JP7238791B2 - 封止組成物及び半導体装置 - Google Patents

封止組成物及び半導体装置 Download PDF

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Publication number
JP7238791B2
JP7238791B2 JP2019562046A JP2019562046A JP7238791B2 JP 7238791 B2 JP7238791 B2 JP 7238791B2 JP 2019562046 A JP2019562046 A JP 2019562046A JP 2019562046 A JP2019562046 A JP 2019562046A JP 7238791 B2 JP7238791 B2 JP 7238791B2
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JP
Japan
Prior art keywords
inorganic filler
particle size
mass
alumina
sealing composition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2019562046A
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English (en)
Japanese (ja)
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JPWO2019131669A1 (ja
Inventor
健太 石橋
格 山浦
拓也 児玉
実佳 田中
慧地 堀
東哲 姜
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Hitachi Chemical Co Ltd
Showa Denko Materials Co Ltd
Resonac Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd, Showa Denko Materials Co Ltd, Resonac Corp filed Critical Hitachi Chemical Co Ltd
Publication of JPWO2019131669A1 publication Critical patent/JPWO2019131669A1/ja
Priority to JP2023032122A priority Critical patent/JP7571810B2/ja
Application granted granted Critical
Publication of JP7238791B2 publication Critical patent/JP7238791B2/ja
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2227—Oxides; Hydroxides of metals of aluminium
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/005—Additives being defined by their particle size in general

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
JP2019562046A 2017-12-28 2018-12-25 封止組成物及び半導体装置 Active JP7238791B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2023032122A JP7571810B2 (ja) 2017-12-28 2023-03-02 封止組成物及び半導体装置

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2017254883 2017-12-28
JP2017254883 2017-12-28
PCT/JP2018/047642 WO2019131669A1 (ja) 2017-12-28 2018-12-25 封止組成物及び半導体装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2023032122A Division JP7571810B2 (ja) 2017-12-28 2023-03-02 封止組成物及び半導体装置

Publications (2)

Publication Number Publication Date
JPWO2019131669A1 JPWO2019131669A1 (ja) 2020-12-24
JP7238791B2 true JP7238791B2 (ja) 2023-03-14

Family

ID=67067545

Family Applications (2)

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JP2019562046A Active JP7238791B2 (ja) 2017-12-28 2018-12-25 封止組成物及び半導体装置
JP2023032122A Active JP7571810B2 (ja) 2017-12-28 2023-03-02 封止組成物及び半導体装置

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JP2023032122A Active JP7571810B2 (ja) 2017-12-28 2023-03-02 封止組成物及び半導体装置

Country Status (5)

Country Link
JP (2) JP7238791B2 (https=)
KR (2) KR102815688B1 (https=)
CN (1) CN111566163B (https=)
TW (1) TWI797222B (https=)
WO (1) WO2019131669A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2023067951A (ja) * 2017-12-28 2023-05-16 株式会社レゾナック 封止組成物及び半導体装置

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20230164858A (ko) 2022-05-26 2023-12-05 동우 화인켐 주식회사 반도체 소자 밀봉용 조성물 및 이를 이용하여 밀봉된 반도체 소자

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005290076A (ja) 2004-03-31 2005-10-20 Sumitomo Bakelite Co Ltd エポキシ樹脂組成物及び半導体装置
JP2010024464A (ja) 2009-11-04 2010-02-04 Sumitomo Bakelite Co Ltd エポキシ樹脂組成物及び半導体装置
JP2014122364A (ja) 2014-03-20 2014-07-03 Sumitomo Bakelite Co Ltd エポキシ樹脂組成物、このエポキシ樹脂組成物が使用された半導体装置、有機修飾無機充填材、エポキシ樹脂組成物の製造方法
JP2015205796A (ja) 2014-04-21 2015-11-19 新日鉄住金マテリアルズ株式会社 球状粒子及びその製造方法、並びにそれを含有する樹脂組成物

Family Cites Families (15)

