JP2019110105A5 - - Google Patents

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Publication number
JP2019110105A5
JP2019110105A5 JP2018113784A JP2018113784A JP2019110105A5 JP 2019110105 A5 JP2019110105 A5 JP 2019110105A5 JP 2018113784 A JP2018113784 A JP 2018113784A JP 2018113784 A JP2018113784 A JP 2018113784A JP 2019110105 A5 JP2019110105 A5 JP 2019110105A5
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JP
Japan
Prior art keywords
thick film
powder
film conductor
mass
glass
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JP2018113784A
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English (en)
Japanese (ja)
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JP2019110105A (ja
JP7187832B2 (ja
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Priority to KR1020180157111A priority Critical patent/KR102639865B1/ko
Priority to CN201811509470.5A priority patent/CN109994246B/zh
Priority to TW107144766A priority patent/TWI796400B/zh
Publication of JP2019110105A publication Critical patent/JP2019110105A/ja
Publication of JP2019110105A5 publication Critical patent/JP2019110105A5/ja
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Publication of JP7187832B2 publication Critical patent/JP7187832B2/ja
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JP2018113784A 2017-12-15 2018-06-14 厚膜導体形成用粉末組成物および厚膜導体形成用ペースト Active JP7187832B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
KR1020180157111A KR102639865B1 (ko) 2017-12-15 2018-12-07 후막 도체 형성용 분말 조성물 및 후막 도체 형성용 페이스트
CN201811509470.5A CN109994246B (zh) 2017-12-15 2018-12-11 厚膜导体形成用粉末组合物以及厚膜导体形成用浆料
TW107144766A TWI796400B (zh) 2017-12-15 2018-12-12 厚膜導體形成用粉末組成物及厚膜導體形成用糊料

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017240609 2017-12-15
JP2017240609 2017-12-15

Publications (3)

Publication Number Publication Date
JP2019110105A JP2019110105A (ja) 2019-07-04
JP2019110105A5 true JP2019110105A5 (enExample) 2021-07-26
JP7187832B2 JP7187832B2 (ja) 2022-12-13

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ID=67180028

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JP2018113784A Active JP7187832B2 (ja) 2017-12-15 2018-06-14 厚膜導体形成用粉末組成物および厚膜導体形成用ペースト

Country Status (2)

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JP (1) JP7187832B2 (enExample)
TW (1) TWI796400B (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7581791B2 (ja) 2020-11-20 2024-11-13 住友金属鉱山株式会社 厚膜導体形成用粉末組成物、厚膜導体形成用ペーストおよび厚膜導体

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2917457B2 (ja) * 1990-07-31 1999-07-12 太平洋セメント株式会社 導体ペースト
JP3209089B2 (ja) * 1996-05-09 2001-09-17 昭栄化学工業株式会社 導電性ペースト
JP3637286B2 (ja) * 2001-03-14 2005-04-13 株式会社ノリタケカンパニーリミテド 焼成ジルコニア基材用導体ペースト
WO2013146239A1 (ja) * 2012-03-28 2013-10-03 東レ株式会社 感光性導電ペーストおよび導電性配線付き基板の製造方法
CN106683744A (zh) * 2016-12-16 2017-05-17 苏州博望新能源科技有限公司 低温烧结太阳能电池背电极银浆
JP6869531B2 (ja) * 2017-02-22 2021-05-12 ナミックス株式会社 導電性ペースト、窒化アルミニウム回路基板及びその製造方法

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