JP7193350B2 - ウェーハの加工方法 - Google Patents
ウェーハの加工方法 Download PDFInfo
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- JP7193350B2 JP7193350B2 JP2019000837A JP2019000837A JP7193350B2 JP 7193350 B2 JP7193350 B2 JP 7193350B2 JP 2019000837 A JP2019000837 A JP 2019000837A JP 2019000837 A JP2019000837 A JP 2019000837A JP 7193350 B2 JP7193350 B2 JP 7193350B2
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
- H01L21/3043—Making grooves, e.g. cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/18—Working by laser beam, e.g. welding, cutting or boring using absorbing layers on the workpiece, e.g. for marking or protecting purposes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/362—Laser etching
- B23K26/364—Laser etching for making a groove or trench, e.g. for scribing a break initiation groove
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/6834—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used to protect an active side of a device or wafer
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
- Dicing (AREA)
- Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Description
本発明の実施形態1に係るウェーハの加工方法を図面に基づいて説明する。図1は、実施形態1に係るウェーハの加工方法の加工対象のウェーハの一例を示す斜視図である。図2は、図1に示されたウェーハの要部の断面図である。図3は、実施形態1に係るウェーハの加工方法の流れを示すフローチャートである。
図4は、図3に示されたウェーハの加工方法で用いられるレーザ加工装置の構成例を示す斜視図である。レーザ加工装置20は、図4に示すように、装置本体21と、チャックテーブル30と、レーザビーム照射ユニット40と、撮像ユニット50と、X軸移動ユニット60と、Y軸移動ユニット70と、保護膜被覆洗浄ユニット80と、搬送ユニット90と、制御ユニット100とを主に備えている。
図5は、図3に示されたウェーハの加工方法の保護膜被覆ステップを示す側断面図である。保護膜被覆ステップST1は、ウェーハ1の積層体3の表面を保護膜6で被覆するステップである。
図6は、図3に示されたウェーハの加工方法の保護膜除去ステップを示す側断面図である。図7は、図3に示されたウェーハの加工方法の保護膜除去ステップのウェーハの要部を示す断面図である。図8は、図3に示されたウェーハの加工方法の保護膜除去ステップ後のウェーハの要部を示す断面図である。図9は、図3に示されたウェーハの加工方法の保護膜除去ステップ後のウェーハの要部を示す平面図である。
図10は、図3に示されたウェーハの加工方法の第1レーザ加工ステップのウェーハの要部を示す断面図である。図11は、図3に示されたウェーハの加工方法の第1レーザ加工ステップ後のウェーハの要部を示す断面図である。図12は、図3に示されたウェーハの加工方法の第1レーザ加工ステップ後のウェーハの要部を示す平面図である。
図13は、図3に示されたウェーハの加工方法の第2レーザ加工ステップのウェーハの要部を示す断面図である。第2レーザ加工ステップST4は、第1レーザ加工ステップST3を実施した後、ストリート4に沿って、レーザビーム210を照射することで、2条のレーザ加工溝9間の積層体3を保護膜6とともに除去して2条のレーザ加工溝9間の基材2を露出させるステップである。
図14は、図3に示されたウェーハの加工方法の切削ステップのウェーハの要部を示す断面図である。切削ステップST5は、第2レーザ加工ステップST4を実施した後、ストリート4の基材2が露出した領域4-1を切削ブレード300で切削するステップである。
2 基材
3 積層体
4 ストリート
4-1 領域
5 デバイス
6 保護膜
9 レーザ加工溝
200 レーザビーム
210 レーザビーム
300 切削ブレード
ST1 保護膜被覆ステップ
ST2 保護膜除去ステップ
ST3 第1レーザ加工ステップ
ST4 第2レーザ加工ステップ
ST5 切削ステップ
Claims (2)
- 基材上に積層体が積層され、所定の幅を有した複数のストリートを備えたウェーハの加工方法であって、
該積層体の表面を保護膜で被覆する保護膜被覆ステップと、
該保護膜被覆ステップを実施した後、ストリートの内側で該ストリートの幅方向の両端にレーザビームをそれぞれ集光させた状態で該ストリートに沿ってレーザビームを照射し、該ストリートに2条のレーザ加工溝を形成する第1レーザ加工ステップと、
該第1レーザ加工ステップを実施した後、該ストリートに沿ってレーザビームを照射することで該2条のレーザ加工溝の間の積層体を保護膜とともに除去して該基材を露出させる第2レーザ加工ステップと、
該第2レーザ加工ステップを実施した後、該ストリートの該基材が露出した領域を切削ブレードで切削する切削ステップと、を備え、
該保護膜被覆ステップを実施した後、該第1レーザ加工ステップを実施する前に、該2条のレーザ加工溝が形成される位置より該ストリートの内側で該ストリートの幅方向に並んだ2点にレーザビームを集光させた状態で該ストリートに沿ってレーザビームを照射して該2条のレーザ加工溝が形成される位置を含む領域の少なくとも該保護膜を除去する保護膜除去ステップと、を備えた、ウェーハの加工方法。 - 該保護膜除去ステップと該第1レーザ加工ステップでは同じ条件で該レーザビームを照射する、請求項1に記載のウェーハの加工方法。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
