JP7222666B2 - 多層基板 - Google Patents

多層基板 Download PDF

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Publication number
JP7222666B2
JP7222666B2 JP2018214108A JP2018214108A JP7222666B2 JP 7222666 B2 JP7222666 B2 JP 7222666B2 JP 2018214108 A JP2018214108 A JP 2018214108A JP 2018214108 A JP2018214108 A JP 2018214108A JP 7222666 B2 JP7222666 B2 JP 7222666B2
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JP
Japan
Prior art keywords
conductive layer
layer
multilayer substrate
brittle material
glass
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2018214108A
Other languages
English (en)
Japanese (ja)
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JP2020087938A5 (https=
JP2020087938A (ja
Inventor
俊樹 岩井
泰治 酒井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
FICT Ltd
Original Assignee
FICT Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by FICT Ltd filed Critical FICT Ltd
Priority to JP2018214108A priority Critical patent/JP7222666B2/ja
Priority to US16/662,440 priority patent/US11152291B2/en
Publication of JP2020087938A publication Critical patent/JP2020087938A/ja
Publication of JP2020087938A5 publication Critical patent/JP2020087938A5/ja
Application granted granted Critical
Publication of JP7222666B2 publication Critical patent/JP7222666B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/685—Shapes or dispositions thereof comprising multiple insulating layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
    • H05K3/426—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in substrates without metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
    • H05K3/4629—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating inorganic sheets comprising printed circuits, e.g. green ceramic sheets
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/63—Vias, e.g. via plugs
    • H10W70/635—Through-vias
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/69—Insulating materials thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/69—Insulating materials thereof
    • H10W70/692—Ceramics or glasses
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
    • H05K3/4061—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in inorganic insulating substrates

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Laminated Bodies (AREA)
JP2018214108A 2018-11-14 2018-11-14 多層基板 Active JP7222666B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2018214108A JP7222666B2 (ja) 2018-11-14 2018-11-14 多層基板
US16/662,440 US11152291B2 (en) 2018-11-14 2019-10-24 Multilayer substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2018214108A JP7222666B2 (ja) 2018-11-14 2018-11-14 多層基板

Publications (3)

Publication Number Publication Date
JP2020087938A JP2020087938A (ja) 2020-06-04
JP2020087938A5 JP2020087938A5 (https=) 2021-04-30
JP7222666B2 true JP7222666B2 (ja) 2023-02-15

Family

ID=70550829

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2018214108A Active JP7222666B2 (ja) 2018-11-14 2018-11-14 多層基板

Country Status (2)

Country Link
US (1) US11152291B2 (https=)
JP (1) JP7222666B2 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12080632B2 (en) * 2021-09-29 2024-09-03 Advanced Micro Devices, Inc. Glass core package substrates
US20230207406A1 (en) * 2021-12-24 2023-06-29 Intel Corporation Ultra low loss and high-density routing between cores
US20250254790A1 (en) * 2022-03-30 2025-08-07 Sony Semiconductor Solutions Corporation Glass circuit board and manufacturing method thereof and imaging device

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001267746A (ja) 2000-03-17 2001-09-28 Hitachi Ltd 多層配線基板
JP2015012013A (ja) 2013-06-26 2015-01-19 京セラ株式会社 多層配線基板およびそれを備えたプローブカード用基板
JP2017107934A (ja) 2015-12-08 2017-06-15 富士通株式会社 回路基板、電子機器、及び回路基板の製造方法
JP2018148126A (ja) 2017-03-08 2018-09-20 日本特殊陶業株式会社 配線基板、及び配線基板の製造方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6216598A (ja) * 1985-07-15 1987-01-24 富士通株式会社 多層セラミツク回路基板の接続ピン形成方法
JPH02142198A (ja) * 1988-11-22 1990-05-31 Matsushita Electric Works Ltd セラミック多層配線板の製造方法
WO2011125546A1 (ja) 2010-03-31 2011-10-13 京セラ株式会社 インターポーザー及びそれを用いた電子装置
JPWO2013042750A1 (ja) 2011-09-22 2015-03-26 日立化成株式会社 積層体、積層板、多層積層板、プリント配線板及び積層板の製造方法
US20130112459A1 (en) 2011-09-22 2013-05-09 Hitachi Chemical Company, Ltd. Laminate body, laminate plate, multilayer laminate plate, printed wiring board, and method for manufacture of laminate plate
US20130180769A1 (en) * 2011-09-22 2013-07-18 Hitachi Chemical Company, Ltd. Laminate body, laminate plate, multilayer laminate plate, printed wiring board, and method for manufacture of laminate plate
JP2019079856A (ja) * 2017-10-20 2019-05-23 トヨタ自動車株式会社 多層基板の製造方法
JP2019140226A (ja) * 2018-02-09 2019-08-22 富士通株式会社 回路基板、回路基板の製造方法及び電子装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001267746A (ja) 2000-03-17 2001-09-28 Hitachi Ltd 多層配線基板
JP2015012013A (ja) 2013-06-26 2015-01-19 京セラ株式会社 多層配線基板およびそれを備えたプローブカード用基板
JP2017107934A (ja) 2015-12-08 2017-06-15 富士通株式会社 回路基板、電子機器、及び回路基板の製造方法
JP2018148126A (ja) 2017-03-08 2018-09-20 日本特殊陶業株式会社 配線基板、及び配線基板の製造方法

Also Published As

Publication number Publication date
US11152291B2 (en) 2021-10-19
JP2020087938A (ja) 2020-06-04
US20200152562A1 (en) 2020-05-14

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