JP7215982B2 - プリント基板及びディスク装置 - Google Patents

プリント基板及びディスク装置 Download PDF

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Publication number
JP7215982B2
JP7215982B2 JP2019168609A JP2019168609A JP7215982B2 JP 7215982 B2 JP7215982 B2 JP 7215982B2 JP 2019168609 A JP2019168609 A JP 2019168609A JP 2019168609 A JP2019168609 A JP 2019168609A JP 7215982 B2 JP7215982 B2 JP 7215982B2
Authority
JP
Japan
Prior art keywords
pad
metal layer
printed circuit
pads
circuit board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2019168609A
Other languages
English (en)
Japanese (ja)
Other versions
JP2021048179A5 (https=
JP2021048179A (ja
Inventor
聖和 石崎
展大 山本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Toshiba Electronic Devices and Storage Corp
Original Assignee
Toshiba Corp
Toshiba Electronic Devices and Storage Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Toshiba Electronic Devices and Storage Corp filed Critical Toshiba Corp
Priority to JP2019168609A priority Critical patent/JP7215982B2/ja
Priority to US16/784,301 priority patent/US11178760B2/en
Publication of JP2021048179A publication Critical patent/JP2021048179A/ja
Publication of JP2021048179A5 publication Critical patent/JP2021048179A5/ja
Priority to JP2023006568A priority patent/JP2023041744A/ja
Application granted granted Critical
Publication of JP7215982B2 publication Critical patent/JP7215982B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3452—Solder masks
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
    • G11B5/48—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed
    • G11B5/54—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed with provision for moving the head into or out of its operative position or across tracks
    • G11B5/55—Track change, selection or acquisition by displacement of the head
    • G11B5/5521—Track change, selection or acquisition by displacement of the head across disk tracks
    • G11B5/5582—Track change, selection or acquisition by displacement of the head across disk tracks system adaptation for working during or after external perturbation, e.g. in the presence of a mechanical oscillation caused by a shock
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
    • G11B5/74—Record carriers characterised by the form, e.g. sheet shaped to wrap around a drum
    • G11B5/82—Disk carriers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0286—Programmable, customizable or modifiable circuits
    • H05K1/0295—Programmable, customizable or modifiable circuits adapted for choosing between different types or different locations of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/09381—Shape of non-curved single flat metallic pad, land or exposed part thereof; Shape of electrode of leadless component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09954—More mounting possibilities, e.g. on same place of PCB, or by using different sets of edge pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10015—Non-printed capacitor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10159—Memory

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Structure Of Printed Boards (AREA)
JP2019168609A 2019-09-17 2019-09-17 プリント基板及びディスク装置 Active JP7215982B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2019168609A JP7215982B2 (ja) 2019-09-17 2019-09-17 プリント基板及びディスク装置
US16/784,301 US11178760B2 (en) 2019-09-17 2020-02-07 Printed circuit board
JP2023006568A JP2023041744A (ja) 2019-09-17 2023-01-19 プリント基板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2019168609A JP7215982B2 (ja) 2019-09-17 2019-09-17 プリント基板及びディスク装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2023006568A Division JP2023041744A (ja) 2019-09-17 2023-01-19 プリント基板

Publications (3)

Publication Number Publication Date
JP2021048179A JP2021048179A (ja) 2021-03-25
JP2021048179A5 JP2021048179A5 (https=) 2021-10-28
JP7215982B2 true JP7215982B2 (ja) 2023-01-31

Family

ID=74869128

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2019168609A Active JP7215982B2 (ja) 2019-09-17 2019-09-17 プリント基板及びディスク装置
JP2023006568A Pending JP2023041744A (ja) 2019-09-17 2023-01-19 プリント基板

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2023006568A Pending JP2023041744A (ja) 2019-09-17 2023-01-19 プリント基板

Country Status (2)

