JP7212831B2 - 導電性接着剤組成物及びこれを用いた接続構造体 - Google Patents
導電性接着剤組成物及びこれを用いた接続構造体 Download PDFInfo
- Publication number
- JP7212831B2 JP7212831B2 JP2019529807A JP2019529807A JP7212831B2 JP 7212831 B2 JP7212831 B2 JP 7212831B2 JP 2019529807 A JP2019529807 A JP 2019529807A JP 2019529807 A JP2019529807 A JP 2019529807A JP 7212831 B2 JP7212831 B2 JP 7212831B2
- Authority
- JP
- Japan
- Prior art keywords
- adhesive composition
- conductive adhesive
- circuit board
- semiconductor light
- conductive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000000853 adhesive Substances 0.000 title claims description 116
- 230000001070 adhesive effect Effects 0.000 title claims description 116
- 239000000203 mixture Substances 0.000 title claims description 103
- 239000002245 particle Substances 0.000 claims description 65
- 239000004065 semiconductor Substances 0.000 claims description 62
- 229910052751 metal Inorganic materials 0.000 claims description 33
- 239000002184 metal Substances 0.000 claims description 32
- 238000002844 melting Methods 0.000 claims description 29
- 230000008018 melting Effects 0.000 claims description 29
- 230000004907 flux Effects 0.000 claims description 28
- 229920005989 resin Polymers 0.000 claims description 27
- 239000011347 resin Substances 0.000 claims description 27
- LCFVJGUPQDGYKZ-UHFFFAOYSA-N Bisphenol A diglycidyl ether Chemical class C=1C=C(OCC2OC2)C=CC=1C(C)(C)C(C=C1)=CC=C1OCC1CO1 LCFVJGUPQDGYKZ-UHFFFAOYSA-N 0.000 claims description 24
- 239000000758 substrate Substances 0.000 claims description 24
- 229920000768 polyamine Polymers 0.000 claims description 19
- 239000012190 activator Substances 0.000 claims description 16
- 150000001875 compounds Chemical class 0.000 claims description 13
- 238000010438 heat treatment Methods 0.000 claims description 8
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims description 5
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 5
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 3
- 229910052797 bismuth Inorganic materials 0.000 claims description 3
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 claims description 3
- 125000004432 carbon atom Chemical group C* 0.000 claims description 3
- 229910052738 indium Inorganic materials 0.000 claims description 3
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims description 3
- 235000011837 pasties Nutrition 0.000 claims description 3
- 229910052718 tin Inorganic materials 0.000 claims description 3
- FEWJPZIEWOKRBE-UHFFFAOYSA-N Tartaric acid Natural products [H+].[H+].[O-]C(=O)C(O)C(O)C([O-])=O FEWJPZIEWOKRBE-UHFFFAOYSA-N 0.000 claims description 2
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 2
- 125000000217 alkyl group Chemical group 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 claims description 2
