JP7200898B2 - ワークの両面研磨方法 - Google Patents
ワークの両面研磨方法 Download PDFInfo
- Publication number
- JP7200898B2 JP7200898B2 JP2019177790A JP2019177790A JP7200898B2 JP 7200898 B2 JP7200898 B2 JP 7200898B2 JP 2019177790 A JP2019177790 A JP 2019177790A JP 2019177790 A JP2019177790 A JP 2019177790A JP 7200898 B2 JP7200898 B2 JP 7200898B2
- Authority
- JP
- Japan
- Prior art keywords
- workpiece
- polishing
- amount
- holding hole
- double
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 238000005498 polishing Methods 0.000 title claims description 90
- 238000000034 method Methods 0.000 title claims description 25
- 230000002093 peripheral effect Effects 0.000 claims description 49
- 230000003746 surface roughness Effects 0.000 claims description 16
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 4
- 238000007517 polishing process Methods 0.000 claims description 4
- 229910052710 silicon Inorganic materials 0.000 claims description 4
- 239000010703 silicon Substances 0.000 claims description 4
- 235000012431 wafers Nutrition 0.000 description 63
- 238000010586 diagram Methods 0.000 description 6
- 238000004513 sizing Methods 0.000 description 6
- 238000007665 sagging Methods 0.000 description 5
- 239000002002 slurry Substances 0.000 description 4
- 230000007423 decrease Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- 230000007717 exclusion Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 238000004891 communication Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 230000005489 elastic deformation Effects 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 231100000989 no adverse effect Toxicity 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 230000003313 weakening effect Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02002—Preparing wafers
- H01L21/02005—Preparing bulk and homogeneous wafers
- H01L21/02008—Multistep processes
- H01L21/0201—Specific process step
- H01L21/02024—Mirror polishing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/12—Lapping plates for working plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
- B24B37/28—Work carriers for double side lapping of plane surfaces
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019177790A JP7200898B2 (ja) | 2019-09-27 | 2019-09-27 | ワークの両面研磨方法 |
DE112020004627.3T DE112020004627T5 (de) | 2019-09-27 | 2020-08-13 | Verfahren zum doppelseitigen polieren eines werkstücks |
CN202080067215.9A CN114401823A (zh) | 2019-09-27 | 2020-08-13 | 工件的双面研磨方法 |
KR1020227009330A KR102674947B1 (ko) | 2019-09-27 | 2020-08-13 | 워크의 양면 연마 방법 |
TW109127489A TWI740606B (zh) | 2019-09-27 | 2020-08-13 | 工件的兩面研磨方法 |
PCT/JP2020/030798 WO2021059790A1 (ja) | 2019-09-27 | 2020-08-13 | ワークの両面研磨方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019177790A JP7200898B2 (ja) | 2019-09-27 | 2019-09-27 | ワークの両面研磨方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2021053726A JP2021053726A (ja) | 2021-04-08 |
JP7200898B2 true JP7200898B2 (ja) | 2023-01-10 |
Family
ID=75166050
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2019177790A Active JP7200898B2 (ja) | 2019-09-27 | 2019-09-27 | ワークの両面研磨方法 |
Country Status (6)
Country | Link |
---|---|
JP (1) | JP7200898B2 (ko) |
KR (1) | KR102674947B1 (ko) |
CN (1) | CN114401823A (ko) |
DE (1) | DE112020004627T5 (ko) |
TW (1) | TWI740606B (ko) |
