JPWO2021186935A1 - - Google Patents

Info

Publication number
JPWO2021186935A1
JPWO2021186935A1 JP2022508120A JP2022508120A JPWO2021186935A1 JP WO2021186935 A1 JPWO2021186935 A1 JP WO2021186935A1 JP 2022508120 A JP2022508120 A JP 2022508120A JP 2022508120 A JP2022508120 A JP 2022508120A JP WO2021186935 A1 JPWO2021186935 A1 JP WO2021186935A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2022508120A
Other languages
Japanese (ja)
Other versions
JP7243920B2 (ja
JPWO2021186935A5 (https=
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2021186935A1 publication Critical patent/JPWO2021186935A1/ja
Publication of JPWO2021186935A5 publication Critical patent/JPWO2021186935A5/ja
Application granted granted Critical
Publication of JP7243920B2 publication Critical patent/JP7243920B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/60—Securing means for detachable heating or cooling arrangements, e.g. clamps
    • H10W40/611—Bolts or screws
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/60—Securing means for detachable heating or cooling arrangements, e.g. clamps
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0212—Printed circuits or mounted components having integral heating means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/20927—Liquid coolant without phase change
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/40—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids
    • H10W40/47—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids by flowing liquids, e.g. forced water cooling
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M7/00—Conversion of AC power input into DC power output; Conversion of DC power input into AC power output
    • H02M7/003—Constructional details, e.g. physical layout, assembly, wiring or busbar connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/60—Securing means for detachable heating or cooling arrangements, e.g. clamps
    • H10W40/641—Snap-on arrangements, e.g. clips

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Inverter Devices (AREA)
JP2022508120A 2020-03-19 2021-02-03 電力変換装置 Active JP7243920B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020049233 2020-03-19
JP2020049233 2020-03-19
PCT/JP2021/003970 WO2021186935A1 (ja) 2020-03-19 2021-02-03 電力変換装置

Publications (3)

Publication Number Publication Date
JPWO2021186935A1 true JPWO2021186935A1 (https=) 2021-09-23
JPWO2021186935A5 JPWO2021186935A5 (https=) 2022-05-18
JP7243920B2 JP7243920B2 (ja) 2023-03-22

Family

ID=77771770

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022508120A Active JP7243920B2 (ja) 2020-03-19 2021-02-03 電力変換装置

Country Status (5)

Country Link
US (1) US11915995B2 (https=)
JP (1) JP7243920B2 (https=)
CN (1) CN114342242A (https=)
DE (1) DE112021000084B4 (https=)
WO (1) WO2021186935A1 (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7433735B2 (ja) * 2021-09-01 2024-02-20 矢崎総業株式会社 電子部品の固定構造、及び車載充電器
DE102023211627B3 (de) * 2023-11-22 2025-05-22 Zf Friedrichshafen Ag Transistoreinheit für einen Stromrichter, Stromrichter und Verfahren zum Herstellen eines Stromrichters
CN118510208A (zh) * 2024-04-01 2024-08-16 华为数字能源技术有限公司 功率设备
CN120980829A (zh) * 2024-05-16 2025-11-18 法雷奥新能源汽车德国有限责任公司 电气装置、电驱动系统和车辆

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000349233A (ja) * 1999-06-03 2000-12-15 Tokyo R & D Co Ltd パワー半導体素子の給電及び放熱装置
WO2018055668A1 (ja) * 2016-09-20 2018-03-29 三菱電機株式会社 電力変換装置
CN110463370A (zh) * 2017-03-20 2019-11-15 Lg伊诺特有限公司 用于功率转换模块的散热装置和包括该装置的功率转换模块

Family Cites Families (21)

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Publication number Priority date Publication date Assignee Title
US4972294A (en) * 1989-04-03 1990-11-20 Motorola, Inc. Heat sink clip assembly
JPH0714695Y2 (ja) 1990-12-21 1995-04-10 石川ガスケット株式会社 副燃焼室付内燃機関用金属積層形ガスケット
US5225965A (en) * 1992-04-24 1993-07-06 Chrysler Corporation Heat sink load spring assembly
DE4218224A1 (de) 1992-06-03 1993-12-09 Asea Brown Boveri Vorrichtung zum Befestigen mindestens eines Bauelementes an einem Träger
US5321582A (en) * 1993-04-26 1994-06-14 Cummins Engine Company, Inc. Electronic component heat sink attachment using a low force spring
US5309979A (en) * 1993-06-08 1994-05-10 Delco Electronics Corp. Self clamping heat sink assembly
JPH0714695U (ja) 1993-07-29 1995-03-10 ミツミ電機株式会社 電子機器等の放熱構造
US6266244B1 (en) * 1999-10-25 2001-07-24 Harman International Industries Incorporated Mounting method and apparatus for electrical components
US6714414B1 (en) * 2003-02-07 2004-03-30 Morningstar Corporation Spring spacer assemblies for maintaining electrical components in contact with thermal transfer surfaces
JP3790225B2 (ja) * 2003-03-25 2006-06-28 東芝キヤリア株式会社 放熱装置
US20050264998A1 (en) * 2004-05-25 2005-12-01 3M Innovative Properties Company Heat sink assembly
WO2006112022A1 (ja) * 2005-04-15 2006-10-26 Fujitsu Limited 折り畳み可能な筐体のロック装置及びそれを有する電子機器
JP4846431B2 (ja) * 2006-04-28 2011-12-28 矢崎総業株式会社 基板用コネクタ
JP4385058B2 (ja) * 2007-05-07 2009-12-16 三菱電機株式会社 電子制御装置
US8897046B2 (en) * 2009-12-25 2014-11-25 Rohm Co., Ltd. DC voltage conversion module, semiconductor module, and method of making semiconductor module
JP5257817B2 (ja) * 2010-06-15 2013-08-07 三菱電機株式会社 半導体装置
JP2013201878A (ja) * 2012-02-24 2013-10-03 Nissan Motor Co Ltd 機電一体型電動機、及び機電一体型電動機の組付け方法
JP6733285B2 (ja) * 2016-04-27 2020-07-29 富士電機株式会社 鉄道車両用電力変換装置
CN108336892B (zh) * 2017-05-25 2021-11-16 泰达电子股份有限公司 电源模块及其组装结构与组装方法
JP6898162B2 (ja) * 2017-06-23 2021-07-07 矢崎総業株式会社 電子部品の固定構造
JP7288363B2 (ja) * 2019-07-10 2023-06-07 ダイヤゼブラ電機株式会社 電子機器および電子制御装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000349233A (ja) * 1999-06-03 2000-12-15 Tokyo R & D Co Ltd パワー半導体素子の給電及び放熱装置
WO2018055668A1 (ja) * 2016-09-20 2018-03-29 三菱電機株式会社 電力変換装置
CN110463370A (zh) * 2017-03-20 2019-11-15 Lg伊诺特有限公司 用于功率转换模块的散热装置和包括该装置的功率转换模块

Also Published As

Publication number Publication date
WO2021186935A1 (ja) 2021-09-23
CN114342242A (zh) 2022-04-12
DE112021000084B4 (de) 2026-03-26
US20220181233A1 (en) 2022-06-09
DE112021000084T5 (de) 2022-04-21
US11915995B2 (en) 2024-02-27
JP7243920B2 (ja) 2023-03-22

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