WO2021235282A1 - 伸縮性配線基板 - Google Patents

伸縮性配線基板 Download PDF

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Publication number
WO2021235282A1
WO2021235282A1 PCT/JP2021/017998 JP2021017998W WO2021235282A1 WO 2021235282 A1 WO2021235282 A1 WO 2021235282A1 JP 2021017998 W JP2021017998 W JP 2021017998W WO 2021235282 A1 WO2021235282 A1 WO 2021235282A1
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WO
WIPO (PCT)
Prior art keywords
elastic
electrode
insulating layer
base material
water absorption
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2021/017998
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English (en)
French (fr)
Japanese (ja)
Inventor
勇人 勝
圭佑 西田
健太朗 臼井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Original Assignee
Murata Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
Priority to CN202180004990.4A priority Critical patent/CN114271034B/zh
Priority to JP2021576148A priority patent/JP7222437B2/ja
Publication of WO2021235282A1 publication Critical patent/WO2021235282A1/ja
Priority to US17/652,207 priority patent/US12052817B2/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/0283—Stretchable printed circuits
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B5/00—Measuring for diagnostic purposes; Identification of persons
    • A61B5/24—Detecting, measuring or recording bioelectric or biomagnetic signals of the body or parts thereof
    • A61B5/25—Bioelectric electrodes therefor
    • A61B5/263—Bioelectric electrodes therefor characterised by the electrode materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0254—High voltage adaptations; Electrical insulation details; Overvoltage or electrostatic discharge protection ; Arrangements for regulating voltages or for using plural voltages
    • H05K1/0256—Electrical insulation details, e.g. around high voltage areas
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0133—Elastomeric or compliant polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/07—Electric details
    • H05K2201/0753—Insulation
    • H05K2201/0769—Anti metal-migration, e.g. avoiding tin whisker growth
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1173—Differences in wettability, e.g. hydrophilic or hydrophobic areas

Definitions

  • the present invention relates to an elastic wiring board.
  • Patent Document 1 includes a plurality of elastic base materials and a plurality of elastic wiring portions provided on at least one of the facing main surfaces of the plurality of elastic base materials, and each main surface is provided with a plurality of elastic wiring portions.
  • an elastic wiring board in which elastic wiring portions provided in the above are electrically connected to each other via a connection portion.
  • an interlayer stretchable base material is arranged between facing main surfaces of the stretchable base material, and the moisture permeability of the interlayer stretchable base material is adjusted to the stretchable base material. It is disclosed that the occurrence of ion migration can be suppressed by lowering the value.
  • the present invention has been made to solve the above problems, and an object of the present invention is to provide an elastic wiring board having excellent ion migration resistance.
  • the elastic wiring board of the present invention comprises an elastic base material and a plurality of electrode wirings having elasticity, and a low water absorption insulating layer is formed between at least a part of the electrode wiring and the elastic base material.
  • a water-repellent layer is provided.
  • FIG. 1 is a cross-sectional view schematically showing an example of an elastic wiring board of the present invention.
  • FIG. 2 is a cross-sectional view schematically showing another example of the elastic wiring board of the present invention.
  • FIG. 3 is a cross-sectional view schematically showing still another example of the elastic wiring board of the present invention.
  • the elastic wiring board of the present invention will be described.
  • the present invention is not limited to the following configuration, and can be appropriately modified and applied without changing the gist of the present invention. It should be noted that a combination of two or more of the individual desirable configurations described below is also the present invention.
  • the elastic wiring board of the present invention comprises an elastic base material and a plurality of electrode wirings having elasticity, and a low water absorption insulating layer is formed between at least a part of the electrode wiring and the elastic base material.
  • a water-repellent layer is provided.
  • a low water absorption insulating layer or a water repellent layer is provided between at least a part of the electrode wiring and the elastic base material. It is considered that the elastic base material has a reduced insulation resistance when it absorbs water in a high humidity environment, and the diffusion of metal ions is likely to occur, resulting in ion migration. Since the low water absorption insulating layer has low water absorption, diffusion of metal ions is unlikely to occur even under conditions where the elastic base material absorbs water. Therefore, if a low water absorption insulating layer is provided between at least a part of the electrode wiring and the elastic base material, it is possible to block the diffusion of metal ions between the electrode wirings and suppress ion migration. ..
