JP7249814B2 - 熱処理装置および熱処理方法 - Google Patents

熱処理装置および熱処理方法 Download PDF

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Publication number
JP7249814B2
JP7249814B2 JP2019038355A JP2019038355A JP7249814B2 JP 7249814 B2 JP7249814 B2 JP 7249814B2 JP 2019038355 A JP2019038355 A JP 2019038355A JP 2019038355 A JP2019038355 A JP 2019038355A JP 7249814 B2 JP7249814 B2 JP 7249814B2
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Japan
Prior art keywords
substrate
heat treatment
mounting surface
space
supported
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JP2019038355A
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English (en)
Japanese (ja)
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JP2020145215A (ja
Inventor
恵 林
茂宏 後藤
正晃 古川
慧 末永
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Screen Holdings Co Ltd
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Screen Holdings Co Ltd
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Publication date
Application filed by Screen Holdings Co Ltd filed Critical Screen Holdings Co Ltd
Priority to JP2019038355A priority Critical patent/JP7249814B2/ja
Priority to PCT/JP2020/002793 priority patent/WO2020179283A1/ja
Priority to TW109104485A priority patent/TWI794585B/zh
Publication of JP2020145215A publication Critical patent/JP2020145215A/ja
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Publication of JP7249814B2 publication Critical patent/JP7249814B2/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/324—Thermal treatment for modifying the properties of semiconductor bodies, e.g. annealing, sintering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2019038355A 2019-03-04 2019-03-04 熱処理装置および熱処理方法 Active JP7249814B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2019038355A JP7249814B2 (ja) 2019-03-04 2019-03-04 熱処理装置および熱処理方法
PCT/JP2020/002793 WO2020179283A1 (ja) 2019-03-04 2020-01-27 熱処理装置および熱処理方法
TW109104485A TWI794585B (zh) 2019-03-04 2020-02-13 熱處理裝置及熱處理方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2019038355A JP7249814B2 (ja) 2019-03-04 2019-03-04 熱処理装置および熱処理方法

Publications (2)

Publication Number Publication Date
JP2020145215A JP2020145215A (ja) 2020-09-10
JP7249814B2 true JP7249814B2 (ja) 2023-03-31

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JP2019038355A Active JP7249814B2 (ja) 2019-03-04 2019-03-04 熱処理装置および熱処理方法

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JP (1) JP7249814B2 (zh)
TW (1) TWI794585B (zh)
WO (1) WO2020179283A1 (zh)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7474688B2 (ja) 2020-12-03 2024-04-25 東京エレクトロン株式会社 補正方法及び基板搬送装置
TW202326927A (zh) * 2021-10-15 2023-07-01 日商東京威力科創股份有限公司 基板處理裝置

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005117007A (ja) 2003-09-19 2005-04-28 Dainippon Screen Mfg Co Ltd 基板処理ユニット、基板載置状態検出方法および基板処理装置
JP2011243834A (ja) 2010-05-20 2011-12-01 Tokyo Electron Ltd プラズマ処理装置，基板保持機構，基板位置ずれ検出方法
JP2018157000A (ja) 2017-03-16 2018-10-04 株式会社日本製鋼所 レーザ照射装置、レーザ照射方法、及び半導体装置の製造方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2884011B2 (ja) * 1990-09-29 1999-04-19 イビデン株式会社 電子部品搭載用基板の外形加工装置
JPH10284360A (ja) * 1997-04-02 1998-10-23 Hitachi Ltd 基板温度制御装置及び方法
JPH1187480A (ja) * 1997-09-11 1999-03-30 Ulvac Japan Ltd 被吸着物の吸着状態モニター方法及び真空装置
JP4666473B2 (ja) * 2005-05-12 2011-04-06 大日本スクリーン製造株式会社 基板熱処理装置
US8003919B2 (en) * 2005-12-06 2011-08-23 Dainippon Screen Mfg. Co., Ltd. Substrate heat treatment apparatus
JP4707593B2 (ja) * 2006-03-23 2011-06-22 大日本スクリーン製造株式会社 熱処理装置と基板吸着方法
JP5504793B2 (ja) * 2009-09-26 2014-05-28 東京エレクトロン株式会社 熱処理装置及び冷却方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005117007A (ja) 2003-09-19 2005-04-28 Dainippon Screen Mfg Co Ltd 基板処理ユニット、基板載置状態検出方法および基板処理装置
JP2011243834A (ja) 2010-05-20 2011-12-01 Tokyo Electron Ltd プラズマ処理装置，基板保持機構，基板位置ずれ検出方法
JP2018157000A (ja) 2017-03-16 2018-10-04 株式会社日本製鋼所 レーザ照射装置、レーザ照射方法、及び半導体装置の製造方法

Also Published As

Publication number Publication date
JP2020145215A (ja) 2020-09-10
TWI794585B (zh) 2023-03-01
TW202040695A (zh) 2020-11-01
WO2020179283A1 (ja) 2020-09-10

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