び半導体素子の形成方法 Download PDFInfo
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- JP7256675B2 JP7256675B2 JP2019078428A JP2019078428A JP7256675B2 JP 7256675 B2 JP7256675 B2 JP 7256675B2 JP 2019078428 A JP2019078428 A JP 2019078428A JP 2019078428 A JP2019078428 A JP 2019078428A JP 7256675 B2 JP7256675 B2 JP 7256675B2
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Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2018-0048568 | 2018-04-26 | ||
| KR1020180048568A KR102541454B1 (ko) | 2018-04-26 | 2018-04-26 | 저유전막의 형성 방법, 및 반도체 소자의 형성방법 |
Publications (3)
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| EP4092154A1 (en) * | 2015-06-16 | 2022-11-23 | Versum Materials US, LLC | Processes for depositing silicon-containing films using same |
| US12142479B2 (en) * | 2020-01-17 | 2024-11-12 | Asm Ip Holding B.V. | Formation of SiOCN thin films |
| KR102830540B1 (ko) * | 2021-07-29 | 2025-07-07 | 삼성전자주식회사 | 반도체 장치 |
| JP7437362B2 (ja) * | 2021-09-28 | 2024-02-22 | 株式会社Kokusai Electric | 半導体装置の製造方法、基板処理装置、基板処理方法及びプログラム |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008527723A (ja) | 2005-01-06 | 2008-07-24 | インテル・コーポレーション | 階段状ソース/ドレイン領域を有するデバイス |
| WO2013027549A1 (ja) | 2011-08-25 | 2013-02-28 | 株式会社日立国際電気 | 半導体装置の製造方法、基板処理方法、基板処理装置および記録媒体 |
| JP2014146670A (ja) | 2013-01-29 | 2014-08-14 | Tokyo Electron Ltd | 成膜方法及び成膜装置 |
| JP2014183218A (ja) | 2013-03-19 | 2014-09-29 | Hitachi Kokusai Electric Inc | 半導体装置の製造方法、基板処理装置及びプログラム |
| JP2016066688A (ja) | 2014-09-24 | 2016-04-28 | 株式会社日立国際電気 | 半導体装置の製造方法、基板処理装置およびプログラム |
| US20170117140A1 (en) | 2015-10-22 | 2017-04-27 | Samsung Electronics Co., Ltd. | Material layer, semiconductor device including the same, and methods of fabricating the material layer and the semiconductor device |
| US20170186603A1 (en) | 2015-12-28 | 2017-06-29 | Samsung Electronics Co., Ltd. | METHOD OF FORMING SiOCN MATERIAL LAYER AND METHOD OF FABRICATING SEMICONDUCTOR DEVICE |
Family Cites Families (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6486082B1 (en) * | 2001-06-18 | 2002-11-26 | Applied Materials, Inc. | CVD plasma assisted lower dielectric constant sicoh film |
| US6962876B2 (en) | 2002-03-05 | 2005-11-08 | Samsung Electronics Co., Ltd. | Method for forming a low-k dielectric layer for a semiconductor device |
| JP2007043147A (ja) | 2005-07-29 | 2007-02-15 | Samsung Electronics Co Ltd | 原子層蒸着工程を用いたシリコンリッチナノクリスタル構造物の形成方法及びこれを用いた不揮発性半導体装置の製造方法 |
| US7795089B2 (en) * | 2007-02-28 | 2010-09-14 | Freescale Semiconductor, Inc. | Forming a semiconductor device having epitaxially grown source and drain regions |
| JP5151260B2 (ja) * | 2007-06-11 | 2013-02-27 | 東京エレクトロン株式会社 | 成膜方法及び成膜装置 |
| US8647722B2 (en) | 2008-11-14 | 2014-02-11 | Asm Japan K.K. | Method of forming insulation film using plasma treatment cycles |
| KR101074291B1 (ko) | 2009-09-11 | 2011-10-18 | 한국철강 주식회사 | 광기전력 장치 및 광기전력의 제조 방법 |