  • the water-repellent layer has a property of blocking the movement of water through the water-repellent layer. Therefore, even under the condition that the elastic base material absorbs water, the diffusion of metal ions is unlikely to occur. Therefore, if a water-repellent layer is provided between at least a part of the electrode wiring and the elastic base material, it is possible to block the diffusion of metal ions between the electrode wirings and suppress ion migration.
  • FIG. 1 is a cross-sectional view schematically showing an example of an elastic wiring board of the present invention.
  • the elastic wiring board 1 has a low water absorption insulation provided between the elastic base material 10, the electrode wirings 30a and 30b, the electrode wirings 30a and 30b, and the elastic base material 10. It consists of layer 20.
  • the electrode wiring 30a and the electrode wiring 30b have different potentials from each other.
  • the elastic wiring board 1 When the elastic wiring board 1 is used, a voltage is applied between the electrode wiring 30a and the electrode wiring 30b. As a result, an electric field is generated between the electrode wiring 30a and the electrode wiring 30b at a position via the elastic base material 10. If there is no low water absorption insulating layer 20, the electrode wiring 30a and the electrode wiring 30b are in contact with the elastic base material 10, and the elastic base material 10 is in a state of absorbing water, the inside of the elastic base material 10 Diffusion of metal ions progresses, and ion migration occurs. On the other hand, in the elastic wiring board 1, a low water absorption insulating layer 20 is provided between the electrode wiring 30a and the elastic base material 10 and between the electrode wiring 30b and the elastic base material 10, respectively. Has been done. Since the low water absorption insulating layer 20 has low water absorption, diffusion of metal ions constituting the electrode wiring is unlikely to occur. Therefore, in the elastic wiring board 1, the occurrence of ion migration can be suppressed.
  • the elastic wiring board of the present invention is also provided with a water-repellent layer instead of the low water-absorbent insulating layer. Since the water-repellent layer has a property of blocking the movement of water through the water-repellent layer, diffusion of metal ions is unlikely to occur in the water-repellent layer even under the condition that the elastic base material absorbs water. Therefore, the occurrence of ion migration can be suppressed.
  • the low water absorption insulating layer and the water repellent layer can suppress the occurrence of ion migration. Therefore, in the present specification, the low water absorption insulating layer and the water repellent layer are collectively referred to as an ion migration resistant layer.
  • the stretchable wiring board of the present invention may include both a low water absorption insulating layer and a water repellent layer.
  • the stretchable base material preferably contains a urethane resin or an acrylic resin.
  • the urethane resin include thermoplastic polyurethane and the like.
  • the acrylic resin include an elastomer made of an acrylic copolymer resin.
  • the thickness of the stretchable base material is preferably 1000 ⁇ m or less, more preferably 100 ⁇ m or less, from the viewpoint of not inhibiting the expansion and contraction of the surface of the living body.
  • the thickness of the elastic base material is preferably 10 ⁇ m or more.
  • Examples of the method for manufacturing the elastic base material include a method of molding a urethane resin or an acrylic resin into a predetermined shape (for example, a sheet shape) by injection molding, pressure molding, tape casting method or the like.
  • the electrode wiring is preferably made of a mixture of conductive particles and an elastomer.
  • a mixture include a mixture of a metal powder such as silver, copper, and nickel as conductive particles and an elastomer resin such as an epoxy resin, a urethane resin, an acrylic resin, and a silicone resin. Two or more kinds of elastomer resins may be used in combination.
  • the conductive particles are preferably silver particles.
  • the conductive particles are silver particles, ion migration is particularly likely to occur. Since the stretchable wiring board of the present invention has excellent ion migration resistance, ion migration is unlikely to occur even when silver is used as a material constituting the conductive particles.
  • the average particle size D50 of the conductive particles is preferably 0.01 ⁇ m or more and 10 ⁇ m or less.
