JP7222437B2 - 伸縮性配線基板 - Google Patents

伸縮性配線基板 Download PDF

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Publication number
JP7222437B2
JP7222437B2 JP2021576148A JP2021576148A JP7222437B2 JP 7222437 B2 JP7222437 B2 JP 7222437B2 JP 2021576148 A JP2021576148 A JP 2021576148A JP 2021576148 A JP2021576148 A JP 2021576148A JP 7222437 B2 JP7222437 B2 JP 7222437B2
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JP
Japan
Prior art keywords
stretchable
insulating layer
electrode
low water
base material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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JP2021576148A
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English (en)
Japanese (ja)
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JPWO2021235282A1 (https=
JPWO2021235282A5 (https=
Inventor
勇人 勝
圭佑 西田
健太朗 臼井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
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Murata Manufacturing Co Ltd
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Publication date
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
Publication of JPWO2021235282A1 publication Critical patent/JPWO2021235282A1/ja
Publication of JPWO2021235282A5 publication Critical patent/JPWO2021235282A5/ja
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/0283—Stretchable printed circuits
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B5/00—Measuring for diagnostic purposes; Identification of persons
    • A61B5/24—Detecting, measuring or recording bioelectric or biomagnetic signals of the body or parts thereof
    • A61B5/25—Bioelectric electrodes therefor
    • A61B5/263—Bioelectric electrodes therefor characterised by the electrode materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0254—High voltage adaptations; Electrical insulation details; Overvoltage or electrostatic discharge protection ; Arrangements for regulating voltages or for using plural voltages
    • H05K1/0256—Electrical insulation details, e.g. around high voltage areas
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0133—Elastomeric or compliant polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/07—Electric details
    • H05K2201/0753—Insulation
    • H05K2201/0769—Anti metal-migration, e.g. avoiding tin whisker growth
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1173—Differences in wettability, e.g. hydrophilic or hydrophobic areas

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Heart & Thoracic Surgery (AREA)
  • Surgery (AREA)
  • Pathology (AREA)
  • Biomedical Technology (AREA)
  • Physics & Mathematics (AREA)
  • Medical Informatics (AREA)
  • Molecular Biology (AREA)
  • Biophysics (AREA)
  • Animal Behavior & Ethology (AREA)
  • General Health & Medical Sciences (AREA)
  • Public Health (AREA)
  • Veterinary Medicine (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Structure Of Printed Boards (AREA)
  • Measurement And Recording Of Electrical Phenomena And Electrical Characteristics Of The Living Body (AREA)
JP2021576148A 2020-05-21 2021-05-12 伸縮性配線基板 Active JP7222437B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020088921 2020-05-21
JP2020088921 2020-05-21
PCT/JP2021/017998 WO2021235282A1 (ja) 2020-05-21 2021-05-12 伸縮性配線基板

Publications (3)

Publication Number Publication Date
JPWO2021235282A1 JPWO2021235282A1 (https=) 2021-11-25
JPWO2021235282A5 JPWO2021235282A5 (https=) 2022-05-12
JP7222437B2 true JP7222437B2 (ja) 2023-02-15

Family

ID=78707846

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021576148A Active JP7222437B2 (ja) 2020-05-21 2021-05-12 伸縮性配線基板

Country Status (4)

Country Link
US (1) US12052817B2 (https=)
JP (1) JP7222437B2 (https=)
CN (1) CN114271034B (https=)
WO (1) WO2021235282A1 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP4412403A4 (en) * 2021-12-08 2025-10-01 Murata Manufacturing Co EXPANDABLE DEVICE
WO2023228798A1 (ja) * 2022-05-26 2023-11-30 株式会社村田製作所 伸縮デバイス
CN119318210A (zh) * 2022-06-08 2025-01-14 株式会社村田制作所 伸缩性器件

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015158840A (ja) 2014-02-25 2015-09-03 富士フイルム株式会社 タッチパネルおよび導電性フィルムシート
JP2017152687A (ja) 2016-02-22 2017-08-31 日本メクトロン株式会社 伸縮性配線基板及びその製造方法
JP2018114302A (ja) 2014-01-28 2018-07-26 日本電信電話株式会社 生体信号検出衣料
US20180303418A1 (en) 2012-03-30 2018-10-25 The Board Of Trustees Of The University Of Illinois Appendage mountable electronic devices conformable to surfaces
JP2019165048A (ja) 2018-03-19 2019-09-26 株式会社フジクラ 伸縮性配線板及び伸縮性配線板の製造方法
JP2019220247A (ja) 2018-06-15 2019-12-26 グンゼ株式会社 端子接続構造及び端子接続方法
JP2020055300A (ja) 2018-09-27 2020-04-09 信越化学工業株式会社 伸縮性膜及び伸縮性膜の形成方法