- 235000002906 tartaric acid Nutrition 0.000 claims description 2
- 239000011975 tartaric acid Substances 0.000 claims description 2
- 229910052725 zinc Inorganic materials 0.000 claims description 2
- 239000011701 zinc Substances 0.000 claims description 2
- 238000001723 curing Methods 0.000 description 29
- 238000012360 testing method Methods 0.000 description 28
- 229910000679 solder Inorganic materials 0.000 description 18
- 238000000034 method Methods 0.000 description 17
- 239000003795 chemical substances by application Substances 0.000 description 11
- 230000000694 effects Effects 0.000 description 11
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 10
- 230000000052 comparative effect Effects 0.000 description 10
- 239000003085 diluting agent Substances 0.000 description 10
- 239000010949 copper Substances 0.000 description 9
- 239000000463 material Substances 0.000 description 7
- 239000000126 substance Substances 0.000 description 7
- 229910052802 copper Inorganic materials 0.000 description 6
- 230000006866 deterioration Effects 0.000 description 6
- 239000003822 epoxy resin Substances 0.000 description 6
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 6
- 230000007774 longterm Effects 0.000 description 6
- 229920000647 polyepoxide Polymers 0.000 description 6
- 229920001187 thermosetting polymer Polymers 0.000 description 6
- 229910045601 alloy Inorganic materials 0.000 description 5
- 239000000956 alloy Substances 0.000 description 5
- 239000004202 carbamide Substances 0.000 description 5
- 230000007423 decrease Effects 0.000 description 5
- -1 etc. Inorganic materials 0.000 description 5
- 150000002739 metals Chemical class 0.000 description 5
- 238000003860 storage Methods 0.000 description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 239000000919 ceramic Substances 0.000 description 4
- 238000013329 compounding Methods 0.000 description 4
- 239000011889 copper foil Substances 0.000 description 4
- 230000001747 exhibiting effect Effects 0.000 description 4
- 239000000945 filler Substances 0.000 description 4
- 239000010931 gold Substances 0.000 description 4
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 4
- 239000000843 powder Substances 0.000 description 4
- RUEBPOOTFCZRBC-UHFFFAOYSA-N (5-methyl-2-phenyl-1h-imidazol-4-yl)methanol Chemical compound OCC1=C(C)NC(C=2C=CC=CC=2)=N1 RUEBPOOTFCZRBC-UHFFFAOYSA-N 0.000 description 3
- PTBDIHRZYDMNKB-UHFFFAOYSA-N 2,2-Bis(hydroxymethyl)propionic acid Chemical compound OCC(C)(CO)C(O)=O PTBDIHRZYDMNKB-UHFFFAOYSA-N 0.000 description 3
- 239000002518 antifoaming agent Substances 0.000 description 3
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 3
- 239000002923 metal particle Substances 0.000 description 3
- 238000005065 mining Methods 0.000 description 3