  • the average particle size D50 of the conductive particles can be measured by a laser diffraction / scattering method.
  • the shape of the conductive particles is not limited to a spherical shape, and may be a flat shape or a shape having protrusions.
  • the thickness of the electrode wiring is preferably 100 ⁇ m or less, more preferably 50 ⁇ m or less.
  • the thickness of the electrode wiring is preferably 1 ⁇ m or more.
  • the electrode wiring can be formed, for example, by a method in which a dispersion liquid or slurry in which a mixture of conductive particles and an elastomer is dispersed in a solvent is printed on the surface of an elastic base material or an ion migration resistant layer and dried.
  • the plurality of electrode wirings may be provided at the same position in the thickness direction of the elastic wiring board, or may be provided at different positions.
  • a plurality of electrode wirings are provided at different positions in the thickness direction of the elastic wiring board, there is a case where the electrode wirings are arranged on both sides of the elastic base material.
  • three or more electrode wirings may be arranged.
  • two or more electrode wirings having the same potential may be arranged as long as two or more kinds of potentials exist as the potentials of the electrode wirings.
  • the low water absorption insulating layer refers to an insulating layer having a water absorption rate of 2.0% or less as measured in accordance with ASTM standard D570.
  • the water absorption rate of the low water absorption insulating layer is preferably 1.5% or less, more preferably 1.0% or less.
  • the low water absorption insulating layer may contain a low water absorption insulating resin such as silicone resin, acrylic resin, olefin resin, modified urethane resin, vinyl chloride resin, polyester, polyamide, polyolefin, polyethylene, polypropylene, or a paraxylylene-based polymer. preferable.
  • a low water absorption insulating resin such as silicone resin, acrylic resin, olefin resin, modified urethane resin, vinyl chloride resin, polyester, polyamide, polyolefin, polyethylene, polypropylene, or a paraxylylene-based polymer.
  • a dispersion liquid in which the low water-absorbent insulating resin is dispersed in a solvent is prepared, and the dispersion liquid is applied on an elastic base material by printing or the like and dried.
  • the monomer After applying a monomer dispersion liquid containing a monomer that becomes a low water-absorbent insulating resin by polymerization on a stretchable substrate by printing or the like, the monomer is applied by means such as heat or UV exposure. It can be obtained by the method of polymerization.
  • the low water absorption insulating layer containing the paraxylylene-based polymer can be obtained by depositing the paraxylylene-based polymer on a stretchable substrate.
  • Examples of the method of printing the dispersion liquid on the elastic base material include screen printing, gravure printing, inkjet printing and the like.
  • the thickness of the low water-absorbent insulating layer obtained by applying and drying the dispersion is preferably 1 ⁇ m or more and 100 ⁇ m or less, and more preferably 10 ⁇ m or more and 30 ⁇ m or less.
  • the thickness of the low water-absorbent insulating layer obtained by applying and drying the dispersion liquid is 1 ⁇ m or more and 100 ⁇ m or less, it is possible to impart appropriate hardness to the elastic wiring board.
  • the thickness of the low water absorption insulating layer obtained by vapor deposition is preferably 0.1 ⁇ m or more and 10 ⁇ m or less, and more preferably 1 ⁇ m or more and 10 ⁇ m or less. Even when the thickness of the low water-absorbent insulating film layer obtained by vapor deposition exceeds 10 ⁇ m, the ion migration resistance is hardly improved. Therefore, from the viewpoint of manufacturing cost, the thickness of the low water absorption insulating layer obtained by vapor deposition is preferably 10 ⁇ m or less.
  • the water-repellent layer is a layer having a contact angle with water of 90 ° or more.
  • the contact angle of the water-repellent layer with water is preferably 100 ° or more, and more preferably 120 ° or more.
  • Examples of the method for forming the water-repellent layer include a method in which a commercially available water-repellent agent is applied on an elastic base material by printing or the like and heat-treated as necessary.
  • Examples of commercially available water repellents include F-based (fluorine-based) water-repellent agents and Si-based (silicone-based) water-repellent agents.
  • the ion-resistant migration layer may be provided on the entire surface of the elastic base material, or may be provided only on a part thereof.
