JP7213919B2 - 炭化ホウ素焼結体及びこれを含むエッチング装置 - Google Patents
炭化ホウ素焼結体及びこれを含むエッチング装置 Download PDFInfo
- Publication number
- JP7213919B2 JP7213919B2 JP2021099607A JP2021099607A JP7213919B2 JP 7213919 B2 JP7213919 B2 JP 7213919B2 JP 2021099607 A JP2021099607 A JP 2021099607A JP 2021099607 A JP2021099607 A JP 2021099607A JP 7213919 B2 JP7213919 B2 JP 7213919B2
- Authority
- JP
- Japan
- Prior art keywords
- boron carbide
- sintered body
- carbide sintered
- sintering
- boron
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- INAHAJYZKVIDIZ-UHFFFAOYSA-N boron carbide Chemical compound B12B3B4C32B41 INAHAJYZKVIDIZ-UHFFFAOYSA-N 0.000 title claims description 174
- 229910052580 B4C Inorganic materials 0.000 title claims description 171
- 238000005530 etching Methods 0.000 title claims description 37
- 238000005245 sintering Methods 0.000 claims description 80
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 46
- 238000004519 manufacturing process Methods 0.000 claims description 44
- 229910052799 carbon Inorganic materials 0.000 claims description 43
- 239000002245 particle Substances 0.000 claims description 41
- 239000002994 raw material Substances 0.000 claims description 26
- 238000000465 moulding Methods 0.000 claims description 18
- 229910052810 boron oxide Inorganic materials 0.000 claims description 16
- 239000003795 chemical substances by application Substances 0.000 claims description 16
- JKWMSGQKBLHBQQ-UHFFFAOYSA-N diboron trioxide Chemical compound O=BOB=O JKWMSGQKBLHBQQ-UHFFFAOYSA-N 0.000 claims description 16
- 239000011148 porous material Substances 0.000 claims description 14
- -1 fluorine ions Chemical class 0.000 claims description 12
- 238000003763 carbonization Methods 0.000 claims description 8
- 238000001020 plasma etching Methods 0.000 claims description 7
- 229910052710 silicon Inorganic materials 0.000 claims description 7
- 239000010703 silicon Substances 0.000 claims description 7
- 229910052801 chlorine Inorganic materials 0.000 claims description 4
- 239000000460 chlorine Substances 0.000 claims description 4
- 229910052731 fluorine Inorganic materials 0.000 claims description 4
- 239000011737 fluorine Substances 0.000 claims description 4
- 238000010000 carbonizing Methods 0.000 claims description 2
- 238000000034 method Methods 0.000 description 37
- 239000000463 material Substances 0.000 description 22
- 230000008569 process Effects 0.000 description 21
- 239000000843 powder Substances 0.000 description 19
- 238000012545 processing Methods 0.000 description 11
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 11
- 229910010271 silicon carbide Inorganic materials 0.000 description 11
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 9
- 239000000654 additive Substances 0.000 description 9
- 229910052796 boron Inorganic materials 0.000 description 9
- 239000000758 substrate Substances 0.000 description 9
- 239000007789 gas Substances 0.000 description 8
- 239000012298 atmosphere Substances 0.000 description 7
- 238000000151 deposition Methods 0.000 description 7
- 230000000704 physical effect Effects 0.000 description 7
- 238000002360 preparation method Methods 0.000 description 7
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 6
- 230000000996 additive effect Effects 0.000 description 6
