JPWO2023106055A1 - - Google Patents

Info

Publication number
JPWO2023106055A1
JPWO2023106055A1 JP2023566195A JP2023566195A JPWO2023106055A1 JP WO2023106055 A1 JPWO2023106055 A1 JP WO2023106055A1 JP 2023566195 A JP2023566195 A JP 2023566195A JP 2023566195 A JP2023566195 A JP 2023566195A JP WO2023106055 A1 JPWO2023106055 A1 JP WO2023106055A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2023566195A
Other languages
Japanese (ja)
Other versions
JPWO2023106055A5 (https=
JP7658459B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2023106055A1 publication Critical patent/JPWO2023106055A1/ja
Publication of JPWO2023106055A5 publication Critical patent/JPWO2023106055A5/ja
Application granted granted Critical
Publication of JP7658459B2 publication Critical patent/JP7658459B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/0283—Stretchable printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0133—Elastomeric or compliant polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0302—Properties and characteristics in general
    • H05K2201/0314—Elastomeric connector or conductor, e.g. rubber with metallic filler
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/099—Coating over pads, e.g. solder resist partly over pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)
JP2023566195A 2021-12-08 2022-11-16 伸縮性デバイス Active JP7658459B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021199233 2021-12-08
JP2021199233 2021-12-08
PCT/JP2022/042512 WO2023106055A1 (ja) 2021-12-08 2022-11-16 伸縮性デバイス

Publications (3)

Publication Number Publication Date
JPWO2023106055A1 true JPWO2023106055A1 (https=) 2023-06-15
JPWO2023106055A5 JPWO2023106055A5 (https=) 2024-07-11
JP7658459B2 JP7658459B2 (ja) 2025-04-08

Family

ID=86730404

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023566195A Active JP7658459B2 (ja) 2021-12-08 2022-11-16 伸縮性デバイス

Country Status (5)

Country Link
US (1) US20240324099A1 (https=)
EP (1) EP4412403A4 (https=)
JP (1) JP7658459B2 (https=)
CN (1) CN118355735A (https=)
WO (1) WO2023106055A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025249078A1 (ja) * 2024-05-27 2025-12-04 株式会社村田製作所 伸縮性デバイス
WO2026048693A1 (ja) * 2024-08-27 2026-03-05 株式会社村田製作所 伸縮性デバイス

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009081929A1 (ja) * 2007-12-26 2009-07-02 Fujikura Ltd. 実装基板及びその製造方法
JP2016143763A (ja) * 2015-02-02 2016-08-08 株式会社フジクラ 伸縮性回路基板
WO2020203135A1 (ja) * 2019-03-29 2020-10-08 株式会社村田製作所 伸縮性実装基板
WO2021235282A1 (ja) * 2020-05-21 2021-11-25 株式会社村田製作所 伸縮性配線基板

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6903981B2 (ja) * 2017-03-23 2021-07-14 セイコーエプソン株式会社 検出装置
US20210076496A1 (en) * 2019-09-09 2021-03-11 Flex Ltd. Solder electronic components to printed conductive ink

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009081929A1 (ja) * 2007-12-26 2009-07-02 Fujikura Ltd. 実装基板及びその製造方法
JP2016143763A (ja) * 2015-02-02 2016-08-08 株式会社フジクラ 伸縮性回路基板
WO2020203135A1 (ja) * 2019-03-29 2020-10-08 株式会社村田製作所 伸縮性実装基板
WO2021235282A1 (ja) * 2020-05-21 2021-11-25 株式会社村田製作所 伸縮性配線基板

Also Published As

Publication number Publication date
WO2023106055A1 (ja) 2023-06-15
EP4412403A1 (en) 2024-08-07
CN118355735A (zh) 2024-07-16
US20240324099A1 (en) 2024-09-26
EP4412403A4 (en) 2025-10-01
JP7658459B2 (ja) 2025-04-08

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