  • the low water absorption insulating layer 20 is provided on the entire surface of one surface of the elastic base material 10, but the low water absorption insulating layer 20 is the electrode wiring 30a. It may be provided only between the elastic base material 10 or between the electrode wiring 30b and the elastic base material 10, that is, only in the portion where the electrode wiring and the elastic base material face each other.
  • FIG. 2 is a cross-sectional view schematically showing another example of the elastic wiring board of the present invention.
  • the elastic wiring substrate 2 shown in FIG. 2 includes an elastic base material 11, electrode wirings 31a and 31b, a low water absorption insulating layer 21a arranged between the electrode wiring 31a and the elastic base material 11, and an electrode. It is composed of a low water absorption insulating layer 21b arranged between the wiring 31b and the elastic base material 11.
  • the electrode wirings 31a and 31b are provided on the low water absorption insulating layers 21a and 21b, respectively, and are not in direct contact with the elastic base material 11. Further, the stretchable wiring board 2 is not provided with the low water absorption insulating layer 21, and there is a portion where the stretchable base material 11 is exposed.
  • the external dimensions of the low water absorption insulating layers 21a and 21b are larger than the external dimensions of the electrode wirings 31a and 32b, respectively.
  • (2, double arrow L 1 and the length indicated by L 2) is preferably 20 ⁇ m or more, and more preferably 100 ⁇ m or more.
  • the distance L 1 and the distance L 2 are preferably 3000 ⁇ m or less. By setting the distance L 1 and the distance L 2 to 3000 ⁇ m or less, the irritation to the living body caused by the ion-resistant migration layer can be minimized and the biocompatibility can be improved.
  • the ion-resistant migration layer is preferably provided between two electrode wirings having different potentials and an elastic base material.
  • Two electrode wirings having different potentials have a relatively high potential (high potential electrode) on one side and a relatively low potential (ground electrode) on the other side.
  • the position where the ion-resistant migration layer is arranged may be a position in contact with the high potential electrode, a position in contact with the ground electrode, or a position in contact with either the high potential electrode or the ground electrode. It may not be in a position.
  • the ion migration resistant layer is provided at a position in contact with the high potential electrode which is the starting point of diffusion.
  • the elastic wiring board 2 is an example in which an ion migration resistant layer is provided at both a position in contact with a high potential electrode and a position in contact with a ground electrode. Therefore, either the low water absorption insulating layer 21a or the low water absorption insulating layer 21b is removed from the elastic wiring board 2 shown in FIG. 2, and the electrode wiring 31a or 31b is directly provided on the elastic substrate 11. Is also the elastic wiring board of the present invention.
  • Diffusion of metal ions from the electrode wiring to the elastic base material occurs when the elastic base material is arranged between the electrode wirings having different potentials. Therefore, since the diffusion of metal ions does not occur in the elastic base material arranged between the electrode wirings having the same potential, it is not necessary to provide the ion migration resistant layer.
  • FIG. 3 is a cross-sectional view schematically showing still another example of the elastic wiring board of the present invention.
  • the elastic wiring board 3 shown in FIG. 3 is composed of an elastic base material 12, electrode wirings 32a and 32b, and a low water absorption insulating layer 22 arranged between the electrode wiring 32a and the elastic base material 12.
  • the electrode wiring 32a is provided on the low water absorption insulating layer 22 and is not in direct contact with the elastic base material 12.
  • the two electrode wirings 32b are in direct contact with the elastic base material 12.
  • the electrode wiring 32a and the electrode wiring 32b have different potentials from each other, but the two electrode wirings 32b have the same potential.
  • the low water-absorbent insulating layer 22 is provided between the electrode wirings 32a and the electrode wirings 32b having different potentials, but the low water-absorbent insulating layer 22 is provided between the electrode wirings 32b having the same potential.
  • the stretchable wiring board 3 is not provided with the low water absorption insulating layer 22, and there is a portion where the stretchable base material 12 is exposed.
  • the external dimensions of the low water absorption insulating layer 22 are larger than the external dimensions of the electrode wiring 32a.