- 239000003960 organic solvent Substances 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 239000000565 sealant Substances 0.000 description 3
- 238000007711 solidification Methods 0.000 description 3
- 230000008023 solidification Effects 0.000 description 3
- UIDDPPKZYZTEGS-UHFFFAOYSA-N 3-(2-ethyl-4-methylimidazol-1-yl)propanenitrile Chemical compound CCC1=NC(C)=CN1CCC#N UIDDPPKZYZTEGS-UHFFFAOYSA-N 0.000 description 2
- IHFQGEDFEXGPFR-UHFFFAOYSA-N 5-[4-(4-heptylbenzoyl)phenyl]pentanoic acid Chemical compound C1=CC(CCCCCCC)=CC=C1C(=O)C1=CC=C(CCCCC(O)=O)C=C1 IHFQGEDFEXGPFR-UHFFFAOYSA-N 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- 239000006087 Silane Coupling Agent Substances 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 150000001412 amines Chemical class 0.000 description 2
- 239000011230 binding agent Substances 0.000 description 2
- 238000002507 cathodic stripping potentiometry Methods 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 239000011246 composite particle Substances 0.000 description 2
- 239000007771 core particle Substances 0.000 description 2
- 239000007822 coupling agent Substances 0.000 description 2
- 125000003700 epoxy group Chemical group 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 238000011049 filling Methods 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 125000002883 imidazolyl group Chemical group 0.000 description 2
- 238000005304 joining Methods 0.000 description 2
- 239000004611 light stabiliser Substances 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 229910052763 palladium Inorganic materials 0.000 description 2
- 229910052697 platinum Inorganic materials 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 239000000700 radioactive tracer Substances 0.000 description 2
- 230000035939 shock Effects 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- WUOACPNHFRMFPN-SECBINFHSA-N (S)-(-)-alpha-terpineol Chemical compound CC1=CC[C@@H](C(C)(C)O)CC1 WUOACPNHFRMFPN-SECBINFHSA-N 0.000 description 1
- LZDKZFUFMNSQCJ-UHFFFAOYSA-N 1,2-diethoxyethane Chemical compound CCOCCOCC LZDKZFUFMNSQCJ-UHFFFAOYSA-N 0.000 description 1
- 125000001989 1,3-phenylene group Chemical group [H]C1=C([H])C([*:1])=C([H])C([*:2])=C1[H] 0.000 description 1
- 125000001140 1,4-phenylene group Chemical group [H]C1=C([H])C([*:2])=C([H])C([H])=C1[*:1] 0.000 description 1
- JVYDLYGCSIHCMR-UHFFFAOYSA-N 2,2-bis(hydroxymethyl)butanoic acid Chemical compound CCC(CO)(CO)C(O)=O JVYDLYGCSIHCMR-UHFFFAOYSA-N 0.000 description 1
- UHAMPPWFPNXLIU-UHFFFAOYSA-N 2,2-bis(hydroxymethyl)pentanoic acid Chemical compound CCCC(CO)(CO)C(O)=O UHAMPPWFPNXLIU-UHFFFAOYSA-N 0.000 description 1
- OAYXUHPQHDHDDZ-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethanol Chemical compound CCCCOCCOCCO OAYXUHPQHDHDDZ-UHFFFAOYSA-N 0.000 description 1
