JP7218677B2 - 基板構造体 - Google Patents

基板構造体 Download PDF

Info

Publication number
JP7218677B2
JP7218677B2 JP2019112115A JP2019112115A JP7218677B2 JP 7218677 B2 JP7218677 B2 JP 7218677B2 JP 2019112115 A JP2019112115 A JP 2019112115A JP 2019112115 A JP2019112115 A JP 2019112115A JP 7218677 B2 JP7218677 B2 JP 7218677B2
Authority
JP
Japan
Prior art keywords
conductive plate
base substrate
sheet
wiring member
main surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2019112115A
Other languages
English (en)
Japanese (ja)
Other versions
JP2020205335A (ja
JP2020205335A5 (enExample
Inventor
俊悟 平谷
慎祐 奥見
有延 中村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Wiring Systems Ltd
AutoNetworks Technologies Ltd
Sumitomo Electric Industries Ltd
Original Assignee
Sumitomo Wiring Systems Ltd
AutoNetworks Technologies Ltd
Sumitomo Electric Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Wiring Systems Ltd, AutoNetworks Technologies Ltd, Sumitomo Electric Industries Ltd filed Critical Sumitomo Wiring Systems Ltd
Priority to JP2019112115A priority Critical patent/JP7218677B2/ja
Priority to PCT/JP2020/021110 priority patent/WO2020255666A1/ja
Priority to US17/619,054 priority patent/US11711887B2/en
Priority to CN202080039857.8A priority patent/CN113906832B/zh
Publication of JP2020205335A publication Critical patent/JP2020205335A/ja
Publication of JP2020205335A5 publication Critical patent/JP2020205335A5/ja
Application granted granted Critical
Publication of JP7218677B2 publication Critical patent/JP7218677B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0207—Cooling of mounted components using internal conductor planes parallel to the surface for thermal conduction, e.g. power planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0263—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10166—Transistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10272—Busbars, i.e. thick metal bars mounted on the printed circuit board [PCB] as high-current conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10507—Involving several components
    • H05K2201/10522—Adjacent components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10507—Involving several components
    • H05K2201/10545—Related components mounted on both sides of the PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10553—Component over metal, i.e. metal plate in between bottom of component and surface of PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10681—Tape Carrier Package [TCP]; Flexible sheet connector
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10977—Encapsulated connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10984—Component carrying a connection agent, e.g. solder, adhesive

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Combinations Of Printed Boards (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Connection Or Junction Boxes (AREA)
JP2019112115A 2019-06-17 2019-06-17 基板構造体 Active JP7218677B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2019112115A JP7218677B2 (ja) 2019-06-17 2019-06-17 基板構造体
PCT/JP2020/021110 WO2020255666A1 (ja) 2019-06-17 2020-05-28 基板構造体
US17/619,054 US11711887B2 (en) 2019-06-17 2020-05-28 Substrate structure
CN202080039857.8A CN113906832B (zh) 2019-06-17 2020-05-28 基板结构体

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2019112115A JP7218677B2 (ja) 2019-06-17 2019-06-17 基板構造体

Publications (3)

Publication Number Publication Date
JP2020205335A JP2020205335A (ja) 2020-12-24
JP2020205335A5 JP2020205335A5 (enExample) 2021-12-02
JP7218677B2 true JP7218677B2 (ja) 2023-02-07

Family

ID=73838528

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2019112115A Active JP7218677B2 (ja) 2019-06-17 2019-06-17 基板構造体

Country Status (4)

Country Link
US (1) US11711887B2 (enExample)
JP (1) JP7218677B2 (enExample)
CN (1) CN113906832B (enExample)
WO (1) WO2020255666A1 (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12122251B2 (en) 2022-09-28 2024-10-22 BorgWarner US Technologies LLC Systems and methods for bidirectional message architecture for inverter for electric vehicle
WO2024069416A1 (en) * 2022-09-28 2024-04-04 Delphi Technologies Ip Limited Systems and methods for low inductance phase switch for inverter for electric vehicle