| JP5514365B2 (ja) | 2011-03-23 | 2014-06-04 | 株式会社日立国際電気 | 半導体装置の製造方法、基板処理方法および基板処理装置 |
| JP6049395B2 (ja) * | 2011-12-09 | 2016-12-21 | 株式会社日立国際電気 | 半導体装置の製造方法、基板処理方法、基板処理装置およびプログラム |
| JP5806612B2 (ja) * | 2011-12-27 | 2015-11-10 | 東京エレクトロン株式会社 | シリコン酸炭窒化膜の形成方法 |
| JP6022274B2 (ja) | 2012-09-18 | 2016-11-09 | 株式会社日立国際電気 | 半導体装置の製造方法、基板処理装置およびプログラム |
| JP6199570B2 (ja) * | 2013-02-07 | 2017-09-20 | 株式会社日立国際電気 | 半導体装置の製造方法、基板処理方法、基板処理装置およびプログラム |
| JP6035166B2 (ja) | 2013-02-26 | 2016-11-30 | 株式会社日立国際電気 | 半導体装置の製造方法、基板処理装置およびプログラム |
| JP6111097B2 (ja) * | 2013-03-12 | 2017-04-05 | 株式会社日立国際電気 | 半導体装置の製造方法、基板処理装置およびプログラム |
| JP5864637B2 (ja) | 2013-03-19 | 2016-02-17 | 株式会社日立国際電気 | 半導体装置の製造方法、基板処理装置、プログラム及び記録媒体 |
| KR101846850B1 (ko) * | 2013-09-30 | 2018-04-09 | 가부시키가이샤 히다치 고쿠사이 덴키 | 반도체 장치의 제조 방법, 기판 처리 장치, 기판 처리 시스템 및 기록 매체 |
| JP2016536452A (ja) | 2013-10-15 | 2016-11-24 | ビーコ・エーエルディー インコーポレイテッド | 種前駆体を用いる高速原子層堆積プロセス |
| JP6479560B2 (ja) | 2015-05-01 | 2019-03-06 | 東京エレクトロン株式会社 | 成膜装置 |
| SG10201607880PA (en) | 2015-09-25 | 2017-04-27 | Tokyo Electron Ltd | METHOD FOR FORMING TiON FILM |
-
2018
- 2018-04-26 KR KR1020180048568A patent/KR102541454B1/ko active Active
- 2018-12-12 US US16/217,339 patent/US10861695B2/en active Active
-
2019
- 2019-04-10 SG SG10201903205R patent/SG10201903205RA/en unknown
- 2019-04-12 CN CN201910292773.4A patent/CN110416061B/zh active Active
- 2019-04-17 JP JP2019078428A patent/JP7256675B2/ja active Active
- 2019-04-25 EP EP19171041.7A patent/EP3561860A1/en not_active Withdrawn
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008527723A (ja) | 2005-01-06 | 2008-07-24 | インテル・コーポレーション | 階段状ソース/ドレイン領域を有するデバイス |
| WO2013027549A1 (ja) | 2011-08-25 | 2013-02-28 | 株式会社日立国際電気 | 半導体装置の製造方法、基板処理方法、基板処理装置および記録媒体 |
| JP2014146670A (ja) | 2013-01-29 | 2014-08-14 | Tokyo Electron Ltd | 成膜方法及び成膜装置 |
| JP2014183218A (ja) | 2013-03-19 | 2014-09-29 | Hitachi Kokusai Electric Inc | 半導体装置の製造方法、基板処理装置及びプログラム |
| JP2016066688A (ja) | 2014-09-24 | 2016-04-28 | 株式会社日立国際電気 | 半導体装置の製造方法、基板処理装置およびプログラム |
| US20170117140A1 (en) | 2015-10-22 | 2017-04-27 | Samsung Electronics Co., Ltd. | Material layer, semiconductor device including the same, and methods of fabricating the material layer and the semiconductor device |
| US20170186603A1 (en) | 2015-12-28 | 2017-06-29 | Samsung Electronics Co., Ltd. | METHOD OF FORMING SiOCN MATERIAL LAYER AND METHOD OF FABRICATING SEMICONDUCTOR DEVICE |
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| KR102541454B1 (ko) | 2023-06-09 |
| SG10201903205RA (en) | 2019-11-28 |
| US10861695B2 (en) | 2020-12-08 |
| CN110416061A (zh) | 2019-11-05 |
| JP2019192907A (ja) | 2019-10-31 |
| US20190333754A1 (en) | 2019-10-31 |
| EP3561860A1 (en) | 2019-10-30 |
| CN110416061B (zh) | 2024-04-30 |
| KR20190124509A (ko) | 2019-11-05 |
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