JP7243920B2 - 電力変換装置 - Google Patents

電力変換装置 Download PDF

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Publication number
JP7243920B2
JP7243920B2 JP2022508120A JP2022508120A JP7243920B2 JP 7243920 B2 JP7243920 B2 JP 7243920B2 JP 2022508120 A JP2022508120 A JP 2022508120A JP 2022508120 A JP2022508120 A JP 2022508120A JP 7243920 B2 JP7243920 B2 JP 7243920B2
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JP
Japan
Prior art keywords
housing
biasing member
convex
fastening
substrate
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Active
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JP2022508120A
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English (en)
Japanese (ja)
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JPWO2021186935A1 (https=
JPWO2021186935A5 (https=
Inventor
瞬 福地
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fuji Electric Co Ltd
Original Assignee
Fuji Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuji Electric Co Ltd filed Critical Fuji Electric Co Ltd
Publication of JPWO2021186935A1 publication Critical patent/JPWO2021186935A1/ja
Publication of JPWO2021186935A5 publication Critical patent/JPWO2021186935A5/ja
Application granted granted Critical
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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/60—Securing means for detachable heating or cooling arrangements, e.g. clamps
    • H10W40/611—Bolts or screws
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/60—Securing means for detachable heating or cooling arrangements, e.g. clamps
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0212—Printed circuits or mounted components having integral heating means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/20927—Liquid coolant without phase change
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/40—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids
    • H10W40/47—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids by flowing liquids, e.g. forced water cooling
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M7/00—Conversion of AC power input into DC power output; Conversion of DC power input into AC power output
    • H02M7/003—Constructional details, e.g. physical layout, assembly, wiring or busbar connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/60—Securing means for detachable heating or cooling arrangements, e.g. clamps
    • H10W40/641—Snap-on arrangements, e.g. clips

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Inverter Devices (AREA)
JP2022508120A 2020-03-19 2021-02-03 電力変換装置 Active JP7243920B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020049233 2020-03-19
JP2020049233 2020-03-19
PCT/JP2021/003970 WO2021186935A1 (ja) 2020-03-19 2021-02-03 電力変換装置

Publications (3)

Publication Number Publication Date
JPWO2021186935A1 JPWO2021186935A1 (https=) 2021-09-23
JPWO2021186935A5 JPWO2021186935A5 (https=) 2022-05-18
JP7243920B2 true JP7243920B2 (ja) 2023-03-22

Family

ID=77771770

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022508120A Active JP7243920B2 (ja) 2020-03-19 2021-02-03 電力変換装置

Country Status (5)

Country Link
US (1) US11915995B2 (https=)
JP (1) JP7243920B2 (https=)
CN (1) CN114342242A (https=)
DE (1) DE112021000084B4 (https=)
WO (1) WO2021186935A1 (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7433735B2 (ja) * 2021-09-01 2024-02-20 矢崎総業株式会社 電子部品の固定構造、及び車載充電器
DE102023211627B3 (de) * 2023-11-22 2025-05-22 Zf Friedrichshafen Ag Transistoreinheit für einen Stromrichter, Stromrichter und Verfahren zum Herstellen eines Stromrichters
CN118510208A (zh) * 2024-04-01 2024-08-16 华为数字能源技术有限公司 功率设备
CN120980829A (zh) * 2024-05-16 2025-11-18 法雷奥新能源汽车德国有限责任公司 电气装置、电驱动系统和车辆

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000349233A (ja) 1999-06-03 2000-12-15 Tokyo R & D Co Ltd パワー半導体素子の給電及び放熱装置
WO2018055668A1 (ja) 2016-09-20 2018-03-29 三菱電機株式会社 電力変換装置
CN110463370A (zh) 2017-03-20 2019-11-15 Lg伊诺特有限公司 用于功率转换模块的散热装置和包括该装置的功率转换模块

Family Cites Families (21)

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Publication number Priority date Publication date Assignee Title
US4972294A (en) * 1989-04-03 1990-11-20 Motorola, Inc. Heat sink clip assembly
JPH0714695Y2 (ja) 1990-12-21 1995-04-10 石川ガスケット株式会社 副燃焼室付内燃機関用金属積層形ガスケット
US5225965A (en) * 1992-04-24 1993-07-06 Chrysler Corporation Heat sink load spring assembly
DE4218224A1 (de) 1992-06-03 1993-12-09 Asea Brown Boveri Vorrichtung zum Befestigen mindestens eines Bauelementes an einem Träger
US5321582A (en) * 1993-04-26 1994-06-14 Cummins Engine Company, Inc. Electronic component heat sink attachment using a low force spring
US5309979A (en) * 1993-06-08 1994-05-10 Delco Electronics Corp. Self clamping heat sink assembly
JPH0714695U (ja) 1993-07-29 1995-03-10 ミツミ電機株式会社 電子機器等の放熱構造
US6266244B1 (en) * 1999-10-25 2001-07-24 Harman International Industries Incorporated Mounting method and apparatus for electrical components
US6714414B1 (en) * 2003-02-07 2004-03-30 Morningstar Corporation Spring spacer assemblies for maintaining electrical components in contact with thermal transfer surfaces
JP3790225B2 (ja) * 2003-03-25 2006-06-28 東芝キヤリア株式会社 放熱装置
US20050264998A1 (en) * 2004-05-25 2005-12-01 3M Innovative Properties Company Heat sink assembly
WO2006112022A1 (ja) * 2005-04-15 2006-10-26 Fujitsu Limited 折り畳み可能な筐体のロック装置及びそれを有する電子機器
JP4846431B2 (ja) * 2006-04-28 2011-12-28 矢崎総業株式会社 基板用コネクタ
JP4385058B2 (ja) * 2007-05-07 2009-12-16 三菱電機株式会社 電子制御装置
US8897046B2 (en) * 2009-12-25 2014-11-25 Rohm Co., Ltd. DC voltage conversion module, semiconductor module, and method of making semiconductor module
JP5257817B2 (ja) * 2010-06-15 2013-08-07 三菱電機株式会社 半導体装置
JP2013201878A (ja) * 2012-02-24 2013-10-03 Nissan Motor Co Ltd 機電一体型電動機、及び機電一体型電動機の組付け方法
JP6733285B2 (ja) * 2016-04-27 2020-07-29 富士電機株式会社 鉄道車両用電力変換装置
CN108336892B (zh) * 2017-05-25 2021-11-16 泰达电子股份有限公司 电源模块及其组装结构与组装方法
JP6898162B2 (ja) * 2017-06-23 2021-07-07 矢崎総業株式会社 電子部品の固定構造
JP7288363B2 (ja) * 2019-07-10 2023-06-07 ダイヤゼブラ電機株式会社 電子機器および電子制御装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000349233A (ja) 1999-06-03 2000-12-15 Tokyo R & D Co Ltd パワー半導体素子の給電及び放熱装置
WO2018055668A1 (ja) 2016-09-20 2018-03-29 三菱電機株式会社 電力変換装置
CN110463370A (zh) 2017-03-20 2019-11-15 Lg伊诺特有限公司 用于功率转换模块的散热装置和包括该装置的功率转换模块

Also Published As

Publication number Publication date
WO2021186935A1 (ja) 2021-09-23
CN114342242A (zh) 2022-04-12
DE112021000084B4 (de) 2026-03-26
US20220181233A1 (en) 2022-06-09
DE112021000084T5 (de) 2022-04-21
US11915995B2 (en) 2024-02-27
JPWO2021186935A1 (https=) 2021-09-23

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