JP7207503B2 - 無線通信デバイス - Google Patents
無線通信デバイス Download PDFInfo
- Publication number
- JP7207503B2 JP7207503B2 JP2021178869A JP2021178869A JP7207503B2 JP 7207503 B2 JP7207503 B2 JP 7207503B2 JP 2021178869 A JP2021178869 A JP 2021178869A JP 2021178869 A JP2021178869 A JP 2021178869A JP 7207503 B2 JP7207503 B2 JP 7207503B2
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- JP
- Japan
- Prior art keywords
- rfic
- adhesive layer
- rfic module
- wireless communication
- communication device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/046—Surface mounting
- H05K13/0469—Surface mounting by applying a glue or viscous material
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
- B32B37/16—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating
- B32B37/22—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating involving the assembly of both discrete and continuous layers
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07718—Constructional details, e.g. mounting of circuits in the carrier the record carrier being manufactured in a continuous process, e.g. using endless rolls
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
- G06K19/07754—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna the connection being galvanic
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
- H04B1/38—Transceivers, i.e. devices in which transmitter and receiver form a structural unit and in which at least one part is used for functions of transmitting and receiving
- H04B1/3827—Portable transceivers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Networks & Wireless Communication (AREA)
- Signal Processing (AREA)
- Details Of Aerials (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第1および第2の結合部を含むアンテナパターンを備えるアンテナ部材と、
RFICチップと前記RFICチップに接続された第1および第2の端子電極とを含むRFICモジュールと、
前記アンテナ部材と前記RFICモジュールを接着する絶縁性の接着層と、を備え、
前記第1の結合部と前記第1の端子電極とが前記接着層を介して対向して配置され、
前記第2の結合部と前記第2の端子電極とが前記接着層を介して対向して配置され、
前記材料シート、前記接着部材、および前記RFICモジュールの積層方向視で、前記第1の結合部のサイズが前記第1の端子電極のサイズに比べて大きいとともに前記第2の結合部のサイズが前記第2の端子電極のサイズに比べて大きく、
前記積層方向視で、前記第1および第2の端子電極を最小面積で内含する第1の領域が前記接着層に比べて小さく且つ前記接着層の輪郭線内に位置するとともに、前記接着部材が前記第1および第2の結合部を最小面積で内含する第2の領域に比べて小さく且つ前記第2の領域内に位置する、無線通信デバイスが提供される。
Claims (9)
- 第1および第2の結合部を含むアンテナパターンを備えるアンテナ部材と、
RFICチップと前記RFICチップに接続された第1および第2の端子電極とを含むRFICモジュールと、
前記アンテナ部材と前記RFICモジュールを接着する絶縁性の接着層と、を備え、
前記第1の結合部と前記第1の端子電極とが前記接着層を介して対向して配置され、
前記第2の結合部と前記第2の端子電極とが前記接着層を介して対向して配置され、
前記アンテナ部材、前記接着層、および前記RFICモジュールの積層方向視で、前記第1の結合部のサイズが前記第1の端子電極のサイズに比べて大きいとともに前記第2の結合部のサイズが前記第2の端子電極のサイズに比べて大きく、
前記積層方向視で、前記第1および第2の端子電極を最小面積で内含する第1の領域が前記接着層に比べて小さく且つ前記接着層の輪郭線内に位置するとともに、前記接着層が前記第1および第2の結合部を最小面積で内含する第2の領域に比べて小さく且つ前記第2の領域内に位置する、無線通信デバイス。
- 前記積層方向視で、前記RFICモジュールが、前記接着層の輪郭線内に位置し、
前記第1および第2の端子電極以外の前記RFICモジュールの部分が、前記接着層に接触する、請求項1に記載の無線通信デバイス。
- 前記積層方向視で、前記RFICモジュールと、前記接着層の輪郭線形状が略同形である、請求項2に記載の無線通信デバイス。
- 前記積層方向視で、前記RFICモジュールの幅に対する、前記接着層の輪郭線の同方向の幅が1.0倍以上、1.2倍以下である、請求項3に記載の無線通信デバイス。
- 前記接着層は、前記アンテナパターン以外の前記アンテナ部材の一部分と接触している、請求項1から4のいずれか一項に記載の無線通信デバイス。
- 前記第1および第2の端子電極が、前記RFICモジュールに内蔵されている、請求項1から5のいずれか一項に記載の無線通信デバイス。
- 前記積層方向視で、前記第1の端子電極が前記第1の結合部の中央に位置するとともに前記第2の端子電極が前記第2の結合部の中央に位置している、請求項1から6のいずれか一項に記載の無線通信デバイス。
- 前記RFICモジュールは、前記RFICチップと前記第1および第2の端子電極との間に設けられた整合回路を備える、請求項1から7のいずれか一項に記載の無線通信デバイス。
- RFIDモジュールの端子電極とアンテナ部材の結合部が略平行である、請求項1から8のいずれか一項に記載の無線通信デバイス。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018194417 | 2018-10-15 | ||
JP2018194417 | 2018-10-15 | ||
JP2020087861A JP2020166871A (ja) | 2018-10-15 | 2020-05-20 | 無線通信デバイスの製造方法および無線通信デバイス製造装置 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2020087861A Division JP2020166871A (ja) | 2018-10-15 | 2020-05-20 | 無線通信デバイスの製造方法および無線通信デバイス製造装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2022020727A JP2022020727A (ja) | 2022-02-01 |
JP7207503B2 true JP7207503B2 (ja) | 2023-01-18 |
Family
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Family Applications (3)
Application Number | Title | Priority Date | Filing Date |
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JP2020505280A Active JP6708321B1 (ja) | 2018-10-15 | 2019-08-26 | 無線通信デバイスの製造方法および無線通信デバイス製造装置 |