  • the shortest distance from the end of the outer shape of the electrode wiring 32a to the end of the outer shape of the low water absorption insulating layer 22 when the outer shape of the low water absorption insulating layer 21 and the outer shape of the electrode wiring 30a are overlapped in a plan view. (3, length indicated by the double arrow L 5) is preferably 20 ⁇ m or more, and more preferably 100 ⁇ m or more.
  • the distance L 5 is preferably 3000 ⁇ m or less. By setting the distance L 5 to 3000 ⁇ m or less, the irritation to the living body caused by the ion-resistant migration layer can be minimized and the biocompatibility can be improved.
  • the outer shape of the ion-resistant migration layer arranged between the electrode wiring and the elastic base material preferably has a larger area than the outer shape of the electrode wiring and is similar to the outer shape of the electrode wiring.
  • the outer shape of the ion-resistant migration layer should be such that the outer shape of the electrode wiring protrudes outward by 20 ⁇ m or more and 3000 ⁇ m or less. Is preferable.
  • the protrusion amount (length) is a length corresponding to the distance L 1 , the distance L 2 , the distance L 3 and the distance L 4 described in FIG. 2, and the distance L 5 described in FIG.
  • the plan view shape of the ion-resistant migration layer may be a shape that covers two or more electrode wirings. It is preferable that at least one of the electrode wirings having different potentials is provided directly above the ion-resistant migration layer.
  • one electrode arranged directly above the ion-resistant migration layer and another electrode wiring is arranged directly under the same ion-resistant migration layer one electrode arranged directly above the ion-resistant migration layer.
  • the shortest distance between the wiring and the other electrode wiring disposed directly below the anti-ion-migration layer that preferably at 20 ⁇ m or more, 100 ⁇ m or more More preferred.
  • the distance from one electrode wiring to the other electrode wiring exceeds 3000 ⁇ m in a plan view, it is preferable to provide a region in which the ion-resistant migration layer is not provided between the two electrode wirings.
  • the electrode wiring 32a and the electrode wiring 32b having different potentials are separated by the same low water absorption insulating layer 22, but the low water absorption insulating layer is provided only directly under the electrode wiring 32a.
  • the amount of protrusion of the ion-resistant migration layer from the electrode wiring 31a when the ion-resistant migration layer and the electrode wiring 31a are viewed in a plan view is preferably 20 ⁇ m or more, preferably 100 ⁇ m at any location. The above is more preferable.
  • the upper limit of the amount of protrusion is preferably 3000 ⁇ m or less.
  • the elastic wiring board of the present invention may include, for example, an electrode, an electronic component, or the like as a configuration other than the electrode wiring and the ion-resistant migration layer.
  • the electrodes serve to receive biological signals when the elastic wiring board is attached to the living body.
  • the electrode is preferably a gel electrode.
  • the gel electrode is composed of a conductive gel material containing, for example, water, alcohol, a moisturizer, an electrolyte and the like. Examples of such gel materials include hydrogels and the like.
  • electrodes containing conductive particles shall be treated as electrode wiring.
  • Examples of electronic components include capacitors, inductors, diodes, resistors, amplifiers, and the like.
  • thermoplastic polyurethane resin sheet having a thickness of 40 ⁇ m was cut into 150 mm ⁇ 150 mm to obtain an elastic base material.
  • a dispersion liquid in which a modified silicone resin was dispersed in a solvent was applied onto the stretchable base material and dried to form a low water absorption insulating layer having a thickness of 10 ⁇ m on the stretchable base material.
  • two electrode wirings having a line width of 0.5 mm and a thickness of 25 ⁇ m are formed in parallel at intervals of 1000 ⁇ m by using a silver paste, and the elastic wiring substrate according to the first embodiment is formed.
  • Got The water absorption rate of the thermoplastic polyurethane resin sheet was 2.2%.
  • the water absorption rate of the low water absorption insulating layer was 0.11%.
  • Example 2 to 4 The elastic wiring boards according to Examples 2 to 4 were obtained in the same procedure as in Example 1 except that the composition of the low water absorption insulating layer was changed to that shown in Table 1.