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Publication number Priority date Publication date Assignee Title
JP2874089B2 (ja) * 1994-04-13 1999-03-24 信越化学工業株式会社 半導体封止用樹脂組成物及び半導体装置
JP4112396B2 (ja) 2003-02-13 2008-07-02 電気化学工業株式会社 樹脂用充填材および用途
JP4774778B2 (ja) 2005-03-28 2011-09-14 住友ベークライト株式会社 半導体封止用エポキシ樹脂組成物及び半導体装置
WO2008044579A1 (fr) * 2006-10-06 2008-04-17 Sumitomo Bakelite Company Limited composition de résine époxy pour le scellement d'un semi-conducteur, et dispositif semi-conducteur
JP4973322B2 (ja) 2007-06-04 2012-07-11 住友ベークライト株式会社 エポキシ樹脂組成物及び半導体装置
KR101505237B1 (ko) * 2008-04-30 2015-03-23 덴키 가가쿠 고교 가부시기가이샤 알루미나 분말, 그의 제조 방법 및 그것을 사용한 수지 조성물
CN102382422B (zh) * 2010-09-01 2013-01-02 北京科化新材料科技有限公司 包含一水合氧化铝的环氧树脂组合物
JP6282390B2 (ja) * 2010-12-16 2018-02-21 日立化成株式会社 封止用エポキシ樹脂成形材料及びこれを用いた半導体装置
JP2013028659A (ja) * 2011-07-26 2013-02-07 Hitachi Chemical Co Ltd アンダーフィル用エポキシ樹脂液状封止材及びこれを用いた電子部品装置
SG11201405097QA (en) * 2012-03-29 2014-10-30 Sumitomo Bakelite Co Resin composition and semiconductor device
JP2014031460A (ja) * 2012-08-06 2014-02-20 Panasonic Corp 封止用エポキシ樹脂組成物及びそれを用いた半導体装置
WO2014208694A1 (ja) 2013-06-27 2014-12-31 日立化成株式会社 樹脂組成物、樹脂シート、樹脂シート硬化物、樹脂シート構造体、樹脂シート構造体硬化物、樹脂シート構造体硬化物の製造方法、半導体装置、及びｌｅｄ装置
US9711378B2 (en) * 2014-01-08 2017-07-18 Shin-Etsu Chemical Co., Ltd. Liquid epoxy resin composition for semiconductor sealing and resin-sealed semiconductor device
WO2017122952A1 (ko) * 2016-01-13 2017-07-20 주식회사 엘지화학 반도체 패키지용 열경화성 수지 조성물과 이를 이용한 프리프레그
WO2019131669A1 (ja) 2017-12-28 2019-07-04 日立化成株式会社 封止組成物及び半導体装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005290076A (ja) 2004-03-31 2005-10-20 Sumitomo Bakelite Co Ltd エポキシ樹脂組成物及び半導体装置
JP2010024464A (ja) 2009-11-04 2010-02-04 Sumitomo Bakelite Co Ltd エポキシ樹脂組成物及び半導体装置
JP2014122364A (ja) 2014-03-20 2014-07-03 Sumitomo Bakelite Co Ltd エポキシ樹脂組成物、このエポキシ樹脂組成物が使用された半導体装置、有機修飾無機充填材、エポキシ樹脂組成物の製造方法
JP2015205796A (ja) 2014-04-21 2015-11-19 新日鉄住金マテリアルズ株式会社 球状粒子及びその製造方法、並びにそれを含有する樹脂組成物

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2023067951A (ja) * 2017-12-28 2023-05-16 株式会社レゾナック 封止組成物及び半導体装置
JP7571810B2 (ja) 2017-12-28 2024-10-23 株式会社レゾナック 封止組成物及び半導体装置

Also Published As

Publication number Publication date
JPWO2019131669A1 (ja) 2020-12-24
KR20200103682A (ko) 2020-09-02
TWI797222B (zh) 2023-04-01
WO2019131669A1 (ja) 2019-07-04
KR20250016469A (ko) 2025-02-03
KR102815688B1 (ko) 2025-06-04
TW201934650A (zh) 2019-09-01
JP7571810B2 (ja) 2024-10-23
CN111566163B (zh) 2024-02-13
CN111566163A (zh) 2020-08-21
JP2023067951A (ja) 2023-05-16

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