JP7187832B2 - 厚膜導体形成用粉末組成物および厚膜導体形成用ペースト - Google Patents

厚膜導体形成用粉末組成物および厚膜導体形成用ペースト Download PDF

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Publication number
JP7187832B2
JP7187832B2 JP2018113784A JP2018113784A JP7187832B2 JP 7187832 B2 JP7187832 B2 JP 7187832B2 JP 2018113784 A JP2018113784 A JP 2018113784A JP 2018113784 A JP2018113784 A JP 2018113784A JP 7187832 B2 JP7187832 B2 JP 7187832B2
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powder
film conductor
thick film
mass
parts
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JP2019110105A (ja
JP2019110105A5 (enExample
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慎吾 粟ヶ窪
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Sumitomo Metal Mining Co Ltd
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Sumitomo Metal Mining Co Ltd
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Priority to KR1020180157111A priority Critical patent/KR102639865B1/ko
Priority to CN201811509470.5A priority patent/CN109994246B/zh
Priority to TW107144766A priority patent/TWI796400B/zh
Publication of JP2019110105A publication Critical patent/JP2019110105A/ja
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JP2018113784A 2017-12-15 2018-06-14 厚膜導体形成用粉末組成物および厚膜導体形成用ペースト Active JP7187832B2 (ja)

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KR1020180157111A KR102639865B1 (ko) 2017-12-15 2018-12-07 후막 도체 형성용 분말 조성물 및 후막 도체 형성용 페이스트
CN201811509470.5A CN109994246B (zh) 2017-12-15 2018-12-11 厚膜导体形成用粉末组合物以及厚膜导体形成用浆料
TW107144766A TWI796400B (zh) 2017-12-15 2018-12-12 厚膜導體形成用粉末組成物及厚膜導體形成用糊料

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JP2017240609 2017-12-15
JP2017240609 2017-12-15

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JP2019110105A JP2019110105A (ja) 2019-07-04
JP2019110105A5 JP2019110105A5 (enExample) 2021-07-26
JP7187832B2 true JP7187832B2 (ja) 2022-12-13

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JP7581791B2 (ja) 2020-11-20 2024-11-13 住友金属鉱山株式会社 厚膜導体形成用粉末組成物、厚膜導体形成用ペーストおよび厚膜導体

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002270035A (ja) 2001-03-14 2002-09-20 Noritake Co Ltd 導体ペースト、該ペースト調製用粉末材料およびセラミック電子部品製造方法
WO2013146239A1 (ja) 2012-03-28 2013-10-03 東レ株式会社 感光性導電ペーストおよび導電性配線付き基板の製造方法
JP2018137131A (ja) 2017-02-22 2018-08-30 ナミックス株式会社 導電性ペースト、窒化アルミニウム回路基板及びその製造方法

Family Cites Families (3)

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Publication number Priority date Publication date Assignee Title
JP2917457B2 (ja) * 1990-07-31 1999-07-12 太平洋セメント株式会社 導体ペースト
JP3209089B2 (ja) * 1996-05-09 2001-09-17 昭栄化学工業株式会社 導電性ペースト
CN106683744A (zh) * 2016-12-16 2017-05-17 苏州博望新能源科技有限公司 低温烧结太阳能电池背电极银浆

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002270035A (ja) 2001-03-14 2002-09-20 Noritake Co Ltd 導体ペースト、該ペースト調製用粉末材料およびセラミック電子部品製造方法
WO2013146239A1 (ja) 2012-03-28 2013-10-03 東レ株式会社 感光性導電ペーストおよび導電性配線付き基板の製造方法
JP2018137131A (ja) 2017-02-22 2018-08-30 ナミックス株式会社 導電性ペースト、窒化アルミニウム回路基板及びその製造方法

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TW201927927A (zh) 2019-07-16
JP2019110105A (ja) 2019-07-04
TWI796400B (zh) 2023-03-21

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