  • Comparative Example 1 An elastic wiring board according to Comparative Example 1 was obtained by the same procedure as in Example 1 except that the low water absorption insulating layer was not provided.
  • Example 5 to 8 By changing the printing pattern of the low water absorption insulating layer, the distance L between the electrode wiring and the low water absorption insulating layer was changed as shown in Table 2, and the procedure was the same as that of the first embodiment.
  • Elastic wiring boards according to 5 to 8 were obtained and a reliability test was conducted.
  • the elastic base material and the low water absorption insulating layer constituting the elastic wiring board according to Examples 5 to 8 are the same as those in Example 1.
  • the test conditions for the reliability test were the same as in Examples 1 to 4 and Comparative Example 1.
  • the results are shown in Table 2.
  • the results of Comparative Example 1 are also shown in Table 2.
  • ">12hour” means that a short circuit did not occur even after 12 hours had passed after being left unattended.
  • the distance L between the electrode wiring and the low water absorption insulating layer is preferably 20 ⁇ m or more in order to prevent ion migration. Further, in consideration of manufacturing variations, the distance L between the electrode wiring and the low water absorption insulating layer is more preferably 100 ⁇ m or more.
  • Example 9 to 12 instead of applying the dispersion liquid on the stretchable substrate and drying it, the expansion and contraction according to Examples 9 to 12 are carried out in the same procedure as in Example 1 except that a paraxylylene-based polymer is vapor-deposited to provide a low water-absorbent insulating layer.
  • a sex wiring board was obtained and a reliability test was performed.
  • the test conditions for the reliability test were the same as in Examples 1 to 4 and Comparative Example 1. The results are shown in Table 3.
  • the results of Comparative Example 1 are also shown in Table 3. Further, the water absorption rate of the low water absorption insulating layer obtained by depositing a paraxylylene-based polymer was 0.1% or less.
  • the elastic wiring board provided with the low water absorption insulating layer by thin film deposition is excellent in ion migration resistance in a high humidity environment.
  • the thickness of the low water absorption insulating layer provided by thin film deposition may be 0.1 ⁇ m or more, but 1 ⁇ m or more is preferable.
  • Example 13 to 14 Instead of applying the dispersion liquid on the stretchable base material and drying it, the water repellent layer shown in Table 4 was applied to the surface of the stretchable base material and heat-treated at 80 ° C. to form a water repellent layer.
  • the elastic wiring board according to Examples 13 to 14 was obtained by the same procedure as in Example 1.
  • the contact angle of the water-repellent layer with water was contacted, and a reliability test was performed.
  • the test conditions for the reliability test were the same as in Examples 1 to 4 and Comparative Example 1.
  • the results are shown in Table 4.
  • the results of Comparative Example 1 are also shown in Table 4.
  • the contact angle of the thermoplastic polyurethane resin sheet with water was 70 °.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Life Sciences & Earth Sciences (AREA)
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  • Heart & Thoracic Surgery (AREA)
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  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
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  • Measurement And Recording Of Electrical Phenomena And Electrical Characteristics Of The Living Body (AREA)
PCT/JP2021/017998 2020-05-21 2021-05-12 伸縮性配線基板 Ceased WO2021235282A1 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
CN202180004990.4A CN114271034B (zh) 2020-05-21 2021-05-12 伸缩性布线基板
JP2021576148A JP7222437B2 (ja) 2020-05-21 2021-05-12 伸縮性配線基板
US17/652,207 US12052817B2 (en) 2020-05-21 2022-02-23 Elastic wiring board

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Application Number Priority Date Filing Date Title
JP2020088921 2020-05-21
JP2020-088921 2020-05-21

Related Child Applications (1)

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US17/652,207 Continuation US12052817B2 (en) 2020-05-21 2022-02-23 Elastic wiring board

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023106055A1 (ja) * 2021-12-08 2023-06-15 株式会社村田製作所 伸縮性デバイス
WO2023228798A1 (ja) * 2022-05-26 2023-11-30 株式会社村田製作所 伸縮デバイス
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