JP7244712B2 - パッケージ - Google Patents

パッケージ Download PDF

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Publication number
JP7244712B2
JP7244712B2 JP2023505749A JP2023505749A JP7244712B2 JP 7244712 B2 JP7244712 B2 JP 7244712B2 JP 2023505749 A JP2023505749 A JP 2023505749A JP 2023505749 A JP2023505749 A JP 2023505749A JP 7244712 B2 JP7244712 B2 JP 7244712B2
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JP
Japan
Prior art keywords
frame
via electrode
package
electrode
diameter
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2023505749A
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English (en)
Japanese (ja)
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JPWO2022196097A5 (https=
JPWO2022196097A1 (https=
Inventor
孝友 緒方
太伸 阪
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NGK Insulators Ltd
NGK Electronics Devices Inc
Original Assignee
NGK Insulators Ltd
NGK Electronics Devices Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NGK Insulators Ltd, NGK Electronics Devices Inc filed Critical NGK Insulators Ltd
Publication of JPWO2022196097A1 publication Critical patent/JPWO2022196097A1/ja
Priority to JP2023036199A priority Critical patent/JP2023060888A/ja
Publication of JPWO2022196097A5 publication Critical patent/JPWO2022196097A5/ja
Application granted granted Critical
Publication of JP7244712B2 publication Critical patent/JP7244712B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/17—Containers or parts thereof characterised by their materials
    • H10W76/18—Insulating materials, e.g. resins, glasses or ceramics

Landscapes

  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
  • Control And Other Processes For Unpacking Of Materials (AREA)
JP2023505749A 2021-03-19 2022-01-21 パッケージ Active JP7244712B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2023036199A JP2023060888A (ja) 2021-03-19 2023-03-09 パッケージ

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021045808 2021-03-19
JP2021045808 2021-03-19
PCT/JP2022/002211 WO2022196097A1 (ja) 2021-03-19 2022-01-21 パッケージ

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2023036199A Division JP2023060888A (ja) 2021-03-19 2023-03-09 パッケージ

Publications (3)

Publication Number Publication Date
JPWO2022196097A1 JPWO2022196097A1 (https=) 2022-09-22
JPWO2022196097A5 JPWO2022196097A5 (https=) 2023-03-15
JP7244712B2 true JP7244712B2 (ja) 2023-03-22

Family

ID=83320238

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2023505749A Active JP7244712B2 (ja) 2021-03-19 2022-01-21 パッケージ
JP2023036199A Pending JP2023060888A (ja) 2021-03-19 2023-03-09 パッケージ

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2023036199A Pending JP2023060888A (ja) 2021-03-19 2023-03-09 パッケージ

Country Status (4)

Country Link
JP (2) JP7244712B2 (https=)
CN (1) CN116250078B (https=)
TW (2) TWI799161B (https=)
WO (1) WO2022196097A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI863479B (zh) * 2022-08-09 2024-11-21 日商Ｎｇｋ電子器件股份有限公司 封裝體

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002064354A (ja) 2000-08-18 2002-02-28 Daishinku Corp 表面実装型圧電振動子用パッケージおよび表面実装型圧電振動子用パッケージの製造方法
JP2003218660A (ja) 2002-01-24 2003-07-31 Kyocera Corp 圧電振動子収納用パッケージ
JP2013004693A (ja) 2011-06-15 2013-01-07 Daishinku Corp 電子部品用パッケージおよび圧電振動デバイス
JP2019192825A (ja) 2018-04-26 2019-10-31 京セラ株式会社 電子部品収納用パッケージ、電子装置、および電子モジュール
WO2020208999A1 (ja) 2019-04-12 2020-10-15 Ｎｇｋエレクトロデバイス株式会社 電子部品収納用パッケージ

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2920854B2 (ja) * 1991-08-01 1999-07-19 富士通株式会社 ビィアホール構造及びその形成方法
JP3426741B2 (ja) * 1994-10-27 2003-07-14 京セラ株式会社 半導体素子収納用パッケージ
JP2003110037A (ja) * 2001-09-27 2003-04-11 Kyocera Corp 電子部品収納用パッケージ
US20040021219A1 (en) * 2002-08-01 2004-02-05 James Studebaker Method of mounting integrated circuit die in a package using a solder preform having isolatable portions
JP4167614B2 (ja) * 2003-09-24 2008-10-15 株式会社住友金属エレクトロデバイス 電子部品収納用パッケージ
US7075775B2 (en) * 2004-05-27 2006-07-11 Kyocera Corporation Chip-type electronic component
JP4546990B2 (ja) * 2007-06-21 2010-09-22 日本特殊陶業株式会社 セラミックパッケージ及びその製造方法
DE102008007001B4 (de) * 2008-01-31 2016-09-22 Globalfoundries Dresden Module One Limited Liability Company & Co. Kg Vergrößern des Widerstandsverhaltens gegenüber Elektromigration in einer Verbindungsstruktur eines Halbleiterbauelements durch Bilden einer Legierung
US20100013060A1 (en) * 2008-06-22 2010-01-21 Taiwan Semiconductor Manufacturing Company, Ltd. Method of forming a conductive trench in a silicon wafer and silicon wafer comprising such trench
JP5442974B2 (ja) * 2008-09-16 2014-03-19 日本特殊陶業株式会社 セラミック部品の製造方法
JP5987347B2 (ja) * 2012-02-24 2016-09-07 セイコーエプソン株式会社 電子デバイスの製造方法
WO2014115766A1 (ja) * 2013-01-22 2014-07-31 京セラ株式会社 電子素子搭載用パッケージ、電子装置および撮像モジュール
JP6336829B2 (ja) * 2014-06-19 2018-06-06 京セラ株式会社 配線基板、パッケージおよび電子機器
US9711452B2 (en) * 2014-12-05 2017-07-18 International Business Machines Corporation Optimized wires for resistance or electromigration
CN108461450B (zh) * 2015-11-25 2021-06-18 京瓷株式会社 电子部件收纳用封装体、电子装置以及电子模块
JP6834841B2 (ja) * 2017-08-09 2021-02-24 三菱電機株式会社 半導体装置
JP7102256B2 (ja) * 2018-06-27 2022-07-19 株式会社村田製作所 積層セラミック電子部品

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002064354A (ja) 2000-08-18 2002-02-28 Daishinku Corp 表面実装型圧電振動子用パッケージおよび表面実装型圧電振動子用パッケージの製造方法
JP2003218660A (ja) 2002-01-24 2003-07-31 Kyocera Corp 圧電振動子収納用パッケージ
JP2013004693A (ja) 2011-06-15 2013-01-07 Daishinku Corp 電子部品用パッケージおよび圧電振動デバイス
JP2019192825A (ja) 2018-04-26 2019-10-31 京セラ株式会社 電子部品収納用パッケージ、電子装置、および電子モジュール
WO2020208999A1 (ja) 2019-04-12 2020-10-15 Ｎｇｋエレクトロデバイス株式会社 電子部品収納用パッケージ

Also Published As

Publication number Publication date
TWI894536B (zh) 2025-08-21
WO2022196097A1 (ja) 2022-09-22
JP2023060888A (ja) 2023-04-28
TW202240797A (zh) 2022-10-16
TWI799161B (zh) 2023-04-11
CN116250078A (zh) 2023-06-09
JPWO2022196097A1 (https=) 2022-09-22
TW202329339A (zh) 2023-07-16
CN116250078B (zh) 2023-10-24

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