JPWO2023238754A1 - - Google Patents

Info

Publication number
JPWO2023238754A1
JPWO2023238754A1 JP2024526402A JP2024526402A JPWO2023238754A1 JP WO2023238754 A1 JPWO2023238754 A1 JP WO2023238754A1 JP 2024526402 A JP2024526402 A JP 2024526402A JP 2024526402 A JP2024526402 A JP 2024526402A JP WO2023238754 A1 JPWO2023238754 A1 JP WO2023238754A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2024526402A
Other languages
Japanese (ja)
Other versions
JPWO2023238754A5 (https=
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2023238754A1 publication Critical patent/JPWO2023238754A1/ja
Publication of JPWO2023238754A5 publication Critical patent/JPWO2023238754A5/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/02—Physical, chemical or physicochemical properties
    • B32B7/022—Mechanical properties
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/0283—Stretchable printed circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Structure Of Printed Boards (AREA)
  • Laminated Bodies (AREA)
JP2024526402A 2022-06-08 2023-05-31 Pending JPWO2023238754A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022093265 2022-06-08
PCT/JP2023/020308 WO2023238754A1 (ja) 2022-06-08 2023-05-31 伸縮性デバイス

Publications (2)

Publication Number Publication Date
JPWO2023238754A1 true JPWO2023238754A1 (https=) 2023-12-14
JPWO2023238754A5 JPWO2023238754A5 (https=) 2025-02-21

Family

ID=89118366

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024526402A Pending JPWO2023238754A1 (https=) 2022-06-08 2023-05-31

Country Status (4)

Country Link
US (1) US20250089177A1 (https=)
JP (1) JPWO2023238754A1 (https=)
CN (1) CN119318210A (https=)
WO (1) WO2023238754A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025173748A1 (ja) * 2024-02-14 2025-08-21 株式会社村田製作所 伸縮性デバイス
WO2026048693A1 (ja) * 2024-08-27 2026-03-05 株式会社村田製作所 伸縮性デバイス

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004319962A (ja) * 2002-12-13 2004-11-11 Victor Co Of Japan Ltd フレックスリジッドプリント配線板及びその製造方法
JP2008244062A (ja) * 2007-03-27 2008-10-09 Kojima Press Co Ltd 回路基板
US20120106095A1 (en) * 2010-10-29 2012-05-03 Palo Alto Research Center Incorporated Stretchable electronics modules and circuits
JP2020510998A (ja) * 2017-02-16 2020-04-09 ネーデルランドセ・オルガニサティ・フォール・トゥーヘパスト−ナトゥールウェテンスハッペライク・オンデルズーク・テーエヌオー フレキシブル回路における渦巻き相互接続
WO2020262288A1 (ja) * 2019-06-27 2020-12-30 パナソニックＩｐマネジメント株式会社 伸縮性回路基板、及び伸縮性回路実装品
WO2021235282A1 (ja) * 2020-05-21 2021-11-25 株式会社村田製作所 伸縮性配線基板

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012204396A (ja) * 2011-03-23 2012-10-22 Fujikura Ltd フレキシブルプリント基板及びその製造方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004319962A (ja) * 2002-12-13 2004-11-11 Victor Co Of Japan Ltd フレックスリジッドプリント配線板及びその製造方法
JP2008244062A (ja) * 2007-03-27 2008-10-09 Kojima Press Co Ltd 回路基板
US20120106095A1 (en) * 2010-10-29 2012-05-03 Palo Alto Research Center Incorporated Stretchable electronics modules and circuits
JP2020510998A (ja) * 2017-02-16 2020-04-09 ネーデルランドセ・オルガニサティ・フォール・トゥーヘパスト−ナトゥールウェテンスハッペライク・オンデルズーク・テーエヌオー フレキシブル回路における渦巻き相互接続
WO2020262288A1 (ja) * 2019-06-27 2020-12-30 パナソニックＩｐマネジメント株式会社 伸縮性回路基板、及び伸縮性回路実装品
WO2021235282A1 (ja) * 2020-05-21 2021-11-25 株式会社村田製作所 伸縮性配線基板

Also Published As

Publication number Publication date
US20250089177A1 (en) 2025-03-13
CN119318210A (zh) 2025-01-14
WO2023238754A1 (ja) 2023-12-14

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