- VXQBJTKSVGFQOL-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethyl acetate Chemical compound CCCCOCCOCCOC(C)=O VXQBJTKSVGFQOL-UHFFFAOYSA-N 0.000 description 1
- FPZWZCWUIYYYBU-UHFFFAOYSA-N 2-(2-ethoxyethoxy)ethyl acetate Chemical compound CCOCCOCCOC(C)=O FPZWZCWUIYYYBU-UHFFFAOYSA-N 0.000 description 1
- POAOYUHQDCAZBD-UHFFFAOYSA-N 2-butoxyethanol Chemical compound CCCCOCCO POAOYUHQDCAZBD-UHFFFAOYSA-N 0.000 description 1
- NQBXSWAWVZHKBZ-UHFFFAOYSA-N 2-butoxyethyl acetate Chemical compound CCCCOCCOC(C)=O NQBXSWAWVZHKBZ-UHFFFAOYSA-N 0.000 description 1
- BVYPJEBKDLFIDL-UHFFFAOYSA-N 3-(2-phenylimidazol-1-yl)propanenitrile Chemical compound N#CCCN1C=CN=C1C1=CC=CC=C1 BVYPJEBKDLFIDL-UHFFFAOYSA-N 0.000 description 1
- SZUPZARBRLCVCB-UHFFFAOYSA-N 3-(2-undecylimidazol-1-yl)propanenitrile Chemical compound CCCCCCCCCCCC1=NC=CN1CCC#N SZUPZARBRLCVCB-UHFFFAOYSA-N 0.000 description 1
- QCAHUFWKIQLBNB-UHFFFAOYSA-N 3-(3-methoxypropoxy)propan-1-ol Chemical compound COCCCOCCCO QCAHUFWKIQLBNB-UHFFFAOYSA-N 0.000 description 1
- WHBMMWSBFZVSSR-UHFFFAOYSA-N 3-hydroxybutyric acid Chemical compound CC(O)CC(O)=O WHBMMWSBFZVSSR-UHFFFAOYSA-N 0.000 description 1
- 229910052582 BN Inorganic materials 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- MPVYLNJPEHLJHF-UHFFFAOYSA-N C(CCCC(=O)O)(=O)O.C(CCCCC(=O)O)(=O)O.C(C(O)C(O)C(=O)O)(=O)O.OCC(C(=O)O)(CC)CO Chemical compound C(CCCC(=O)O)(=O)O.C(CCCCC(=O)O)(=O)O.C(C(O)C(O)C(=O)O)(=O)O.OCC(C(=O)O)(CC)CO MPVYLNJPEHLJHF-UHFFFAOYSA-N 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 239000005062 Polybutadiene Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- UUQQGGWZVKUCBD-UHFFFAOYSA-N [4-(hydroxymethyl)-2-phenyl-1h-imidazol-5-yl]methanol Chemical compound N1C(CO)=C(CO)N=C1C1=CC=CC=C1 UUQQGGWZVKUCBD-UHFFFAOYSA-N 0.000 description 1
- 239000006096 absorbing agent Substances 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 229920000800 acrylic rubber Polymers 0.000 description 1
- 238000005054 agglomeration Methods 0.000 description 1
- 230000002776 aggregation Effects 0.000 description 1
- 238000013019 agitation Methods 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- 125000002947 alkylene group Chemical group 0.000 description 1
- OVKDFILSBMEKLT-UHFFFAOYSA-N alpha-Terpineol Natural products CC(=C)C1(O)CCC(C)=CC1 OVKDFILSBMEKLT-UHFFFAOYSA-N 0.000 description 1
- 229940088601 alpha-terpineol Drugs 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 125000003277 amino group Chemical group 0.000 description 1