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JP2019000837A JP7193350B2 (ja) | 2019-01-07 | 2019-01-07 | ウェーハの加工方法 |
KR1020190171966A KR20200085647A (ko) | 2019-01-07 | 2019-12-20 | 웨이퍼의 가공 방법 |
TW109100185A TWI820282B (zh) | 2019-01-07 | 2020-01-03 | 晶圓的加工方法 |
CN202010008606.5A CN111415863B (zh) | 2019-01-07 | 2020-01-06 | 晶片的加工方法 |
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JP2019000837A JP7193350B2 (ja) | 2019-01-07 | 2019-01-07 | ウェーハの加工方法 |
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JP2020109815A JP2020109815A (ja) | 2020-07-16 |
JP7193350B2 true JP7193350B2 (ja) | 2022-12-20 |
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JP (1) | JP7193350B2 (ja) |
KR (1) | KR20200085647A (ja) |
CN (1) | CN111415863B (ja) |
TW (1) | TWI820282B (ja) |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008004822A (ja) | 2006-06-23 | 2008-01-10 | Disco Abrasive Syst Ltd | ウエーハの加工条件設定方法 |
JP2013026440A (ja) | 2011-07-21 | 2013-02-04 | Renesas Electronics Corp | 半導体装置の製造方法 |
JP2017092363A (ja) | 2015-11-16 | 2017-05-25 | 株式会社ディスコ | ウエーハの分割方法 |
JP2018006461A (ja) | 2016-06-29 | 2018-01-11 | 株式会社ディスコ | デバイスのパッケージ方法 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
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JPH05326696A (ja) * | 1992-05-25 | 1993-12-10 | Sanyo Electric Co Ltd | 半導体ウエハー |
JP2004055852A (ja) * | 2002-07-19 | 2004-02-19 | Ricoh Co Ltd | 半導体装置及びその製造方法 |
JP2005064230A (ja) | 2003-08-12 | 2005-03-10 | Disco Abrasive Syst Ltd | 板状物の分割方法 |
JP4750427B2 (ja) * | 2005-01-13 | 2011-08-17 | 株式会社ディスコ | ウエーハのレーザー加工方法 |
JP5453123B2 (ja) * | 2010-01-19 | 2014-03-26 | 株式会社ディスコ | 切削方法 |
JP6037659B2 (ja) * | 2012-05-25 | 2016-12-07 | 株式会社ディスコ | ウェーハの分割方法 |
TWI614914B (zh) * | 2014-07-11 | 2018-02-11 | 晶元光電股份有限公司 | 發光元件及其製造方法 |
-
2019
- 2019-01-07 JP JP2019000837A patent/JP7193350B2/ja active Active
- 2019-12-20 KR KR1020190171966A patent/KR20200085647A/ko active IP Right Grant
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2020
- 2020-01-03 TW TW109100185A patent/TWI820282B/zh active
- 2020-01-06 CN CN202010008606.5A patent/CN111415863B/zh active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008004822A (ja) | 2006-06-23 | 2008-01-10 | Disco Abrasive Syst Ltd | ウエーハの加工条件設定方法 |
JP2013026440A (ja) | 2011-07-21 | 2013-02-04 | Renesas Electronics Corp | 半導体装置の製造方法 |
JP2017092363A (ja) | 2015-11-16 | 2017-05-25 | 株式会社ディスコ | ウエーハの分割方法 |
JP2018006461A (ja) | 2016-06-29 | 2018-01-11 | 株式会社ディスコ | デバイスのパッケージ方法 |
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TWI820282B (zh) | 2023-11-01 |
CN111415863B (zh) | 2024-05-14 |
TW202037442A (zh) | 2020-10-16 |
KR20200085647A (ko) | 2020-07-15 |
JP2020109815A (ja) | 2020-07-16 |
CN111415863A (zh) | 2020-07-14 |
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