CN118355735A - 伸缩性器件 - Google Patents

伸缩性器件 Download PDF

Info

Publication number
CN118355735A
CN118355735A CN202280080738.6A CN202280080738A CN118355735A CN 118355735 A CN118355735 A CN 118355735A CN 202280080738 A CN202280080738 A CN 202280080738A CN 118355735 A CN118355735 A CN 118355735A
Authority
CN
China
Prior art keywords
conductive member
stretchable
insulating layer
contact
wiring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202280080738.6A
Other languages
English (en)
Chinese (zh)
Inventor
伊藤宏充
西田圭佑
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Original Assignee
Murata Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
Publication of CN118355735A publication Critical patent/CN118355735A/zh
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/0283—Stretchable printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0133—Elastomeric or compliant polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0302—Properties and characteristics in general
    • H05K2201/0314—Elastomeric connector or conductor, e.g. rubber with metallic filler
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/099—Coating over pads, e.g. solder resist partly over pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)
CN202280080738.6A 2021-12-08 2022-11-16 伸缩性器件 Pending CN118355735A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021-199233 2021-12-08
JP2021199233 2021-12-08
PCT/JP2022/042512 WO2023106055A1 (ja) 2021-12-08 2022-11-16 伸縮性デバイス

Publications (1)

Publication Number Publication Date
CN118355735A true CN118355735A (zh) 2024-07-16

Family

ID=86730404

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202280080738.6A Pending CN118355735A (zh) 2021-12-08 2022-11-16 伸缩性器件

Country Status (5)

Country Link
US (1) US20240324099A1 (https=)
EP (1) EP4412403A4 (https=)
JP (1) JP7658459B2 (https=)
CN (1) CN118355735A (https=)
WO (1) WO2023106055A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025249078A1 (ja) * 2024-05-27 2025-12-04 株式会社村田製作所 伸縮性デバイス
WO2026048693A1 (ja) * 2024-08-27 2026-03-05 株式会社村田製作所 伸縮性デバイス

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5220766B2 (ja) * 2007-12-26 2013-06-26 株式会社フジクラ 実装基板
JP6518451B2 (ja) * 2015-02-02 2019-05-22 株式会社フジクラ 伸縮性回路基板
JP6903981B2 (ja) * 2017-03-23 2021-07-14 セイコーエプソン株式会社 検出装置
WO2020203135A1 (ja) * 2019-03-29 2020-10-08 株式会社村田製作所 伸縮性実装基板
US20210076496A1 (en) * 2019-09-09 2021-03-11 Flex Ltd. Solder electronic components to printed conductive ink
CN114271034B (zh) * 2020-05-21 2024-08-30 株式会社村田制作所 伸缩性布线基板

Also Published As

Publication number Publication date
WO2023106055A1 (ja) 2023-06-15
EP4412403A1 (en) 2024-08-07
US20240324099A1 (en) 2024-09-26
EP4412403A4 (en) 2025-10-01
JPWO2023106055A1 (https=) 2023-06-15
JP7658459B2 (ja) 2025-04-08

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