- 229920005989 resin Polymers 0.000 description 6
- 239000011347 resin Substances 0.000 description 6
- 239000002002 slurry Substances 0.000 description 6
- 239000002904 solvent Substances 0.000 description 6
- 230000007797 corrosion Effects 0.000 description 5
- 238000005260 corrosion Methods 0.000 description 5
- 230000008021 deposition Effects 0.000 description 5
- 238000005469 granulation Methods 0.000 description 5
- 230000003179 granulation Effects 0.000 description 5
- 239000012535 impurity Substances 0.000 description 5
- 239000010410 layer Substances 0.000 description 5
- 239000000126 substance Substances 0.000 description 5
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 4
- 239000000443 aerosol Substances 0.000 description 4
- 238000005229 chemical vapour deposition Methods 0.000 description 4
- 239000011247 coating layer Substances 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- 238000001816 cooling Methods 0.000 description 4
- 238000002844 melting Methods 0.000 description 4
- 230000008018 melting Effects 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- 238000005240 physical vapour deposition Methods 0.000 description 4
- 238000007493 shaping process Methods 0.000 description 4
- 229910052582 BN Inorganic materials 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 3
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 3
- 229910052581 Si3N4 Inorganic materials 0.000 description 3
- 238000000498 ball milling Methods 0.000 description 3
- 238000009694 cold isostatic pressing Methods 0.000 description 3
- 238000011156 evaluation Methods 0.000 description 3
- 230000014509 gene expression Effects 0.000 description 3
- 229910052736 halogen Inorganic materials 0.000 description 3
- 238000002347 injection Methods 0.000 description 3
- 239000007924 injection Substances 0.000 description 3
- 238000003825 pressing Methods 0.000 description 3
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 3
- 238000005507 spraying Methods 0.000 description 3
- KLZUFWVZNOTSEM-UHFFFAOYSA-K Aluminium flouride Chemical compound F[Al](F)F KLZUFWVZNOTSEM-UHFFFAOYSA-K 0.000 description 2
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 239000006227 byproduct Substances 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 239000000356 contaminant Substances 0.000 description 2
- 229910002804 graphite Inorganic materials 0.000 description 2
- 239000010439 graphite Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000003754 machining Methods 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 239000003607 modifier Substances 0.000 description 2
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 2
- 238000007750 plasma spraying Methods 0.000 description 2
- 239000002952 polymeric resin Substances 0.000 description 2
- 229910052814 silicon oxide Inorganic materials 0.000 description 2
- 239000006104 solid solution Substances 0.000 description 2
- 230000003746 surface roughness Effects 0.000 description 2
- 229920003002 synthetic resin Polymers 0.000 description 2
- 238000007740 vapor deposition Methods 0.000 description 2
- 238000005019 vapor deposition process Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 238000007088 Archimedes method Methods 0.000 description 1