Country Link
US (1) US11178760B2 (https=)
JP (2) JP7215982B2 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11844176B2 (en) 2021-06-24 2023-12-12 Samsung Electronics Co., Ltd. Printed circuit board
JP2023141009A (ja) 2022-03-23 2023-10-05 株式会社東芝 プリント回路基板およびディスク装置
JP2025031250A (ja) * 2023-08-25 2025-03-07 株式会社日立製作所 制御基板及びその製造方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010212318A (ja) 2009-03-09 2010-09-24 Sharp Corp プリント配線基板および部品実装構造体
JP2012015329A (ja) 2010-06-30 2012-01-19 Toshiba Lighting & Technology Corp 回路板
JP2015135906A (ja) 2014-01-17 2015-07-27 富士通株式会社 プリント配線板および情報処理装置

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63106171U (https=) * 1986-12-27 1988-07-08
JPS63302595A (ja) * 1987-06-02 1988-12-09 Murata Mfg Co Ltd チップ部品の取付構造
JPH01214195A (ja) * 1988-02-23 1989-08-28 Matsushita Electric Works Ltd プリント基板
JPH0265293A (ja) * 1988-08-31 1990-03-05 Toyo Commun Equip Co Ltd 表面実装用プリント板のパターン
US5453581A (en) * 1993-08-30 1995-09-26 Motorola, Inc. Pad arrangement for surface mount components
JP2568816B2 (ja) 1995-08-25 1997-01-08 松下電器産業株式会社 電子部品の半田付け方法
US6169253B1 (en) * 1998-06-08 2001-01-02 Visteon Global Technologies, Inc. Solder resist window configurations for solder paste overprinting
JP2001308503A (ja) 2000-04-26 2001-11-02 Koichi Yamazaki はんだ付け用電極構造
JP2003243814A (ja) * 2002-02-21 2003-08-29 Hitachi Ltd チップ部品の実装用ランド
JP2003298220A (ja) * 2002-03-29 2003-10-17 Hitachi Ltd 回路基板および電子機器、およびそれらの製造方法
JP2004296718A (ja) * 2003-03-26 2004-10-21 Fuji Photo Film Co Ltd プリント配線板、及び駆動回路基板の製造方法
TWI232561B (en) * 2003-10-17 2005-05-11 Advanced Semiconductor Eng Substrate having bond pads for bonding redundant solder beads
TWI244362B (en) * 2004-01-07 2005-11-21 Via Tech Inc Circuit carrier and electric package structure thereof
JP2006303252A (ja) 2005-04-21 2006-11-02 Alps Electric Co Ltd 回路基板
US7967184B2 (en) * 2005-11-16 2011-06-28 Sandisk Corporation Padless substrate for surface mounted components
JP2008123722A (ja) 2006-11-08 2008-05-29 Sumitomo Electric Ind Ltd 冷陰極蛍光ランプ用電極材料
TWI337055B (en) * 2007-06-22 2011-02-01 Delta Electronics Inc Universal solder pad structure
KR20090079687A (ko) * 2008-01-18 2009-07-22 삼성전자주식회사 인쇄 회로 기판과 그 실장 방법 및 이를 포함하는 액정표시 장치
JP4852111B2 (ja) 2009-01-15 2012-01-11 三菱電機株式会社 プリント配線基板
JP4929382B2 (ja) * 2010-07-13 2012-05-09 株式会社東芝 電子部品構造体及び電子機器
JP2012064720A (ja) 2010-09-15 2012-03-29 Toshiba Corp 電子機器
JP2014003101A (ja) * 2012-06-15 2014-01-09 Toshiba Corp 回路板、電子機器
JP6362889B2 (ja) * 2013-04-26 2018-07-25 日立オートモティブシステムズ株式会社 電子制御装置
JP6376386B2 (ja) * 2014-09-25 2018-08-22 株式会社デンソー 配線基板

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010212318A (ja) 2009-03-09 2010-09-24 Sharp Corp プリント配線基板および部品実装構造体
JP2012015329A (ja) 2010-06-30 2012-01-19 Toshiba Lighting & Technology Corp 回路板
JP2015135906A (ja) 2014-01-17 2015-07-27 富士通株式会社 プリント配線板および情報処理装置

Also Published As

Publication number Publication date
US20210084760A1 (en) 2021-03-18
JP2023041744A (ja) 2023-03-24
US11178760B2 (en) 2021-11-16
JP2021048179A (ja) 2021-03-25

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