JPWO2022196097A1 - - Google Patents

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Publication number
JPWO2022196097A1
JPWO2022196097A1 JP2023505749A JP2023505749A JPWO2022196097A1 JP WO2022196097 A1 JPWO2022196097 A1 JP WO2022196097A1 JP 2023505749 A JP2023505749 A JP 2023505749A JP 2023505749 A JP2023505749 A JP 2023505749A JP WO2022196097 A1 JPWO2022196097 A1 JP WO2022196097A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2023505749A
Other languages
Japanese (ja)
Other versions
JP7244712B2 (ja
JPWO2022196097A5 (https=
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2022196097A1 publication Critical patent/JPWO2022196097A1/ja
Priority to JP2023036199A priority Critical patent/JP2023060888A/ja
Publication of JPWO2022196097A5 publication Critical patent/JPWO2022196097A5/ja
Application granted granted Critical
Publication of JP7244712B2 publication Critical patent/JP7244712B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/17—Containers or parts thereof characterised by their materials
    • H10W76/18—Insulating materials, e.g. resins, glasses or ceramics
JP2023505749A 2021-03-19 2022-01-21 パッケージ Active JP7244712B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2023036199A JP2023060888A (ja) 2021-03-19 2023-03-09 パッケージ

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021045808 2021-03-19
JP2021045808 2021-03-19
PCT/JP2022/002211 WO2022196097A1 (ja) 2021-03-19 2022-01-21 パッケージ

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2023036199A Division JP2023060888A (ja) 2021-03-19 2023-03-09 パッケージ

Publications (3)

Publication Number Publication Date
JPWO2022196097A1 true JPWO2022196097A1 (https=) 2022-09-22
JPWO2022196097A5 JPWO2022196097A5 (https=) 2023-03-15
JP7244712B2 JP7244712B2 (ja) 2023-03-22

Family

ID=83320238

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2023505749A Active JP7244712B2 (ja) 2021-03-19 2022-01-21 パッケージ
JP2023036199A Pending JP2023060888A (ja) 2021-03-19 2023-03-09 パッケージ

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2023036199A Pending JP2023060888A (ja) 2021-03-19 2023-03-09 パッケージ

Country Status (4)

Country Link
JP (2) JP7244712B2 (https=)
CN (1) CN116250078B (https=)
TW (2) TWI799161B (https=)
WO (1) WO2022196097A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI863479B (zh) * 2022-08-09 2024-11-21 日商Ｎｇｋ電子器件股份有限公司 封裝體

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002064354A (ja) * 2000-08-18 2002-02-28 Daishinku Corp 表面実装型圧電振動子用パッケージおよび表面実装型圧電振動子用パッケージの製造方法
JP2003218660A (ja) * 2002-01-24 2003-07-31 Kyocera Corp 圧電振動子収納用パッケージ
JP2013004693A (ja) * 2011-06-15 2013-01-07 Daishinku Corp 電子部品用パッケージおよび圧電振動デバイス
JP2019192825A (ja) * 2018-04-26 2019-10-31 京セラ株式会社 電子部品収納用パッケージ、電子装置、および電子モジュール
WO2020208999A1 (ja) * 2019-04-12 2020-10-15 Ｎｇｋエレクトロデバイス株式会社 電子部品収納用パッケージ

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2920854B2 (ja) * 1991-08-01 1999-07-19 富士通株式会社 ビィアホール構造及びその形成方法
JP3426741B2 (ja) * 1994-10-27 2003-07-14 京セラ株式会社 半導体素子収納用パッケージ
JP2003110037A (ja) * 2001-09-27 2003-04-11 Kyocera Corp 電子部品収納用パッケージ
US20040021219A1 (en) * 2002-08-01 2004-02-05 James Studebaker Method of mounting integrated circuit die in a package using a solder preform having isolatable portions
JP4167614B2 (ja) * 2003-09-24 2008-10-15 株式会社住友金属エレクトロデバイス 電子部品収納用パッケージ
US7075775B2 (en) * 2004-05-27 2006-07-11 Kyocera Corporation Chip-type electronic component
JP4546990B2 (ja) * 2007-06-21 2010-09-22 日本特殊陶業株式会社 セラミックパッケージ及びその製造方法
DE102008007001B4 (de) * 2008-01-31 2016-09-22 Globalfoundries Dresden Module One Limited Liability Company & Co. Kg Vergrößern des Widerstandsverhaltens gegenüber Elektromigration in einer Verbindungsstruktur eines Halbleiterbauelements durch Bilden einer Legierung
US20100013060A1 (en) * 2008-06-22 2010-01-21 Taiwan Semiconductor Manufacturing Company, Ltd. Method of forming a conductive trench in a silicon wafer and silicon wafer comprising such trench
JP5442974B2 (ja) * 2008-09-16 2014-03-19 日本特殊陶業株式会社 セラミック部品の製造方法
JP5987347B2 (ja) * 2012-02-24 2016-09-07 セイコーエプソン株式会社 電子デバイスの製造方法
WO2014115766A1 (ja) * 2013-01-22 2014-07-31 京セラ株式会社 電子素子搭載用パッケージ、電子装置および撮像モジュール
JP6336829B2 (ja) * 2014-06-19 2018-06-06 京セラ株式会社 配線基板、パッケージおよび電子機器
US9711452B2 (en) * 2014-12-05 2017-07-18 International Business Machines Corporation Optimized wires for resistance or electromigration
CN108461450B (zh) * 2015-11-25 2021-06-18 京瓷株式会社 电子部件收纳用封装体、电子装置以及电子模块
JP6834841B2 (ja) * 2017-08-09 2021-02-24 三菱電機株式会社 半導体装置
JP7102256B2 (ja) * 2018-06-27 2022-07-19 株式会社村田製作所 積層セラミック電子部品

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002064354A (ja) * 2000-08-18 2002-02-28 Daishinku Corp 表面実装型圧電振動子用パッケージおよび表面実装型圧電振動子用パッケージの製造方法
JP2003218660A (ja) * 2002-01-24 2003-07-31 Kyocera Corp 圧電振動子収納用パッケージ
JP2013004693A (ja) * 2011-06-15 2013-01-07 Daishinku Corp 電子部品用パッケージおよび圧電振動デバイス
JP2019192825A (ja) * 2018-04-26 2019-10-31 京セラ株式会社 電子部品収納用パッケージ、電子装置、および電子モジュール
WO2020208999A1 (ja) * 2019-04-12 2020-10-15 Ｎｇｋエレクトロデバイス株式会社 電子部品収納用パッケージ

Also Published As

Publication number Publication date
JP7244712B2 (ja) 2023-03-22
TWI894536B (zh) 2025-08-21
WO2022196097A1 (ja) 2022-09-22
JP2023060888A (ja) 2023-04-28
TW202240797A (zh) 2022-10-16
TWI799161B (zh) 2023-04-11
CN116250078A (zh) 2023-06-09
TW202329339A (zh) 2023-07-16
CN116250078B (zh) 2023-10-24

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