- QYEXBYZXHDUPRC-UHFFFAOYSA-N B#[Ti]#B Chemical compound B#[Ti]#B QYEXBYZXHDUPRC-UHFFFAOYSA-N 0.000 description 1
- 229910015844 BCl3 Inorganic materials 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000002202 Polyethylene glycol Substances 0.000 description 1
- 229910033181 TiB2 Inorganic materials 0.000 description 1
- 229910008999 W2B5 Inorganic materials 0.000 description 1
- 239000003082 abrasive agent Substances 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 229910002090 carbon oxide Inorganic materials 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000005137 deposition process Methods 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000013013 elastic material Substances 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000013538 functional additive Substances 0.000 description 1
- 239000008187 granular material Substances 0.000 description 1
- 238000009499 grossing Methods 0.000 description 1
- 229910052741 iridium Inorganic materials 0.000 description 1
- GKOZUEZYRPOHIO-UHFFFAOYSA-N iridium atom Chemical compound [Ir] GKOZUEZYRPOHIO-UHFFFAOYSA-N 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 238000011068 loading method Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910003465 moissanite Inorganic materials 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 238000007517 polishing process Methods 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 238000010248 power generation Methods 0.000 description 1
- 239000002243 precursor Substances 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 238000002490 spark plasma sintering Methods 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- FAQYAMRNWDIXMY-UHFFFAOYSA-N trichloroborane Chemical compound ClB(Cl)Cl FAQYAMRNWDIXMY-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32623—Mechanical discharge control means
- H01J37/32642—Focus rings
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E30/00—Energy generation of nuclear origin
- Y02E30/30—Nuclear fission reactors
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Ceramic Products (AREA)
- Drying Of Semiconductors (AREA)
Description
Claims (11)
- 原料物質を成形してグリーン体を製造する1次成形ステップと、
前記グリーン体を炭化及び焼結させて炭化ホウ素焼結体を製造する焼結体形成ステップとを含み、
前記原料物質は、炭化ホウ素と焼結特性改善剤を含み、
前記焼結特性改善剤は、ボロンオキサイドおよびカーボンを含み、
前記原料物質は、前記ボロンオキサイドを1重量%~9重量を含み、前記カーボンを5重量%~15重量を含み、
前記炭化は、600℃~900℃の温度で行われ、
前記焼結は、1800℃~2500℃の温度で行われる、炭化ホウ素焼結体の製造方法。 - 前記焼結体形成ステップは、常圧で実施される、請求項1に記載の炭化ホウ素焼結体の製造方法。
- 前記炭化ホウ素焼結体が、炭化ホウ素含有粒子がネッキングされたものであって、400℃で測定した熱伝導度の値が27W/(m*k)以下であり、25℃で測定した熱伝導度の値と800℃で測定した熱伝導度の値との比率が1:0.2~3である、請求項1または2に記載の炭化ホウ素焼結体の製造方法。
- 前記炭化ホウ素含有粒子は、粒径(D50)が1.5μm以下である、請求項3に記載の炭化ホウ素焼結体の製造方法。
- 前記炭化ホウ素焼結体が、表面で測定したRa粗さが0.1μm~1.2μmである、請求項1から3のいずれかに記載の炭化ホウ素焼結体の製造方法。
- 前記炭化ホウ素焼結体が、空隙率が3%以下である、請求項1から3のいずれかに記載の炭化ホウ素焼結体の製造方法。
- 前記炭化ホウ素焼結体が、表面または断面で観察される気孔の平均直径が5μm以下である、請求項1から3のいずれかに記載の炭化ホウ素焼結体の製造方法。
- 前記炭化ホウ素焼結体が、表面または断面で観察される気孔の直径が10μm以上である部分の面積が5%以下である、請求項1から3のいずれかに記載の炭化ホウ素焼結体の製造方法。
- 前記炭化ホウ素焼結体が、プラズマエッチング装置内でフッ素イオンまたは塩素イオンと接触してパーティクルを形成しない、請求項1から3のいずれかに記載の炭化ホウ素焼結体の製造方法。
- 前記炭化ホウ素焼結体が、シリコンに比べて55%以下のエッチング率を有する、請求項1から3のいずれかに記載の炭化ホウ素焼結体の製造方法。
- 前記炭化ホウ素焼結体が、CVD-SiCに比べて70%以下のエッチング率を有する、請求項1から3のいずれかに記載の炭化ホウ素焼結体の製造方法。
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2018-0094196 | 2018-08-13 | ||
KR20180094196 | 2018-08-13 | ||
