JP7171223B2 - 撮像ユニットおよびその製造方法 - Google Patents
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Description
図1は、本発明の実施形態の撮像ユニットの構成を概略的に示す図である。
各実施形態で説明した撮像ユニットおよび撮像装置は様々なアプリケーションに適用可能である。例えば、撮像ユニットは可視光以外にも赤外光、紫外光、X線等の光のセンシングに用いることが可能である。また、撮像装置はデジタルカメラに代表されるが他にも、スマートフォン等のカメラ付携帯電話、監視カメラ、ゲーム機器等にも適用可能である。さらに、内視鏡や血管撮像を行う医療機器や、肌や頭皮を観察する美容機器、スポーツやアクション動画を撮像するためのビデオカメラに適用できる。そして、交通や船舶監視やドライブレコーダー等の交通目的カメラ、天体観測や検体観察等の学術用途カメラ、カメラ付き家電製品、マシンビジョン等にも適用可能である。特にマシンビジョンとして、工場等におけるロボットには限られず、農業や漁業での活用も可能である。
102 撮像基板
103 部品
104 コネクタ
105 部品領域
106 禁止領域
107 ワイヤボンディングパッド
108 チェックパッド
109 カバーガラス
110 枠
Claims (18)
- イメージセンサを構成する半導体チップと、前記半導体チップを実装する基板から成る撮像ユニットであって、
前記半導体チップを制御するための複数の入力配線と、
前記入力配線に接続する複数の第1の電極と、
前記入力配線に接続する入力コネクタとを備え、
前記基板は前記半導体チップを実装する反対の面において、電子部品を実装するための第1の領域と前記半導体チップの実装に用いる第2の領域とを含み、
前記入力コネクタは前記第1の領域に設けられ、前記第1の電極のうち少なくとも1以上は第2の領域に設けられ、
前記第1の電極を介して前記半導体チップを駆動可能であることを特徴とする撮像ユニット。 - 前記半導体チップからの画像信号を出力するための出力配線に接続する出力コネクタをさらに備える請求項1に記載の撮像ユニット。
- 前記出力コネクタに接続する出力配線は高速信号を伝送するための差動対配線であることを特徴とする請求項2に記載の撮像ユニット。
- 前記入力コネクタまたは前記出力コネクタはボードトゥボード型のコネクタであることを特徴とする請求項2または3に記載の撮像ユニット。
- 前記基板は半導体チップを実装する面において前記半導体チップとワイヤボンディング接続を行うための第2の電極を備え、
前記第2の電極は、前記第2の領域に対応する反対の面に設けられることを特徴とする請求項1乃至4のいずれか1項に記載の撮像ユニット。 - 前記第1の領域は、前記半導体チップが実装されている領域を反対の面に対応させた領域と略一致することを特徴とする請求項1乃至5のいずれか1項に記載の撮像ユニット。
- 前記入力コネクタと前記半導体チップを接続する配線中に一つ以上の電源回路を備え、
前記第1の電極は前記電源回路と前記半導体チップの間および前記電源回路と前記入力コネクタの間の配線に接続されることを特徴とする請求項1乃至6のいずれか1項に記載の撮像ユニット。 - 前記第1の電極が接続する前記電源回路と前記半導体チップの間の配線はスイッチ回路を備えることを特徴とする請求項7に記載の撮像ユニット。
- 前記第2の領域は前記基板の外周部に設けられていることを特徴とする請求項1乃至8のいずれか1項に記載の撮像ユニット。
- 前記第2の領域は前記半導体チップのワイヤボンディング接続を行うための加熱領域であることを特徴とする請求項1乃至9のいずれか1項に記載の撮像ユニット。
- 前記第1の領域および前記第2の領域の夫々に第1の電極を備え、
前記第1の領域に備えられた前記第1の電極の数は前記第2の領域に備えられた前記第1の電極の数よりも少ないことを特徴とする請求項1乃至10のいずれか1項に記載の撮像ユニット。 - 前記第1の電極は、前記基板の周辺部の4辺のうちの2辺に配置されることを特徴とする請求項1から請求項11のいずれか1項に記載の撮像ユニット。
- 前記第1の電極は、前記基板の周辺部の4辺のうちの長い辺に配置されることを特徴とする請求項1から請求項11のいずれか1項に記載の撮像ユニット。
- 前記入力コネクタは、前記半導体チップに対して画像を取得するように制御する制御部と接続するためのコネクタであって、前記半導体チップを駆動するための信号が接続されることを特徴とする請求項1から13のいずれか1項に記載の撮像ユニット。
- 前記制御部との間で接続される信号は、クロック信号、同期信号、シリアル通信信号、電源の少なくとも1つが含まれることを特徴とする請求項14に記載の撮像ユニット。
- イメージセンサを構成する半導体チップと、前記半導体チップを実装する基板から成る撮像ユニットの製造方法であって、
前記半導体チップを制御するための複数の入力配線に対して接続する、複数の第1の電極を基板外周部に設けるステップと、
前記半導体チップを制御するための複数の入力配線に対して接続する、入力コネクタを設けるステップと、
電子部品を前記基板における第1の領域に実装するためステップと、
前記第1の領域と異なり前記第1の電極が設けられた第2の領域を用いて前記半導体チップを実装するステップとを含み、
前記第1の電極を介して前記半導体チップを駆動可能にすることを特徴とする撮像ユニットの製造方法。 - 前記半導体チップが実装された基板をカバーガラスで封止するステップと、
前記カバーガラスで封止された状態で前記半導体チップを検査する検査ステップとを更に含み、
前記検査ステップは前記第1の電極を用いて前記半導体チップを制御することを特徴とする請求項16に記載の撮像ユニットの製造方法。 - イメージセンサを構成する半導体チップと、前記半導体チップを実装する基板と、
前記半導体チップを制御するための複数の入力配線と、
前記入力配線に接続する複数の第1の電極と、
前記入力配線に接続する入力コネクタとを備え、
前記基板は前記半導体チップを実装する反対の面において、電子部品を実装するための第1の領域と前記半導体チップの実装に用いる第2の領域とを含み、
前記入力コネクタは前記第1の領域に設けられ、前記第1の電極のうち少なくとも1以上は第2の領域に設けられ、
前記第1の電極を介して前記半導体チップを駆動可能である撮像ユニットを備えることを特徴とする撮像装置。
Priority Applications (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018087519A JP7171223B2 (ja) | 2018-04-27 | 2018-04-27 | 撮像ユニットおよびその製造方法 |
PCT/JP2019/016760 WO2019208415A1 (ja) | 2018-04-27 | 2019-04-19 | 撮像ユニットおよびその製造方法 |
BR112020021559-7A BR112020021559A2 (pt) | 2018-04-27 | 2019-04-19 | Unidade de captura de imagem e método para a fabricação da mesma |
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