JP2020205335A5 - - Google Patents

Download PDF

Info

Publication number
JP2020205335A5
JP2020205335A5 JP2019112115A JP2019112115A JP2020205335A5 JP 2020205335 A5 JP2020205335 A5 JP 2020205335A5 JP 2019112115 A JP2019112115 A JP 2019112115A JP 2019112115 A JP2019112115 A JP 2019112115A JP 2020205335 A5 JP2020205335 A5 JP 2020205335A5
Authority
JP
Japan
Prior art keywords
conductive plate
numbered
elements
odd
boundary
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2019112115A
Other languages
English (en)
Japanese (ja)
Other versions
JP2020205335A (ja
JP7218677B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2019112115A priority Critical patent/JP7218677B2/ja
Priority claimed from JP2019112115A external-priority patent/JP7218677B2/ja
Priority to PCT/JP2020/021110 priority patent/WO2020255666A1/ja
Priority to US17/619,054 priority patent/US11711887B2/en
Priority to CN202080039857.8A priority patent/CN113906832B/zh
Publication of JP2020205335A publication Critical patent/JP2020205335A/ja
Publication of JP2020205335A5 publication Critical patent/JP2020205335A5/ja
Application granted granted Critical
Publication of JP7218677B2 publication Critical patent/JP7218677B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2019112115A 2019-06-17 2019-06-17 基板構造体 Active JP7218677B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2019112115A JP7218677B2 (ja) 2019-06-17 2019-06-17 基板構造体
PCT/JP2020/021110 WO2020255666A1 (ja) 2019-06-17 2020-05-28 基板構造体
US17/619,054 US11711887B2 (en) 2019-06-17 2020-05-28 Substrate structure
CN202080039857.8A CN113906832B (zh) 2019-06-17 2020-05-28 基板结构体

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2019112115A JP7218677B2 (ja) 2019-06-17 2019-06-17 基板構造体

Publications (3)

Publication Number Publication Date
JP2020205335A JP2020205335A (ja) 2020-12-24
JP2020205335A5 true JP2020205335A5 (enExample) 2021-12-02
JP7218677B2 JP7218677B2 (ja) 2023-02-07

Family

ID=73838528

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2019112115A Active JP7218677B2 (ja) 2019-06-17 2019-06-17 基板構造体

Country Status (4)

Country Link
US (1) US11711887B2 (enExample)
JP (1) JP7218677B2 (enExample)
CN (1) CN113906832B (enExample)
WO (1) WO2020255666A1 (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12122251B2 (en) 2022-09-28 2024-10-22 BorgWarner US Technologies LLC Systems and methods for bidirectional message architecture for inverter for electric vehicle
WO2024069416A1 (en) * 2022-09-28 2024-04-04 Delphi Technologies Ip Limited Systems and methods for low inductance phase switch for inverter for electric vehicle

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01127282U (enExample) * 1988-02-24 1989-08-31
JP2000151056A (ja) 1998-11-13 2000-05-30 Nippon Avionics Co Ltd パッケージ
US7167377B2 (en) 2001-11-26 2007-01-23 Sumitoo Wiring Systems, Ltd. Circuit-constituting unit and method of producing the same
JP2006005107A (ja) * 2004-06-16 2006-01-05 Auto Network Gijutsu Kenkyusho:Kk 回路構成体
JP2010199514A (ja) * 2009-02-27 2010-09-09 Autonetworks Technologies Ltd 回路構成体
JP6076874B2 (ja) * 2013-09-26 2017-02-08 ルネサスエレクトロニクス株式会社 電子装置、テストボードおよび半導体装置の製造方法
DE112015000733B4 (de) * 2014-05-09 2018-07-19 Autonetworks Technologies, Ltd. Schaltungsbaugruppe, Struktur aus verbundenen Sammelschienen und elektrischer Verteiler
JP2015220814A (ja) * 2014-05-15 2015-12-07 株式会社オートネットワーク技術研究所 配電基板および電気接続箱
JP2016220277A (ja) 2015-05-14 2016-12-22 矢崎総業株式会社 電気接続箱
JP6573215B2 (ja) * 2016-01-27 2019-09-11 株式会社オートネットワーク技術研究所 回路構成体
JP6593597B2 (ja) * 2016-03-16 2019-10-23 株式会社オートネットワーク技術研究所 回路構成体
JP2017208508A (ja) 2016-05-20 2017-11-24 株式会社オートネットワーク技術研究所 回路構成体
JP2018107369A (ja) 2016-12-28 2018-07-05 株式会社オートネットワーク技術研究所 回路構成体及び電気接続箱
JP2019087592A (ja) * 2017-11-06 2019-06-06 Tdk株式会社 コンデンサモジュール、共振器、ワイヤレス送電装置、ワイヤレス受電装置、ワイヤレス電力伝送システム

Similar Documents

Publication Publication Date Title
JP2017028252A5 (ja) トランジスタ
JP2010093109A5 (enExample)
JP2015156800A5 (ja) パワー半導体装置
JP2016110114A5 (ja) 表示装置
JP2014096591A5 (enExample)
JP2019212656A5 (enExample)
JP2019101062A5 (enExample)
JP2016092411A5 (enExample)
WO2015184152A3 (en) Wire bond support structure and microelectronic package including wire bonds therefrom
JP2018182320A5 (enExample)
JP2010164939A5 (enExample)
JP2012015480A5 (enExample)
JP2018137324A5 (enExample)
JP2014131041A5 (enExample)
JP2017116928A5 (ja) 表示パネル
JP2014068015A5 (enExample)
JP2010107595A5 (enExample)
JP2015187695A5 (enExample)
JP2019175924A5 (enExample)
JP2020205335A5 (enExample)
JPWO2021070366A5 (enExample)
JP2020017623A5 (enExample)
JP2015050384A5 (enExample)
JP2012253855A5 (enExample)
PH12017501997A1 (en) Lead carrier with print formed package components and conductive path redistribution structures