KR1020190005482A KR20200019068A (ko) | 2018-08-13 | 2019-01-16 | 탄화붕소 소결체 및 이를 포함하는 식각장치 |
KR10-2019-0005482 | 2019-01-16 | ||
JP2019147330A JP2020073420A (ja) | 2018-08-13 | 2019-08-09 | 炭化ホウ素焼結体及びこれを含むエッチング装置 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2019147330A Division JP2020073420A (ja) | 2018-08-13 | 2019-08-09 | 炭化ホウ素焼結体及びこれを含むエッチング装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2021151949A JP2021151949A (ja) | 2021-09-30 |
JP7213919B2 true JP7213919B2 (ja) | 2023-01-27 |
Family
ID=69671017
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2019147330A Pending JP2020073420A (ja) | 2018-08-13 | 2019-08-09 | 炭化ホウ素焼結体及びこれを含むエッチング装置 |
JP2021099607A Active JP7213919B2 (ja) | 2018-08-13 | 2021-06-15 | 炭化ホウ素焼結体及びこれを含むエッチング装置 |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2019147330A Pending JP2020073420A (ja) | 2018-08-13 | 2019-08-09 | 炭化ホウ素焼結体及びこれを含むエッチング装置 |
Country Status (3)
Country | Link |
---|---|
JP (2) | JP2020073420A (ja) |
KR (8) | KR20200019070A (ja) |
TW (2) | TWI722531B (ja) |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102364295B1 (ko) | 2020-02-28 | 2022-02-21 | 한국과학기술연구원 | 탄화붕소 복합재료 및 그의 제조방법 |
KR102249470B1 (ko) * | 2020-05-19 | 2021-05-07 | 비씨엔씨 주식회사 | 입자성장을 억제한 고밀도 보론카바이드 세라믹 제조방법 및 제조된 세라믹 소결체 |
KR102216815B1 (ko) * | 2020-07-02 | 2021-02-18 | 주식회사 티씨케이 | 탄화붕소 내플라즈마 부재를 포함하는 반도체 제조용 부품 |
KR102262340B1 (ko) * | 2020-07-02 | 2021-06-09 | 주식회사 티씨케이 | 탄화붕소 소재 |
US20220068614A1 (en) * | 2020-08-28 | 2022-03-03 | Coorstek Kk | Semiconductor manufacturing member and manufacturing method therefor |
KR102513077B1 (ko) * | 2021-02-09 | 2023-03-24 | 주식회사 티씨케이 | 탄화붕소 내플라즈마 부재를 포함하는 반도체 제조용 부품 |
KR102320333B1 (ko) | 2021-05-25 | 2021-11-03 | (주)케이디엠씨 | 플라즈마 강화 화학 기상증착 장비용 중대형 세라믹 부품의 제조방법 및 이에 의해 제조되는 플라즈마 강화 화학 기상증착 장비용 중대형 세라믹 부품 |
CN113345615B (zh) * | 2021-05-31 | 2022-12-27 | 中国工程物理研究院材料研究所 | 一种石蜡/碳化硼中子防护复合材料及制备方法 |
KR102419521B1 (ko) * | 2021-08-26 | 2022-07-12 | 비씨엔씨 주식회사 | 보론카바이드 소결체 제조 장치 |
KR102419533B1 (ko) * | 2021-11-25 | 2022-07-11 | 비씨엔씨 주식회사 | 파티클 발생 최소화에 유리한 치밀한 보론카바이드 재질의 반도체 제조공정용 엣지링 및 그 제조방법 |
WO2024010100A1 (ko) * | 2022-07-04 | 2024-01-11 | 주식회사 티씨케이 | 탄화붕소 내플라즈마 부재를 포함하는 반도체 제조용 부품 |
KR20240059212A (ko) * | 2022-10-27 | 2024-05-07 | 솔믹스 주식회사 | 소결체 및 이를 포함하는 부품 |
KR20240071121A (ko) * | 2022-11-15 | 2024-05-22 | 솔믹스 주식회사 | 소결체 및 이를 포함하는 부품 |
KR102567529B1 (ko) * | 2022-11-18 | 2023-08-14 | 에스케이엔펄스 주식회사 | 포커스 링, 이의 제조방법, 이를 포함하는 반도체 소자 제조 장치 및 반도체 소자의 제조 방법 |
KR102566972B1 (ko) * | 2022-11-18 | 2023-08-16 | 에스케이엔펄스 주식회사 | 반도체 소자 제조 장치용 부품, 이의 제조방법, 이를 포함하는 반도체 소자 제조 장치 및 반도체 소자의 제조 방법 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000302551A (ja) | 1999-04-15 | 2000-10-31 | Denki Kagaku Kogyo Kk | リチウム二次電池負極用炭素材料及び黒鉛化促進剤 |
JP2005018992A (ja) | 2003-06-23 | 2005-01-20 | Ibiden Co Ltd | プラズマ発生装置用電極埋設部材 |
KR20090093819A (ko) | 2008-02-28 | 2009-09-02 | 코바렌트 마테리얼 가부시키가이샤 | 플라즈마 처리 장치에 이용되는 소결체 및 부재 |
CN102503429A (zh) | 2011-10-17 | 2012-06-20 | 宁波伏尔肯机械密封件制造有限公司 | 常压烧结碳化硼陶瓷的制备方法 |
CN105924176A (zh) | 2016-04-25 | 2016-09-07 | 北京理工大学 | 碳化硼基复相陶瓷及其放电等离子烧结制备方法 |
WO2017038555A1 (ja) | 2015-09-03 | 2017-03-09 | 住友大阪セメント株式会社 | フォーカスリング、フォーカスリングの製造方法 |
Family Cites Families (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03268303A (ja) * | 1990-03-16 | 1991-11-29 | Tdk Corp | サーミスタ材料およびサーミスタ素子 |
US5904778A (en) * | 1996-07-26 | 1999-05-18 | Applied Materials, Inc. | Silicon carbide composite article particularly useful for plasma reactors |
US6120640A (en) | 1996-12-19 | 2000-09-19 | Applied Materials, Inc. | Boron carbide parts and coatings in a plasma reactor |
JP3500278B2 (ja) * | 1997-09-29 | 2004-02-23 | 京セラ株式会社 | 半導体製造用耐食性部材 |
JP3667062B2 (ja) * | 1997-12-01 | 2005-07-06 | 京セラ株式会社 | 炭化ホウ素焼結体の製造方法 |
JPH11279761A (ja) * | 1998-03-31 | 1999-10-12 | Kyocera Corp | 耐食性部材 |
US6123791A (en) * | 1998-07-29 | 2000-09-26 | Applied Materials, Inc. | Ceramic composition for an apparatus and method for processing a substrate |
JP3865973B2 (ja) * | 1999-06-29 | 2007-01-10 | 京セラ株式会社 | ウエハ加熱装置 |
KR100419778B1 (ko) | 2001-02-16 | 2004-02-21 | 한국에너지기술연구원 | 액상 반응소결에 의한 탄화규소-탄화붕소 복합체 제조방법 |
JP3561476B2 (ja) * | 2001-03-08 | 2004-09-02 | 独立行政法人産業技術総合研究所 | 炭化硼素−二硼化クロム焼結体とその製造方法 |
KR100802328B1 (ko) | 2005-04-07 | 2008-02-13 | 주식회사 솔믹스 | 내마모성 금속기지 복합체 코팅층 형성방법 및 이를이용하여 제조된 코팅층 |
KR100722484B1 (ko) * | 2005-07-21 | 2007-05-28 | 주식회사 혁신전공사 | 에스에스알 모듈을 이용한 철도 신호기 제어용 전용카드 |
JP2007247743A (ja) * | 2006-03-15 | 2007-09-27 | Nissan Motor Co Ltd | 電磁遮断弁およびその制御方法 |
JP4854482B2 (ja) * | 2006-11-29 | 2012-01-18 | 京セラ株式会社 | 炭化硼素質焼結体およびその製造方法 |
TWI427334B (zh) * | 2007-02-05 | 2014-02-21 | Zeiss Carl Smt Gmbh | Euv蝕刻裝置反射光學元件 |
KR100999401B1 (ko) | 2008-09-22 | 2010-12-09 | 충남대학교산학협력단 | 자전연소반응을 이용한 탄화붕소 분말의 제조방법 |
KR101678085B1 (ko) * | 2010-02-09 | 2016-11-21 | 스미토모 오사카 세멘토 가부시키가이샤 | 소결체, 그 제조 방법 및 고주파 투과 재료 |
CN102644131B (zh) | 2012-04-16 | 2013-12-04 | 夏华松 | 碳化硼高聚纤维 |
JP2015115421A (ja) * | 2013-12-10 | 2015-06-22 | 東京エレクトロン株式会社 | プラズマ処理装置及びフォーカスリング |
KR101723675B1 (ko) | 2015-04-30 | 2017-04-06 | (주)단단 | 전기전도성 탄화규소-질화붕소 복합 소재 제조용 조성물 및 이를 이용한 전기전도성 탄화규소-질화붕소 복합 소재의 제조방법 |
JP2017135159A (ja) * | 2016-01-25 | 2017-08-03 | 学校法人同志社 | 炭化ホウ素セラミックスからなる熱電素子及びその製造方法 |
KR20180080520A (ko) * | 2017-01-04 | 2018-07-12 | 삼성전자주식회사 | 포커스 링 및 이를 포함하는 플라즈마 처리 장치 |
KR20180093814A (ko) * | 2017-02-14 | 2018-08-22 | 에스케이씨솔믹스 주식회사 | 보론카바이드를 포함하는 플라즈마 처리장치 및 그 제조방법 |
KR102104158B1 (ko) * | 2017-04-19 | 2020-04-23 | 에스케이씨솔믹스 주식회사 | 반응 결합 보론카바이드를 포함하는 플라즈마 처리장치 및 그 제조방법 |
-
2019
- 2019-01-16 KR KR1020190005506A patent/KR20200019070A/ko not_active Application Discontinuation
- 2019-01-16 KR KR1020190005490A patent/KR20200019069A/ko not_active Application Discontinuation
- 2019-01-16 KR KR1020190005482A patent/KR20200019068A/ko not_active Application Discontinuation
- 2019-08-09 KR KR1020190097469A patent/KR102095159B1/ko active IP Right Grant
- 2019-08-09 JP JP2019147330A patent/JP2020073420A/ja active Pending
- 2019-08-12 TW TW108128484A patent/TWI722531B/zh active
- 2019-08-12 TW TW108128500A patent/TWI704601B/zh active
-
2020
- 2020-03-13 KR KR1020200031187A patent/KR102510986B1/ko active IP Right Grant
- 2020-03-13 KR KR1020200031189A patent/KR102510985B1/ko active IP Right Grant
- 2020-03-13 KR KR1020200031188A patent/KR20200032061A/ko not_active Application Discontinuation
- 2020-03-19 KR KR1020200033730A patent/KR102453218B1/ko active IP Right Grant
-
2021
- 2021-06-15 JP JP2021099607A patent/JP7213919B2/ja active Active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000302551A (ja) | 1999-04-15 | 2000-10-31 | Denki Kagaku Kogyo Kk | リチウム二次電池負極用炭素材料及び黒鉛化促進剤 |