- 239000003945 anionic surfactant Substances 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical class C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- MMCOUVMKNAHQOY-UHFFFAOYSA-N carbonoperoxoic acid Chemical compound OOC(O)=O MMCOUVMKNAHQOY-UHFFFAOYSA-N 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000004040 coloring Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 238000013007 heat curing Methods 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 150000002460 imidazoles Chemical class 0.000 description 1
- 239000010954 inorganic particle Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000012948 isocyanate Substances 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 238000007561 laser diffraction method Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- KBJFYLLAMSZSOG-UHFFFAOYSA-N n-(3-trimethoxysilylpropyl)aniline Chemical compound CO[Si](OC)(OC)CCCNC1=CC=CC=C1 KBJFYLLAMSZSOG-UHFFFAOYSA-N 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- 229920000058 polyacrylate Polymers 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 238000010298 pulverizing process Methods 0.000 description 1
- 239000000376 reactant Substances 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 239000000523 sample Substances 0.000 description 1
- 238000000790 scattering method Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229920002545 silicone oil Polymers 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000010944 silver (metal) Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000011343 solid material Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- JBQYATWDVHIOAR-UHFFFAOYSA-N tellanylidenegermanium Chemical compound [Te]=[Ge] JBQYATWDVHIOAR-UHFFFAOYSA-N 0.000 description 1
- 125000001302 tertiary amino group Chemical group 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 239000006097 ultraviolet radiation absorber Substances 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
- C08L79/02—Polyamines
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
- C09J5/06—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving heating of the applied adhesive
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
- H01R11/01—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between the connecting locations
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Medicinal Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Polymers & Plastics (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Dispersion Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Conductive Materials (AREA)
- Led Device Packages (AREA)
Description
YX8000(三菱ケミカル株式会社製、水添ビスフェノールAジグリシジルエーテルの商品名)14.2質量部と、FXR-1081(株式会社T&K TOKA製、変性ポリアミンの商品名)0.1質量部と、BHPA(2,2-ビス(ヒドロキシメチル)プロピオン酸)2.1質量部とを混合し、混合物を3本ロールに3回通して、接着剤成分を調製した。
表1に示す組成に変更した以外は実施例1と同様にして、実施例2~11及び比較例1~8の導電性接着剤組成物を得た。表1中の各材料の配合割合の単位は質量部である。
<熱硬化性樹脂>
YX8000:三菱ケミカル株式会社製、水添ビスフェノールAジグリシジルエーテルの商品名
YX8034:三菱ケミカル株式会社製、水添ビスフェノールAジグリシジルエーテルの商品名
YL980:三菱ケミカル株式会社製、ビスフェノールAジグリシジルエーテルの商品名
<硬化促進剤>
FXR-1081:株式会社T&K TOKA製、変性ポリアミンの商品名
