TWI797222B - 密封組成物及半導體裝置 - Google Patents

密封組成物及半導體裝置 Download PDF

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Publication number
TWI797222B
TWI797222B TW107147230A TW107147230A TWI797222B TW I797222 B TWI797222 B TW I797222B TW 107147230 A TW107147230 A TW 107147230A TW 107147230 A TW107147230 A TW 107147230A TW I797222 B TWI797222 B TW I797222B
Authority
TW
Taiwan
Prior art keywords
inorganic filler
particle size
sealing composition
mass
alumina
Prior art date
Application number
TW107147230A
Other languages
English (en)
Chinese (zh)
Other versions
TW201934650A (zh
Inventor
石橋健太
山浦格
児玉拓也
田中実佳
堀慧地
姜東哲
Original Assignee
日商日立化成股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商日立化成股份有限公司 filed Critical 日商日立化成股份有限公司
Publication of TW201934650A publication Critical patent/TW201934650A/zh
Application granted granted Critical
Publication of TWI797222B publication Critical patent/TWI797222B/zh

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2227—Oxides; Hydroxides of metals of aluminium
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/005—Additives being defined by their particle size in general

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
TW107147230A 2017-12-28 2018-12-26 密封組成物及半導體裝置 TWI797222B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017254883 2017-12-28
JP2017-254883 2017-12-28

Publications (2)

Publication Number Publication Date
TW201934650A TW201934650A (zh) 2019-09-01
TWI797222B true TWI797222B (zh) 2023-04-01

Family

ID=67067545

Family Applications (1)

Application Number Title Priority Date Filing Date
TW107147230A TWI797222B (zh) 2017-12-28 2018-12-26 密封組成物及半導體裝置

Country Status (5)

Country Link
JP (2) JP7238791B2 (https=)
KR (2) KR102815688B1 (https=)
CN (1) CN111566163B (https=)
TW (1) TWI797222B (https=)
WO (1) WO2019131669A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019131669A1 (ja) * 2017-12-28 2019-07-04 日立化成株式会社 封止組成物及び半導体装置
KR20230164858A (ko) 2022-05-26 2023-12-05 동우 화인켐 주식회사 반도체 소자 밀봉용 조성물 및 이를 이용하여 밀봉된 반도체 소자

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07278415A (ja) * 1994-04-13 1995-10-24 Shin Etsu Chem Co Ltd 半導体封止用樹脂組成物及び半導体装置
JP2005290076A (ja) * 2004-03-31 2005-10-20 Sumitomo Bakelite Co Ltd エポキシ樹脂組成物及び半導体装置
TW200951073A (en) * 2008-04-30 2009-12-16 Denki Kagaku Kogyo Kk Alumina power, its manufacturing method and resin composition using the same
JP2010024464A (ja) * 2009-11-04 2010-02-04 Sumitomo Bakelite Co Ltd エポキシ樹脂組成物及び半導体装置
CN102382422A (zh) * 2010-09-01 2012-03-21 北京科化新材料科技有限公司 包含一水合氧化铝的环氧树脂组合物
JP2015205796A (ja) * 2014-04-21 2015-11-19 新日鉄住金マテリアルズ株式会社 球状粒子及びその製造方法、並びにそれを含有する樹脂組成物
TW201736494A (zh) * 2016-01-13 2017-10-16 Ｌｇ化學股份有限公司 用於半導體封裝的熱固性樹脂組成物和使用其的預浸體

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4112396B2 (ja) 2003-02-13 2008-07-02 電気化学工業株式会社 樹脂用充填材および用途
JP4774778B2 (ja) 2005-03-28 2011-09-14 住友ベークライト株式会社 半導体封止用エポキシ樹脂組成物及び半導体装置
WO2008044579A1 (fr) * 2006-10-06 2008-04-17 Sumitomo Bakelite Company Limited composition de résine époxy pour le scellement d'un semi-conducteur, et dispositif semi-conducteur
JP4973322B2 (ja) 2007-06-04 2012-07-11 住友ベークライト株式会社 エポキシ樹脂組成物及び半導体装置
JP6282390B2 (ja) * 2010-12-16 2018-02-21 日立化成株式会社 封止用エポキシ樹脂成形材料及びこれを用いた半導体装置
JP2013028659A (ja) * 2011-07-26 2013-02-07 Hitachi Chemical Co Ltd アンダーフィル用エポキシ樹脂液状封止材及びこれを用いた電子部品装置
SG11201405097QA (en) * 2012-03-29 2014-10-30 Sumitomo Bakelite Co Resin composition and semiconductor device
JP2014031460A (ja) * 2012-08-06 2014-02-20 Panasonic Corp 封止用エポキシ樹脂組成物及びそれを用いた半導体装置
WO2014208694A1 (ja) 2013-06-27 2014-12-31 日立化成株式会社 樹脂組成物、樹脂シート、樹脂シート硬化物、樹脂シート構造体、樹脂シート構造体硬化物、樹脂シート構造体硬化物の製造方法、半導体装置、及びｌｅｄ装置
US9711378B2 (en) * 2014-01-08 2017-07-18 Shin-Etsu Chemical Co., Ltd. Liquid epoxy resin composition for semiconductor sealing and resin-sealed semiconductor device
JP5905917B2 (ja) * 2014-03-20 2016-04-20 住友ベークライト株式会社 表面処理粒子の製造方法
WO2019131669A1 (ja) 2017-12-28 2019-07-04 日立化成株式会社 封止組成物及び半導体装置

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07278415A (ja) * 1994-04-13 1995-10-24 Shin Etsu Chem Co Ltd 半導体封止用樹脂組成物及び半導体装置
JP2005290076A (ja) * 2004-03-31 2005-10-20 Sumitomo Bakelite Co Ltd エポキシ樹脂組成物及び半導体装置
TW200951073A (en) * 2008-04-30 2009-12-16 Denki Kagaku Kogyo Kk Alumina power, its manufacturing method and resin composition using the same
JP2010024464A (ja) * 2009-11-04 2010-02-04 Sumitomo Bakelite Co Ltd エポキシ樹脂組成物及び半導体装置
CN102382422A (zh) * 2010-09-01 2012-03-21 北京科化新材料科技有限公司 包含一水合氧化铝的环氧树脂组合物
JP2015205796A (ja) * 2014-04-21 2015-11-19 新日鉄住金マテリアルズ株式会社 球状粒子及びその製造方法、並びにそれを含有する樹脂組成物
TW201736494A (zh) * 2016-01-13 2017-10-16 Ｌｇ化學股份有限公司 用於半導體封裝的熱固性樹脂組成物和使用其的預浸體

Also Published As

Publication number Publication date
JPWO2019131669A1 (ja) 2020-12-24
KR20200103682A (ko) 2020-09-02
JP7238791B2 (ja) 2023-03-14
WO2019131669A1 (ja) 2019-07-04
KR20250016469A (ko) 2025-02-03
KR102815688B1 (ko) 2025-06-04
TW201934650A (zh) 2019-09-01
JP7571810B2 (ja) 2024-10-23
CN111566163B (zh) 2024-02-13
CN111566163A (zh) 2020-08-21
JP2023067951A (ja) 2023-05-16

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