WO (1) | WO2021059790A1 (ko) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7235071B2 (ja) * | 2021-06-11 | 2023-03-08 | 株式会社Sumco | ワークの両面研磨方法及びワークの両面研磨装置 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002331453A (ja) | 2001-05-08 | 2002-11-19 | Shin Etsu Handotai Co Ltd | ウェーハの研磨方法及びウェーハの研磨装置 |
JP2006156653A (ja) | 2004-11-29 | 2006-06-15 | Toshiba Ceramics Co Ltd | ウェーハ保持体 |
JP2010253579A (ja) | 2009-04-22 | 2010-11-11 | Sumco Corp | ウェーハの研磨方法および研磨装置 |
JP2014050913A (ja) | 2012-09-06 | 2014-03-20 | Shin Etsu Handotai Co Ltd | 両面研磨方法 |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4280397B2 (ja) * | 1999-10-21 | 2009-06-17 | スピードファム株式会社 | ワークの研磨方法 |
JP2002326156A (ja) * | 2001-04-27 | 2002-11-12 | Nippon Sheet Glass Co Ltd | ガラス基板研磨用キャリア及びガラス基板研磨装置 |
JP2003071703A (ja) * | 2001-09-05 | 2003-03-12 | Seiko Instruments Inc | 多段式微小孔加工方法および装置 |
JP2005150216A (ja) * | 2003-11-12 | 2005-06-09 | Hitachi Cable Ltd | 半導体ウェハの研磨装置 |
JP2006198751A (ja) * | 2005-01-24 | 2006-08-03 | Showa Denko Kk | 磁気ディスク用サブストレート基板の製造方法及び研磨装置 |
KR100746373B1 (ko) * | 2005-12-13 | 2007-08-03 | 주식회사 실트론 | 양면 연마장치의 캐리어 플레이트 구조 |
JP4904960B2 (ja) * | 2006-07-18 | 2012-03-28 | 信越半導体株式会社 | 両面研磨装置用キャリア及びこれを用いた両面研磨装置並びに両面研磨方法 |
JP4605233B2 (ja) * | 2008-02-27 | 2011-01-05 | 信越半導体株式会社 | 両面研磨装置用キャリア及びこれを用いた両面研磨装置並びに両面研磨方法 |
JP5212041B2 (ja) * | 2008-11-19 | 2013-06-19 | 信越半導体株式会社 | 両面研磨装置用キャリア及びこれを用いた両面研磨装置並びに両面研磨方法 |
DE102011082777A1 (de) * | 2011-09-15 | 2012-02-09 | Siltronic Ag | Verfahren zum beidseitigen Polieren einer Halbleiterscheibe |
TWI465317B (zh) | 2012-06-25 | 2014-12-21 | Sumco Corp | 工作件的硏磨方法及工作件的硏磨裝置 |
JP2014188668A (ja) * | 2013-03-28 | 2014-10-06 | Hoya Corp | ガラス基板の製造方法 |
WO2017073265A1 (ja) * | 2015-10-30 | 2017-05-04 | 株式会社Sumco | 半導体ウェーハの両面研磨方法及びその両面研磨装置 |
JP6403100B2 (ja) * | 2016-01-25 | 2018-10-10 | 信越半導体株式会社 | エピタキシャル成長装置及び保持部材 |
JP6579056B2 (ja) * | 2016-07-29 | 2019-09-25 | 株式会社Sumco | ウェーハの両面研磨方法 |
JP6635003B2 (ja) * | 2016-11-02 | 2020-01-22 | 株式会社Sumco | 半導体ウェーハの両面研磨方法 |
JP6844530B2 (ja) * | 2017-12-28 | 2021-03-17 | 株式会社Sumco | ワークの両面研磨装置および両面研磨方法 |
JP7046358B2 (ja) * | 2018-04-17 | 2022-04-04 | スピードファム株式会社 | 研磨装置 |
-
2019
- 2019-09-27 JP JP2019177790A patent/JP7200898B2/ja active Active
-
2020
- 2020-08-13 CN CN202080067215.9A patent/CN114401823A/zh active Pending
- 2020-08-13 DE DE112020004627.3T patent/DE112020004627T5/de active Pending
- 2020-08-13 TW TW109127489A patent/TWI740606B/zh active
- 2020-08-13 KR KR1020227009330A patent/KR102674947B1/ko active IP Right Grant
- 2020-08-13 WO PCT/JP2020/030798 patent/WO2021059790A1/ja active Application Filing
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002331453A (ja) | 2001-05-08 | 2002-11-19 | Shin Etsu Handotai Co Ltd | ウェーハの研磨方法及びウェーハの研磨装置 |
JP2006156653A (ja) | 2004-11-29 | 2006-06-15 | Toshiba Ceramics Co Ltd | ウェーハ保持体 |
JP2010253579A (ja) | 2009-04-22 | 2010-11-11 | Sumco Corp | ウェーハの研磨方法および研磨装置 |
JP2014050913A (ja) | 2012-09-06 | 2014-03-20 | Shin Etsu Handotai Co Ltd | 両面研磨方法 |
Also Published As
Publication number | Publication date |
---|---|
JP2021053726A (ja) | 2021-04-08 |
DE112020004627T5 (de) | 2022-09-01 |
TW202112494A (zh) | 2021-04-01 |
KR102674947B1 (ko) | 2024-06-12 |
KR20220047645A (ko) | 2022-04-18 |
WO2021059790A1 (ja) | 2021-04-01 |
TWI740606B (zh) | 2021-09-21 |
CN114401823A (zh) | 2022-04-26 |
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