FXR-1030:株式会社T&K TOKA製、変性ポリアミンの商品名
2P4MHZ-PW:四国化成工業株式会社製、キュアゾール、イミダゾール化合物の商品名
<フラックス活性剤>
BHPA:2,2-ビス(ヒドロキシメチル)プロピオン酸
BHBA:2,2-ビスヒドロキシメチルブタン酸
酒石酸
アジピン酸
グルタル酸
<導電性粒子>
Sn96.5-Ag3-Cu0.5:Sn96.5-Ag3-Cu0.5はんだ粒子、平均粒径10~25μm、三井金属鉱業株式会社製、融点217℃
Sn42-Bi58:Sn42-Bi58はんだ粒子、平均粒径10~25μm、三井金属鉱業株式会社製、融点138℃
上記実施例1~11、比較例1~8に係る導電性接着剤組成物の特性を下記の方法で測定した。その結果を表1、表2にまとめて示した。表中、「フラックス/金属比率(%)」は、導電性粒子に対するフラックス活性剤の比率(質量%)を意味する。
導電性接着剤組成物を銀めっき付き銅板上に0.5mg塗布し、その上に2mm×2mm×0.25mmの矩形平板状の錫めっき付き銅板を圧着して試験片を得た。その後、実施例1~7、9、11、及び比較例1~6に係る試験片に対しては、260℃、5分間の熱履歴を加えた。実施例8、10、及び比較例7、8の試験片に対しては、160℃、5分間の熱履歴を加えた。熱履歴を加えた後の各試験片の25℃における接着強度(シェア強度)を、シェア速度500μm/sec、クリアランス100μmの条件でボンドテスター(DAGE社製、2400)を用いて測定した。
1mm×50mm×0.03mmの帯状の金めっき付き銅板2枚を、上記導電性接着剤組成物を介して、互いに直交するように貼り合わせて試験片を得た。銅板の直交部分における接着剤の寸法は1mm×1mm×0.03mmであった。続いて、上記(1)と同様の熱履歴を試験片に加えた。その後の試験片について、四端子法で体積抵抗率を測定した。
隣り合う2つの銅箔ランド(0.3mm×0.4mm)を備え、銅箔ランド間の距離が200μmである、100mm×50mm×0.5mmの矩形平板状のセラミック基板を準備した。次いで、銅箔ランド上に導電性接着剤組成物をメタルマスク(厚み100μm、開口寸法0.2mm×0.3mm)を用いて印刷した。その上に、電極間距離が200μmのフリップチップ型LED素子(0.8mm×0.8mm)を、導電性接着剤組成物を介して電極と銅箔ランドが対向するように載せた。得られた部品搭載基板に上記(1)と同様の熱履歴を加え、耐TCT性評価用の試験基板(フリップチップ型LED素子搭載セラミック基板)を得た。この試験基板の初期抵抗をI-Vカーブトレーサーを用いて測定した。その後、試験基板を、熱試験基板衝撃試験機を用いて、-55℃で30分間保持、125℃まで5分間で昇温、125℃で30分間保持、及び-55℃まで5分間で降温の順の温度変化を1サイクルとする熱衝撃試験に供した。熱衝撃試験後の試験基板の接続抵抗を測定した。サイクル数を増やしながら試験基板の接続抵抗を測定し、初期抵抗に対して10%以下にまで接続抵抗が低下した時点までのサイクル数を、耐TCT性の指標とした。接続抵抗は、I-Vカーブトレーサーを用い、定格電流印加時の電圧を測定し、これから算出した。1500サイクルに到達した試験基板について、耐TCT性が良好であると判断された。表中、「初期オープン」は初期導通性が著しく低かったことを意味する。
耐TCT性と同様の方法で、耐バイアス印加試験用の試験基板(フリップチップ型LED素子搭載セラミック基板)を作製した。積分球を用いて試験基板の初期全光束を測定した。その後、恒温恒湿試験機(85℃/85%RH)内で試験基板に定格電流を印加した。1500時間後の全光束を測定し、初期全光束に対する全光束の維持率を、耐バイアス印加試験性の指標とした。全光束の維持率が90%以上である試験基板について、耐バイアス印加試験性が良好であると判断された。
Claims (9)
- (A)融点230℃以下の金属を含む導電性粒子、
(B)水添ビスフェノールAジグリシジルエーテル、
(C)水酸基及びカルボキシル基を有する化合物を含むフラックス活性剤、及び
(D)硬化促進剤
を含有する導電性接着剤組成物であって、
前記フラックス活性剤が、下記一般式(V)で表される化合物又は酒石酸を含み、
式(V)中、R5は炭素数1~5のアルキル基を示し、m及びnはそれぞれ独立に0~5の整数を示し、
前記水添ビスフェノールAジグリシジルエーテルの含有量が、当該導電性接着剤組成物の全体質量に対して10~30質量%であり、
回路基板と該回路基板に搭載される半導体発光素子とを電気的に接続するために用いられる、導電性接着剤組成物。 - 前記導電性粒子に含まれる融点230℃以下の前記金属が、ビスマス、インジウム、スズ及び亜鉛から選ばれる少なくとも1種を含む、請求項1に記載の導電性接着剤組成物。
- 前記硬化促進剤がポリアミンを含む、請求項1又は2に記載の導電性接着剤組成物。
- 前記フラックス活性剤の含有量が、前記導電性粒子の質量に対して2.5~8.5質量%である、請求項1~3のいずれか一項に記載の導電性接着剤組成物。
- 当該導電性接着剤組成物が、25℃でペースト状である、請求項1~4のいずれか一項に記載の導電性接着剤組成物。
- 前記回路基板が基材及び該基材の主面上に配置された2以上の接続端子を有し、該2以上の接続端子と前記半導体発光素子の接続端子とを電気的に接続するために用いられる、請求項1~5のいずれか一項に記載の導電性接着剤組成物。
- 基材及び該基材の主面上に設けられた2以上の接続端子を有する回路基板と、
前記回路基板の2以上の前記接続端子と対向する2以上の接続端子を有する半導体発光素子と、
前記回路基板と前記半導体発光素子との間に配置され、これらを接合している接続部と、
を備え、
前記接続部が、前記回路基板の前記接続端子と前記半導体発光素子の前記接続端子との間に配置され、それらを電気的に接続している導電部を含み、
前記導電部が、請求項1~5のいずれか一項に記載の導電性接着剤組成物に含まれていた導電性粒子を含み、
前記接続部が、前記導電部の周囲に形成された樹脂部を更に含み、前記樹脂部が、請求項1~5のいずれか一項に記載の導電性接着剤組成物における導電性粒子以外の成分である接着剤成分の硬化物を含む、
接続構造体。 - 前記半導体発光素子が、LED-SMDパッケージ、フリップチップ型LED、及びLED-CSPからなる群より選ばれる少なくとも1種を含む、請求項7に記載の接続構造体。