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JPH0717769B2 (ja) * 1988-12-27 1995-03-01 東レ株式会社 プラスチックフィルムと紙との積層品の製造方法
TW430999B (en) * 1998-05-15 2001-04-21 Mirae Corp Contact light emitting device and input device using it
US6316734B1 (en) * 2000-03-07 2001-11-13 3M Innovative Properties Company Flexible circuits with static discharge protection and process for manufacture
JP2003224349A (ja) * 2002-01-29 2003-08-08 Ricoh Microelectronics Co Ltd 基板製造方法
JP2009246250A (ja) * 2008-03-31 2009-10-22 Mitsubishi Electric Corp 薄膜形成方法
KR100999921B1 (ko) * 2008-09-26 2010-12-13 삼성전기주식회사 기판의 이중 표면 처리 방법 및 상기 방법에 의해 표면 처리된 기판
JP2010086814A (ja) * 2008-09-30 2010-04-15 Toshiba Mobile Display Co Ltd 表示装置
CN201398971Y (zh) * 2009-04-20 2010-02-10 湖州艾木奇生物科技咨询服务有限公司 皮下植入式葡萄糖传感器
JP5646433B2 (ja) * 2011-10-31 2014-12-24 日本写真印刷株式会社 導電シート及びその製造方法
JP3177243U (ja) * 2012-05-14 2012-07-26 金鼎聯合科技纖維股▲分▼有限公司 生体信号検知器
US9390858B2 (en) * 2014-04-03 2016-07-12 Murata Manufacturing Co., Ltd. Electronic component, method of manufacturing the same, and mount structure of electronic component
JP6892376B2 (ja) * 2017-02-14 2021-06-23 信越化学工業株式会社 生体電極組成物、生体電極、生体電極の製造方法、及び高分子化合物
CN109384194A (zh) * 2017-08-07 2019-02-26 张家港祥成医用材料科技有限公司 一种电子皮肤非固相生物压力传感器的制备方法
CN107734831B (zh) * 2017-10-13 2019-07-19 百强电子（深圳）有限公司 可穿戴式的伸缩导电布及其制作方法
CN109955785A (zh) * 2017-12-26 2019-07-02 清华大学 疏水镜子以及使用该疏水镜子的汽车
TWI703959B (zh) 2018-03-19 2020-09-11 日商藤倉股份有限公司 拉伸性配線板以及拉伸性配線板之製造方法
JP7006421B2 (ja) 2018-03-20 2022-01-24 ブラザー工業株式会社 画像読取装置
CN209766442U (zh) * 2018-12-13 2019-12-10 北京铂阳顶荣光伏科技有限公司 一种封装结构及太阳能组件

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20180303418A1 (en) 2012-03-30 2018-10-25 The Board Of Trustees Of The University Of Illinois Appendage mountable electronic devices conformable to surfaces
JP2018114302A (ja) 2014-01-28 2018-07-26 日本電信電話株式会社 生体信号検出衣料
JP2015158840A (ja) 2014-02-25 2015-09-03 富士フイルム株式会社 タッチパネルおよび導電性フィルムシート
JP2017152687A (ja) 2016-02-22 2017-08-31 日本メクトロン株式会社 伸縮性配線基板及びその製造方法
JP2019165048A (ja) 2018-03-19 2019-09-26 株式会社フジクラ 伸縮性配線板及び伸縮性配線板の製造方法
JP2019220247A (ja) 2018-06-15 2019-12-26 グンゼ株式会社 端子接続構造及び端子接続方法
JP2020055300A (ja) 2018-09-27 2020-04-09 信越化学工業株式会社 伸縮性膜及び伸縮性膜の形成方法

Also Published As

Publication number Publication date
JPWO2021235282A1 (https=) 2021-11-25
US12052817B2 (en) 2024-07-30
WO2021235282A1 (ja) 2021-11-25
US20220183151A1 (en) 2022-06-09
CN114271034A (zh) 2022-04-01
CN114271034B (zh) 2024-08-30

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