JP2020087861A Pending JP2020166871A (ja) | 2018-10-15 | 2020-05-20 | 無線通信デバイスの製造方法および無線通信デバイス製造装置 |
JP2021178869A Active JP7207503B2 (ja) | 2018-10-15 | 2021-11-01 | 無線通信デバイス |
Family Applications Before (2)
Application Number | Title | Priority Date | Filing Date |
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JP2020505280A Active JP6708321B1 (ja) | 2018-10-15 | 2019-08-26 | 無線通信デバイスの製造方法および無線通信デバイス製造装置 |
JP2020087861A Pending JP2020166871A (ja) | 2018-10-15 | 2020-05-20 | 無線通信デバイスの製造方法および無線通信デバイス製造装置 |
Country Status (5)
Country | Link |
---|---|
US (2) | US11937375B2 (ja) |
JP (3) | JP6708321B1 (ja) |
CN (1) | CN215729821U (ja) |
DE (1) | DE212019000392U1 (ja) |
WO (1) | WO2020079961A1 (ja) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
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DE112019006728T5 (de) * | 2019-01-25 | 2021-10-28 | Murata Manufacturing Co., Ltd. | Drahtloskommunikationsvorrichtung und verfahren zum herstellen derselben |
WO2023276583A1 (ja) * | 2021-07-02 | 2023-01-05 | 株式会社村田製作所 | 無線通信デバイス製造システム |
WO2023112638A1 (ja) * | 2021-12-15 | 2023-06-22 | 株式会社村田製作所 | パッケージ製造方法、パッケージ製造装置、およびパッケージ用治具 |
WO2024075735A1 (ja) * | 2022-10-07 | 2024-04-11 | 株式会社村田製作所 | Rfidモジュール |
WO2024090266A1 (ja) * | 2022-10-28 | 2024-05-02 | 株式会社村田製作所 | 電子部品収納体及び電子部品収納体梱包体 |
WO2024090267A1 (ja) * | 2022-10-28 | 2024-05-02 | 株式会社村田製作所 | 電子部品収納体及び電子部品収納体梱包体 |
WO2024095749A1 (ja) * | 2022-10-31 | 2024-05-10 | 株式会社村田製作所 | 電子部品収納体及び電子部品収納体梱包体 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2013242698A (ja) | 2012-05-21 | 2013-12-05 | Murata Mfg Co Ltd | 無線icモジュール付き基材シートの製造方法 |
JP2015108933A (ja) | 2013-12-04 | 2015-06-11 | 日立化成株式会社 | 非接触式icカード |
WO2018155382A1 (ja) | 2017-02-21 | 2018-08-30 | 株式会社村田製作所 | Rfidタグ |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2002071470A1 (en) * | 2001-03-02 | 2002-09-12 | Toray Engineering Co., Ltd. | Chip mounting method and apparatus therefor |
JP2005284772A (ja) * | 2004-03-30 | 2005-10-13 | Dainippon Printing Co Ltd | Icチップ付シートの製造方法、icチップ付シートの製造装置、およびicチップ付シート |
JP2005309960A (ja) * | 2004-04-23 | 2005-11-04 | Dainippon Printing Co Ltd | Icタグの製造方法およびその製造装置 |
JP4672384B2 (ja) * | 2004-04-27 | 2011-04-20 | 大日本印刷株式会社 | Icタグ付シートの製造方法、icタグ付シートの製造装置、icタグ付シート、icチップの固定方法、icチップの固定装置、およびicタグ |
JP4386023B2 (ja) * | 2005-10-13 | 2009-12-16 | パナソニック株式会社 | Ic実装モジュールの製造方法および製造装置 |
WO2010104125A1 (ja) * | 2009-03-10 | 2010-09-16 | 積水化学工業株式会社 | 半導体チップ積層体の製造方法及び半導体装置 |
WO2018012391A1 (ja) | 2016-07-15 | 2018-01-18 | 株式会社村田製作所 | Rfidタグの製造装置及びrfidタグの製造方法 |
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2019
- 2019-08-26 CN CN201990001097.4U patent/CN215729821U/zh active Active
- 2019-08-26 JP JP2020505280A patent/JP6708321B1/ja active Active
- 2019-08-26 DE DE212019000392.3U patent/DE212019000392U1/de active Active
- 2019-08-26 WO PCT/JP2019/033336 patent/WO2020079961A1/ja active Application Filing
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2020
- 2020-05-20 JP JP2020087861A patent/JP2020166871A/ja active Pending
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2021
- 2021-04-08 US US17/225,434 patent/US11937375B2/en active Active
- 2021-11-01 JP JP2021178869A patent/JP7207503B2/ja active Active
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2024
- 2024-02-13 US US18/440,272 patent/US20240188271A1/en active Pending
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2013242698A (ja) | 2012-05-21 | 2013-12-05 | Murata Mfg Co Ltd | 無線icモジュール付き基材シートの製造方法 |
JP2015108933A (ja) | 2013-12-04 | 2015-06-11 | 日立化成株式会社 | 非接触式icカード |
WO2018155382A1 (ja) | 2017-02-21 | 2018-08-30 | 株式会社村田製作所 | Rfidタグ |
Also Published As
Publication number | Publication date |
---|---|
DE212019000392U1 (de) | 2021-05-20 |
JP6708321B1 (ja) | 2020-06-10 |
JP2020166871A (ja) | 2020-10-08 |
WO2020079961A1 (ja) | 2020-04-23 |
JPWO2020079961A1 (ja) | 2021-02-15 |
US20240188271A1 (en) | 2024-06-06 |
US20210227737A1 (en) | 2021-07-22 |
JP2022020727A (ja) | 2022-02-01 |
CN215729821U (zh) | 2022-02-01 |
US11937375B2 (en) | 2024-03-19 |
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