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000151056A (ja) 1998-11-13 2000-05-30 Nippon Avionics Co Ltd パッケージ
JP2017208508A (ja) 2016-05-20 2017-11-24 株式会社オートネットワーク技術研究所 回路構成体
WO2018123584A1 (ja) 2016-12-28 2018-07-05 株式会社オートネットワーク技術研究所 回路構成体及び電気接続箱

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01127282U (enExample) * 1988-02-24 1989-08-31
US7167377B2 (en) 2001-11-26 2007-01-23 Sumitoo Wiring Systems, Ltd. Circuit-constituting unit and method of producing the same
JP2006005107A (ja) * 2004-06-16 2006-01-05 Auto Network Gijutsu Kenkyusho:Kk 回路構成体
JP2010199514A (ja) * 2009-02-27 2010-09-09 Autonetworks Technologies Ltd 回路構成体
JP6076874B2 (ja) * 2013-09-26 2017-02-08 ルネサスエレクトロニクス株式会社 電子装置、テストボードおよび半導体装置の製造方法
DE112015000733B4 (de) * 2014-05-09 2018-07-19 Autonetworks Technologies, Ltd. Schaltungsbaugruppe, Struktur aus verbundenen Sammelschienen und elektrischer Verteiler
JP2015220814A (ja) * 2014-05-15 2015-12-07 株式会社オートネットワーク技術研究所 配電基板および電気接続箱
JP2016220277A (ja) 2015-05-14 2016-12-22 矢崎総業株式会社 電気接続箱
JP6573215B2 (ja) * 2016-01-27 2019-09-11 株式会社オートネットワーク技術研究所 回路構成体
JP6593597B2 (ja) * 2016-03-16 2019-10-23 株式会社オートネットワーク技術研究所 回路構成体
JP2019087592A (ja) * 2017-11-06 2019-06-06 Tdk株式会社 コンデンサモジュール、共振器、ワイヤレス送電装置、ワイヤレス受電装置、ワイヤレス電力伝送システム

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000151056A (ja) 1998-11-13 2000-05-30 Nippon Avionics Co Ltd パッケージ
JP2017208508A (ja) 2016-05-20 2017-11-24 株式会社オートネットワーク技術研究所 回路構成体
WO2018123584A1 (ja) 2016-12-28 2018-07-05 株式会社オートネットワーク技術研究所 回路構成体及び電気接続箱

Also Published As

Publication number Publication date
WO2020255666A1 (ja) 2020-12-24
CN113906832A (zh) 2022-01-07
US11711887B2 (en) 2023-07-25
JP2020205335A (ja) 2020-12-24
CN113906832B (zh) 2024-09-13
US20220361317A1 (en) 2022-11-10

Similar Documents

Publication Publication Date Title
JP3958589B2 (ja) 電気接続箱
JP4005814B2 (ja) 電気接続箱用配電ユニット及び電気接続箱
CN111316767B (zh) 电路装置
CN108029216B (zh) 电路结构体及电连接箱
CN111373525B (zh) 电路结构体及电接线盒
CN108353501B (zh) 电路结构体
JP3958590B2 (ja) 電気接続箱用配電ユニット及び電気接続箱
CN109757077B (zh) 电路组件以及安装单元
JP7218677B2 (ja) 基板構造体
US20180033714A1 (en) Substrate unit
US10438872B2 (en) Semiconductor device and lead frame
CN112425018B (zh) 电接线盒
US10103096B2 (en) Semiconductor device
CN112400361B (zh) 基板构造体
CN117425957A (zh) 半导体装置
JP7135999B2 (ja) 配線基板
WO2020080248A1 (ja) 回路構造体及び電気接続箱
CN112368834A (zh) 电路基板
JP4175980B2 (ja) 高周波用電力半導体装置
JP2013247192A (ja) パワーモジュール
WO2024185072A1 (ja) 回路体
WO2024166314A1 (ja) 回路体
JP2006074907A (ja) 電源分配装置
JP2020194828A (ja) 基板構造体
JP2017195252A (ja) プリント配線板

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20210928

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20211025

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20220705

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20220829

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20221227

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20230109

R150 Certificate of patent or registration of utility model

Ref document number: 7218677

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150