- それぞれ2以上の接続端子を有する回路基板及び半導体発光素子を準備し、前記回路基板又は前記半導体発光素子の前記接続端子上に請求項1~5のいずれか一項に記載の導電性接着剤組成物を塗布する工程と、
塗布された導電性接着剤組成物を介して前記回路基板の前記接続端子と前記半導体発光素子の前記接続端子とが対向するように、前記回路基板上に前記半導体発光素子を配置して、前記回路基板、前記導電性接着剤組成物及び前記半導体発光素子を有する仮接続体を得る工程と、
前記仮接続体を加熱することによって、前記導電性接着剤組成物を硬化するとともに、前記導電性接着剤組成物中の前記導電性粒子を含み前記回路基板の前記接続端子と前記半導体発光素子の前記接続端子とを電気的に接続する導電部を形成し、それにより、前記導電部を含む接続部によって前記回路基板と前記半導体発光素子とが接合されている接続構造体を得る工程と、
を備える、接続構造体を製造する方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017138145 | 2017-07-14 | ||
JP2017138145 | 2017-07-14 | ||
PCT/JP2018/026537 WO2019013333A1 (ja) | 2017-07-14 | 2018-07-13 | 導電性接着剤組成物及びこれを用いた接続構造体 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2019013333A1 JPWO2019013333A1 (ja) | 2020-07-27 |
JP7212831B2 true JP7212831B2 (ja) | 2023-01-26 |
Family
ID=65001914
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2019529807A Active JP7212831B2 (ja) | 2017-07-14 | 2018-07-13 | 導電性接着剤組成物及びこれを用いた接続構造体 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP7212831B2 (ja) |
KR (1) | KR102656752B1 (ja) |
TW (1) | TWI789406B (ja) |
WO (1) | WO2019013333A1 (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111048499B (zh) * | 2019-12-16 | 2022-05-13 | 业成科技(成都)有限公司 | 微发光二极管显示面板及其制备方法 |
TWI818199B (zh) * | 2020-10-06 | 2023-10-11 | 友達光電股份有限公司 | 發光裝置及其製造方法 |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007182562A (ja) | 2005-12-08 | 2007-07-19 | Hitachi Chem Co Ltd | 電子部品用液状樹脂組成物及び電子部品装置 |
JP2008510620A (ja) | 2004-08-25 | 2008-04-10 | 松下電器産業株式会社 | 半田組成物および半田接合方法ならびに半田接合構造 |
JP2008510621A (ja) | 2004-08-25 | 2008-04-10 | 松下電器産業株式会社 | 半田組成物及び半田接合方法並びに半田接合構造 |
JP2011100927A (ja) | 2009-11-09 | 2011-05-19 | Sony Chemical & Information Device Corp | 接着剤組成物 |
JP2015053342A (ja) | 2013-09-05 | 2015-03-19 | デクセリアルズ株式会社 | 導電性接着剤、太陽電池モジュール、及び太陽電池モジュールの製造方法 |
JP2016014115A (ja) | 2014-07-03 | 2016-01-28 | 積水化学工業株式会社 | 導電材料及び接続構造体 |
JP2017112312A (ja) | 2015-12-18 | 2017-06-22 | 日立化成株式会社 | 導電性接着剤組成物、接続構造体及び半導体発光素子搭載フレキシブル配線基板 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5468199B2 (ja) * | 2006-11-22 | 2014-04-09 | 日立化成株式会社 | 導電性接着剤組成物、電子部品搭載基板及び半導体装置 |
KR101666101B1 (ko) * | 2012-02-24 | 2016-10-13 | 히타치가세이가부시끼가이샤 | 반도체용 접착제, 플럭스제, 반도체 장치의 제조 방법 및 반도체 장치 |
JP2014017248A (ja) | 2012-06-14 | 2014-01-30 | Sekisui Chem Co Ltd | 導電材料、導電材料の製造方法及び接続構造体 |
-
2018
- 2018-07-13 WO PCT/JP2018/026537 patent/WO2019013333A1/ja active Application Filing
- 2018-07-13 JP JP2019529807A patent/JP7212831B2/ja active Active
- 2018-07-13 KR KR1020197035831A patent/KR102656752B1/ko active IP Right Grant
- 2018-07-13 TW TW107124313A patent/TWI789406B/zh active
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008510620A (ja) | 2004-08-25 | 2008-04-10 | 松下電器産業株式会社 | 半田組成物および半田接合方法ならびに半田接合構造 |
