JPWO2022196097A1 - - Google Patents

Info

Publication number
JPWO2022196097A1
JPWO2022196097A1 JP2023505749A JP2023505749A JPWO2022196097A1 JP WO2022196097 A1 JPWO2022196097 A1 JP WO2022196097A1 JP 2023505749 A JP2023505749 A JP 2023505749A JP 2023505749 A JP2023505749 A JP 2023505749A JP WO2022196097 A1 JPWO2022196097 A1 JP WO2022196097A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2023505749A
Other versions
JP7244712B2 (ja
JPWO2022196097A5 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2022196097A1 publication Critical patent/JPWO2022196097A1/ja
Priority to JP2023036199A priority Critical patent/JP2023060888A/ja
Publication of JPWO2022196097A5 publication Critical patent/JPWO2022196097A5/ja
Application granted granted Critical
Publication of JP7244712B2 publication Critical patent/JP7244712B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/06—Containers; Seals characterised by the material of the container or its electrical properties
    • H01L23/08—Containers; Seals characterised by the material of the container or its electrical properties the material being an electrical insulator, e.g. glass

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
  • Control And Other Processes For Unpacking Of Materials (AREA)
JP2023505749A 2021-03-19 2022-01-21 パッケージ Active JP7244712B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2023036199A JP2023060888A (ja) 2021-03-19 2023-03-09 パッケージ

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021045808 2021-03-19
JP2021045808 2021-03-19
PCT/JP2022/002211 WO2022196097A1 (ja) 2021-03-19 2022-01-21 パッケージ

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2023036199A Division JP2023060888A (ja) 2021-03-19 2023-03-09 パッケージ

Publications (3)

Publication Number Publication Date
JPWO2022196097A1 true JPWO2022196097A1 (ja) 2022-09-22
JPWO2022196097A5 JPWO2022196097A5 (ja) 2023-03-15
JP7244712B2 JP7244712B2 (ja) 2023-03-22

Family

ID=83320238

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2023505749A Active JP7244712B2 (ja) 2021-03-19 2022-01-21 パッケージ
JP2023036199A Pending JP2023060888A (ja) 2021-03-19 2023-03-09 パッケージ

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2023036199A Pending JP2023060888A (ja) 2021-03-19 2023-03-09 パッケージ

Country Status (4)

Country Link
JP (2) JP7244712B2 (ja)
CN (1) CN116250078B (ja)
TW (2) TWI799161B (ja)
WO (1) WO2022196097A1 (ja)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002064354A (ja) * 2000-08-18 2002-02-28 Daishinku Corp 表面実装型圧電振動子用パッケージおよび表面実装型圧電振動子用パッケージの製造方法
JP2003218660A (ja) * 2002-01-24 2003-07-31 Kyocera Corp 圧電振動子収納用パッケージ
JP2013004693A (ja) * 2011-06-15 2013-01-07 Daishinku Corp 電子部品用パッケージおよび圧電振動デバイス
JP2019192825A (ja) * 2018-04-26 2019-10-31 京セラ株式会社 電子部品収納用パッケージ、電子装置、および電子モジュール
WO2020208999A1 (ja) * 2019-04-12 2020-10-15 Ｎｇｋエレクトロデバイス株式会社 電子部品収納用パッケージ

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3426741B2 (ja) * 1994-10-27 2003-07-14 京セラ株式会社 半導体素子収納用パッケージ
JP2003110037A (ja) * 2001-09-27 2003-04-11 Kyocera Corp 電子部品収納用パッケージ
US7075775B2 (en) * 2004-05-27 2006-07-11 Kyocera Corporation Chip-type electronic component
WO2014115766A1 (ja) * 2013-01-22 2014-07-31 京セラ株式会社 電子素子搭載用パッケージ、電子装置および撮像モジュール
CN107534022B (zh) * 2015-11-25 2019-03-15 京瓷株式会社 电子部件收纳用封装体、电子装置以及电子模块
JP6834841B2 (ja) * 2017-08-09 2021-02-24 三菱電機株式会社 半導体装置
JP7102256B2 (ja) * 2018-06-27 2022-07-19 株式会社村田製作所 積層セラミック電子部品

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002064354A (ja) * 2000-08-18 2002-02-28 Daishinku Corp 表面実装型圧電振動子用パッケージおよび表面実装型圧電振動子用パッケージの製造方法
JP2003218660A (ja) * 2002-01-24 2003-07-31 Kyocera Corp 圧電振動子収納用パッケージ
JP2013004693A (ja) * 2011-06-15 2013-01-07 Daishinku Corp 電子部品用パッケージおよび圧電振動デバイス
JP2019192825A (ja) * 2018-04-26 2019-10-31 京セラ株式会社 電子部品収納用パッケージ、電子装置、および電子モジュール
WO2020208999A1 (ja) * 2019-04-12 2020-10-15 Ｎｇｋエレクトロデバイス株式会社 電子部品収納用パッケージ

Also Published As

Publication number Publication date
TW202329339A (zh) 2023-07-16
WO2022196097A1 (ja) 2022-09-22
TWI799161B (zh) 2023-04-11
CN116250078A (zh) 2023-06-09
TW202240797A (zh) 2022-10-16
CN116250078B (zh) 2023-10-24
JP7244712B2 (ja) 2023-03-22
JP2023060888A (ja) 2023-04-28

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