JP2005018992A (ja) | 2003-06-23 | 2005-01-20 | Ibiden Co Ltd | プラズマ発生装置用電極埋設部材 |
KR20090093819A (ko) | 2008-02-28 | 2009-09-02 | 코바렌트 마테리얼 가부시키가이샤 | 플라즈마 처리 장치에 이용되는 소결체 및 부재 |
CN102503429A (zh) | 2011-10-17 | 2012-06-20 | 宁波伏尔肯机械密封件制造有限公司 | 常压烧结碳化硼陶瓷的制备方法 |
WO2017038555A1 (ja) | 2015-09-03 | 2017-03-09 | 住友大阪セメント株式会社 | フォーカスリング、フォーカスリングの製造方法 |
CN105924176A (zh) | 2016-04-25 | 2016-09-07 | 北京理工大学 | 碳化硼基复相陶瓷及其放电等离子烧结制备方法 |
Also Published As
Publication number | Publication date |
---|---|
JP2021151949A (ja) | 2021-09-30 |
KR102510986B1 (ko) | 2023-03-17 |
TW202009990A (zh) | 2020-03-01 |
TWI722531B (zh) | 2021-03-21 |
KR20200032061A (ko) | 2020-03-25 |
KR20200019068A (ko) | 2020-02-21 |
KR20200032062A (ko) | 2020-03-25 |
TWI704601B (zh) | 2020-09-11 |
KR20200034686A (ko) | 2020-03-31 |
KR20200032060A (ko) | 2020-03-25 |
KR102453218B1 (ko) | 2022-10-13 |
KR20200019070A (ko) | 2020-02-21 |
TW202009229A (zh) | 2020-03-01 |
KR20200019069A (ko) | 2020-02-21 |
KR20200019094A (ko) | 2020-02-21 |
KR102510985B1 (ko) | 2023-03-17 |
KR102095159B1 (ko) | 2020-03-31 |
JP2020073420A (ja) | 2020-05-14 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP7213919B2 (ja) | 炭化ホウ素焼結体及びこれを含むエッチング装置 | |
JP7307769B2 (ja) | エッチング装置用リング状部品及びこれを用いた基板のエッチング方法 | |
CN110818422A (zh) | 碳化硼烧结体及包含该碳化硼烧结体的蚀刻装置 | |
WO1999018258A1 (fr) | Baguette d'electrode pour depot par etincelles et procede de production, et procede de recouvrement par une couche contenant un superabrasif | |
JP6264846B2 (ja) | 酸化物焼結体、スパッタリングターゲットおよびその製造方法 | |
TW200405771A (en) | Coated silicon carbide cermet used in a plasma reactor | |
US20090105062A1 (en) | Sintered Wear-Resistant Boride Material, Sinterable Powder Mixture, for Producing Said Material, Method for Producing the Material and Use Thereof | |
TWI773135B (zh) | 陶瓷部件、其製備方法以及聚焦環 | |
JP2018532673A (ja) | リソグラフィに基づく製造によるダイヤモンド複合体 | |
JP6540863B2 (ja) | 溶射成形体 | |
KR102124766B1 (ko) | 플라즈마 처리 장치 및 그 제조방법 | |
TWI385138B (zh) | Ceramic components and corrosion resistance components | |
JP6346593B2 (ja) | 炭化ホウ素の焼結体の製造方法 | |
TWI779071B (zh) | 熱噴塗材料、其熱噴塗皮膜及其製造方法 | |
JPS632913B2 (ja) | ||
KR101308907B1 (ko) | 저저항, 고열전도도 베타상 탄화규소 소재 제조용 조성물, 탄화규소 소재 및 소재의 제조방법 | |
JP4376479B2 (ja) | Si−SiC複合材の製造方法 | |
JP7444986B2 (ja) | セラミック部品及びそれを含むプラズマエッチング装置 | |
KR102234171B1 (ko) | 저저항 실리콘카바이드계 복합체의 제조방법 | |
JP2016014191A (ja) | セラミックス円筒形スパッタリングターゲット材およびその製造方法 | |
CN115244209A (zh) | 新型的钨系喷镀覆膜和用于获得其的喷镀用材料 | |
JP2002293632A (ja) | 成形用型 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20210615 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20220705 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20221003 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20221220 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20230117 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 7213919 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
S533 | Written request for registration of change of name |
Free format text: JAPANESE INTERMEDIATE CODE: R313533 |
|
R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
|
S111 | Request for change of ownership or part of ownership |
Free format text: JAPANESE INTERMEDIATE CODE: R313113 |