JP2008510621A (ja) | 2004-08-25 | 2008-04-10 | 松下電器産業株式会社 | 半田組成物及び半田接合方法並びに半田接合構造 |
JP2007182562A (ja) | 2005-12-08 | 2007-07-19 | Hitachi Chem Co Ltd | 電子部品用液状樹脂組成物及び電子部品装置 |
JP2011100927A (ja) | 2009-11-09 | 2011-05-19 | Sony Chemical & Information Device Corp | 接着剤組成物 |
JP2015053342A (ja) | 2013-09-05 | 2015-03-19 | デクセリアルズ株式会社 | 導電性接着剤、太陽電池モジュール、及び太陽電池モジュールの製造方法 |
JP2016014115A (ja) | 2014-07-03 | 2016-01-28 | 積水化学工業株式会社 | 導電材料及び接続構造体 |
JP2017112312A (ja) | 2015-12-18 | 2017-06-22 | 日立化成株式会社 | 導電性接着剤組成物、接続構造体及び半導体発光素子搭載フレキシブル配線基板 |
Also Published As
Publication number | Publication date |
---|---|
TWI789406B (zh) | 2023-01-11 |
JPWO2019013333A1 (ja) | 2020-07-27 |
WO2019013333A1 (ja) | 2019-01-17 |
TW201908444A (zh) | 2019-03-01 |
KR20200029390A (ko) | 2020-03-18 |
KR102656752B1 (ko) | 2024-04-11 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP6508292B2 (ja) | 導電性接着剤組成物 | |
KR101334429B1 (ko) | 접착제 조성물 및 그것을 이용한 전자부품 탑재 기판 및 반도체장치 | |
EP2899245B1 (en) | Anisotropic conductive adhesive | |
CN106914710B (zh) | 树脂助焊剂焊膏和安装结构体 | |
EP2899244A1 (en) | Anisotropic conductive adhesive and connection structure | |
JP6782413B2 (ja) | 導電性接着剤組成物、接続構造体及び半導体発光素子搭載フレキシブル配線基板 | |
JP7259219B2 (ja) | 樹脂組成物及びその硬化物、並びに半導体装置の製造方法 | |
JP7212831B2 (ja) | 導電性接着剤組成物及びこれを用いた接続構造体 | |
JP7331693B2 (ja) | 導電性接着剤組成物及びこれを用いた接続構造体 | |
US20170114255A1 (en) | Adhesive agent and connection structure | |
KR102350347B1 (ko) | 마이크로 led 칩 본딩용 자가융착형 도전접속 페이스트, 이를 포함하는 마이크로 led 칩-회로기판 본딩 모듈 및 이의 제조방법 | |
JP6047437B2 (ja) | 導電材料、接続構造体及び接続構造体の製造方法 | |
US20230087229A1 (en) | Conductive adhesive composition, and method for producing connection structure | |
KR20210068412A (ko) | 반도체용 접착제, 반도체 장치의 제조 방법 및 반도체 장치 | |
CN114250043B (zh) | 自熔接型导电连接材料、包括其的键合模块及其制造方法 | |
JP2012199544A (ja) | 異方性導電ペースト、接続構造体及び接続構造体の製造方法 | |
KR102355782B1 (ko) | 접착력이 우수한 led 칩 본딩용 자가융착형 도전접속 조성물, 이를 포함하는 led 칩-회로기판 본딩 모듈 및 이의 제조방법 | |
TW202220134A (zh) | 導電性接著劑組成物及製造攝像模組的方法 | |
CN117715726A (zh) | 助焊剂用树脂组合物、焊料糊剂和安装结构体 | |
JP2020188268A (ja) | 導電性接着剤組成物、接続構造体及び半導体発光素子搭載フレキシブル配線基板 | |
JP2010050017A (ja) | 耐光性導電ペースト及び素子接続方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20200110 |
|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20210611 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20220628 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20220825 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20221213 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20221226 |
|
R151 | Written notification of patent or utility model registration |
Ref document number: 7212831 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R151 |
|
S531 | Written request for registration of change of domicile |
Free format text: JAPANESE INTERMEDIATE CODE: R313531 |
|
R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |