CN111566163B - 密封组合物和半导体装置 - Google Patents

密封组合物和半导体装置 Download PDF

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Publication number
CN111566163B
CN111566163B CN201880084098.XA CN201880084098A CN111566163B CN 111566163 B CN111566163 B CN 111566163B CN 201880084098 A CN201880084098 A CN 201880084098A CN 111566163 B CN111566163 B CN 111566163B
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China
Prior art keywords
inorganic filler
sealing composition
particle size
filler material
alumina
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CN201880084098.XA
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English (en)
Chinese (zh)
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CN111566163A (zh
Inventor
石桥健太
山浦格
儿玉拓也
田中实佳
堀慧地
姜东哲
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Resonac Corp
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Resonac Corp
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2227—Oxides; Hydroxides of metals of aluminium
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/005—Additives being defined by their particle size in general

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
CN201880084098.XA 2017-12-28 2018-12-25 密封组合物和半导体装置 Active CN111566163B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2017254883 2017-12-28
JP2017-254883 2017-12-28
PCT/JP2018/047642 WO2019131669A1 (ja) 2017-12-28 2018-12-25 封止組成物及び半導体装置

Publications (2)

Publication Number Publication Date
CN111566163A CN111566163A (zh) 2020-08-21
CN111566163B true CN111566163B (zh) 2024-02-13

Family

ID=67067545

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201880084098.XA Active CN111566163B (zh) 2017-12-28 2018-12-25 密封组合物和半导体装置

Country Status (5)

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JP (2) JP7238791B2 (https=)
KR (2) KR102815688B1 (https=)
CN (1) CN111566163B (https=)
TW (1) TWI797222B (https=)
WO (1) WO2019131669A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019131669A1 (ja) * 2017-12-28 2019-07-04 日立化成株式会社 封止組成物及び半導体装置
KR20230164858A (ko) 2022-05-26 2023-12-05 동우 화인켐 주식회사 반도체 소자 밀봉용 조성물 및 이를 이용하여 밀봉된 반도체 소자

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07278415A (ja) * 1994-04-13 1995-10-24 Shin Etsu Chem Co Ltd 半導体封止用樹脂組成物及び半導体装置
JP2005290076A (ja) * 2004-03-31 2005-10-20 Sumitomo Bakelite Co Ltd エポキシ樹脂組成物及び半導体装置
CN101522793A (zh) * 2006-10-06 2009-09-02 住友电木株式会社 半导体密封用环氧树脂组合物及半导体装置
JP2012140612A (ja) * 2010-12-16 2012-07-26 Hitachi Chemical Co Ltd 封止用エポキシ樹脂成形材料及びこれを用いた半導体装置
JP2013028659A (ja) * 2011-07-26 2013-02-07 Hitachi Chemical Co Ltd アンダーフィル用エポキシ樹脂液状封止材及びこれを用いた電子部品装置
JP2014031460A (ja) * 2012-08-06 2014-02-20 Panasonic Corp 封止用エポキシ樹脂組成物及びそれを用いた半導体装置
CN104221140A (zh) * 2012-03-29 2014-12-17 住友电木株式会社 树脂组合物和半导体装置
JP2015205796A (ja) * 2014-04-21 2015-11-19 新日鉄住金マテリアルズ株式会社 球状粒子及びその製造方法、並びにそれを含有する樹脂組成物
CN105899569A (zh) * 2014-01-08 2016-08-24 信越化学工业株式会社 半导体密封用液体环氧树脂组合物和树脂密封半导体装置

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4112396B2 (ja) 2003-02-13 2008-07-02 電気化学工業株式会社 樹脂用充填材および用途
JP4774778B2 (ja) 2005-03-28 2011-09-14 住友ベークライト株式会社 半導体封止用エポキシ樹脂組成物及び半導体装置
JP4973322B2 (ja) 2007-06-04 2012-07-11 住友ベークライト株式会社 エポキシ樹脂組成物及び半導体装置
KR101505237B1 (ko) * 2008-04-30 2015-03-23 덴키 가가쿠 고교 가부시기가이샤 알루미나 분말, 그의 제조 방법 및 그것을 사용한 수지 조성물
JP5407767B2 (ja) * 2009-11-04 2014-02-05 住友ベークライト株式会社 エポキシ樹脂組成物及び半導体装置
CN102382422B (zh) * 2010-09-01 2013-01-02 北京科化新材料科技有限公司 包含一水合氧化铝的环氧树脂组合物
WO2014208694A1 (ja) 2013-06-27 2014-12-31 日立化成株式会社 樹脂組成物、樹脂シート、樹脂シート硬化物、樹脂シート構造体、樹脂シート構造体硬化物、樹脂シート構造体硬化物の製造方法、半導体装置、及びｌｅｄ装置
JP5905917B2 (ja) * 2014-03-20 2016-04-20 住友ベークライト株式会社 表面処理粒子の製造方法
WO2017122952A1 (ko) * 2016-01-13 2017-07-20 주식회사 엘지화학 반도체 패키지용 열경화성 수지 조성물과 이를 이용한 프리프레그
WO2019131669A1 (ja) 2017-12-28 2019-07-04 日立化成株式会社 封止組成物及び半導体装置

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07278415A (ja) * 1994-04-13 1995-10-24 Shin Etsu Chem Co Ltd 半導体封止用樹脂組成物及び半導体装置
JP2005290076A (ja) * 2004-03-31 2005-10-20 Sumitomo Bakelite Co Ltd エポキシ樹脂組成物及び半導体装置
CN101522793A (zh) * 2006-10-06 2009-09-02 住友电木株式会社 半导体密封用环氧树脂组合物及半导体装置
JP2012140612A (ja) * 2010-12-16 2012-07-26 Hitachi Chemical Co Ltd 封止用エポキシ樹脂成形材料及びこれを用いた半導体装置
JP2013028659A (ja) * 2011-07-26 2013-02-07 Hitachi Chemical Co Ltd アンダーフィル用エポキシ樹脂液状封止材及びこれを用いた電子部品装置
CN104221140A (zh) * 2012-03-29 2014-12-17 住友电木株式会社 树脂组合物和半导体装置
JP2014031460A (ja) * 2012-08-06 2014-02-20 Panasonic Corp 封止用エポキシ樹脂組成物及びそれを用いた半導体装置
CN105899569A (zh) * 2014-01-08 2016-08-24 信越化学工业株式会社 半导体密封用液体环氧树脂组合物和树脂密封半导体装置
JP2015205796A (ja) * 2014-04-21 2015-11-19 新日鉄住金マテリアルズ株式会社 球状粒子及びその製造方法、並びにそれを含有する樹脂組成物

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
电子封装用Al_2O_3改性环氧树脂及其性能;刘长岭;杨宁;张泽宇;;应用化学;第30卷(第12期);第1417-1422页 *

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Publication number Publication date
JPWO2019131669A1 (ja) 2020-12-24
KR20200103682A (ko) 2020-09-02
JP7238791B2 (ja) 2023-03-14
TWI797222B (zh) 2023-04-01
WO2019131669A1 (ja) 2019-07-04
KR20250016469A (ko) 2025-02-03
KR102815688B1 (ko) 2025-06-04
TW201934650A (zh) 2019-09-01
JP7571810B2 (ja) 2024-10-23
CN111566163A (zh) 2020-08-21
JP2023067951A (ja) 2023-05-16

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