JP7170138B2 - 塗布方法及び塗布装置 - Google Patents
塗布方法及び塗布装置 Download PDFInfo
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- 238000000576 coating method Methods 0.000 title claims description 73
- 239000011248 coating agent Substances 0.000 title claims description 35
- 239000007788 liquid Substances 0.000 claims description 142
- 239000002904 solvent Substances 0.000 claims description 83
- 238000012545 processing Methods 0.000 claims description 58
- 239000000758 substrate Substances 0.000 claims description 38
- 238000000034 method Methods 0.000 claims description 16
- 238000004528 spin coating Methods 0.000 claims description 8
- WVYWICLMDOOCFB-UHFFFAOYSA-N 4-methyl-2-pentanol Chemical compound CC(C)CC(C)O WVYWICLMDOOCFB-UHFFFAOYSA-N 0.000 claims description 4
- LLHKCFNBLRBOGN-UHFFFAOYSA-N propylene glycol methyl ether acetate Chemical group COCC(C)OC(C)=O LLHKCFNBLRBOGN-UHFFFAOYSA-N 0.000 claims description 4
- 230000007246 mechanism Effects 0.000 description 6
- 101150038956 cup-4 gene Proteins 0.000 description 5
- 230000002123 temporal effect Effects 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 238000011156 evaluation Methods 0.000 description 4
- 238000005192 partition Methods 0.000 description 4
- 238000002474 experimental method Methods 0.000 description 3
- 238000007796 conventional method Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000006870 function Effects 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000009736 wetting Methods 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/16—Coating processes; Apparatus therefor
- G03F7/162—Coating on a rotating support, e.g. using a whirler or a spinner
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
- H01L21/02112—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
- H01L21/02118—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer carbon based polymeric organic or inorganic material, e.g. polyimides, poly cyclobutene or PVC
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D1/00—Processes for applying liquids or other fluent materials
- B05D1/002—Processes for applying liquids or other fluent materials the substrate being rotated
- B05D1/005—Spin coating
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B12/00—Arrangements for controlling delivery; Arrangements for controlling the spray area
- B05B12/02—Arrangements for controlling delivery; Arrangements for controlling the spray area for controlling time, or sequence, of delivery
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- B05B12/00—Arrangements for controlling delivery; Arrangements for controlling the spray area
- B05B12/14—Arrangements for controlling delivery; Arrangements for controlling the spray area for supplying a selected one of a plurality of liquids or other fluent materials or several in selected proportions to a spray apparatus, e.g. to a single spray outlet
- B05B12/1418—Arrangements for controlling delivery; Arrangements for controlling the spray area for supplying a selected one of a plurality of liquids or other fluent materials or several in selected proportions to a spray apparatus, e.g. to a single spray outlet for supplying several liquids or other fluent materials in selected proportions to a single spray outlet
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B13/00—Machines or plants for applying liquids or other fluent materials to surfaces of objects or other work by spraying, not covered by groups B05B1/00 - B05B11/00
- B05B13/02—Means for supporting work; Arrangement or mounting of spray heads; Adaptation or arrangement of means for feeding work
- B05B13/0221—Means for supporting work; Arrangement or mounting of spray heads; Adaptation or arrangement of means for feeding work characterised by the means for moving or conveying the objects or other work, e.g. conveyor belts
- B05B13/0228—Means for supporting work; Arrangement or mounting of spray heads; Adaptation or arrangement of means for feeding work characterised by the means for moving or conveying the objects or other work, e.g. conveyor belts the movement of the objects being rotative
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
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- B05B13/02—Means for supporting work; Arrangement or mounting of spray heads; Adaptation or arrangement of means for feeding work
- B05B13/0221—Means for supporting work; Arrangement or mounting of spray heads; Adaptation or arrangement of means for feeding work characterised by the means for moving or conveying the objects or other work, e.g. conveyor belts
- B05B13/0235—Means for supporting work; Arrangement or mounting of spray heads; Adaptation or arrangement of means for feeding work characterised by the means for moving or conveying the objects or other work, e.g. conveyor belts the movement of the objects being a combination of rotation and linear displacement
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B13/00—Machines or plants for applying liquids or other fluent materials to surfaces of objects or other work by spraying, not covered by groups B05B1/00 - B05B11/00
- B05B13/02—Means for supporting work; Arrangement or mounting of spray heads; Adaptation or arrangement of means for feeding work
- B05B13/0278—Arrangement or mounting of spray heads
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B05B13/00—Machines or plants for applying liquids or other fluent materials to surfaces of objects or other work by spraying, not covered by groups B05B1/00 - B05B11/00
- B05B13/02—Means for supporting work; Arrangement or mounting of spray heads; Adaptation or arrangement of means for feeding work
- B05B13/04—Means for supporting work; Arrangement or mounting of spray heads; Adaptation or arrangement of means for feeding work the spray heads being moved during spraying operation
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B14/00—Arrangements for collecting, re-using or eliminating excess spraying material
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B14/00—Arrangements for collecting, re-using or eliminating excess spraying material
- B05B14/30—Arrangements for collecting, re-using or eliminating excess spraying material comprising enclosures close to, or in contact with, the object to be sprayed and surrounding or confining the discharged spray or jet but not the object to be sprayed
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B7/00—Spraying apparatus for discharge of liquids or other fluent materials from two or more sources, e.g. of liquid and air, of powder and gas
- B05B7/02—Spray pistols; Apparatus for discharge
- B05B7/04—Spray pistols; Apparatus for discharge with arrangements for mixing liquids or other fluent materials before discharge
- B05B7/0408—Spray pistols; Apparatus for discharge with arrangements for mixing liquids or other fluent materials before discharge with arrangements for mixing two or more liquids
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
- B05C11/02—Apparatus for spreading or distributing liquids or other fluent materials already applied to a surface ; Controlling means therefor; Control of the thickness of a coating by spreading or distributing liquids or other fluent materials already applied to the coated surface
- B05C11/08—Spreading liquid or other fluent material by manipulating the work, e.g. tilting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D1/00—Processes for applying liquids or other fluent materials
- B05D1/40—Distributing applied liquids or other fluent materials by members moving relatively to surface
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
- B05D3/10—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by other chemical means
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/20—Diluents or solvents
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02225—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
- H01L21/0226—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process
- H01L21/02282—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process liquid deposition, e.g. spin-coating, sol-gel techniques, spray coating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D2401/00—Form of the coating product, e.g. solution, water dispersion, powders or the like
- B05D2401/10—Organic solvent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
- B05D3/10—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by other chemical means
- B05D3/104—Pretreatment of other substrates
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- Condensed Matter Physics & Semiconductors (AREA)
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- Microelectronics & Electronic Packaging (AREA)
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- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
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- Wood Science & Technology (AREA)
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- Application Of Or Painting With Fluid Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Materials For Photolithography (AREA)
Description
図1、図2は、本実施形態にかかる塗布装置としてのレジスト塗布装置1の構成の概略を示しており、このレジスト塗布装置1は、筐体C内にカップ体2を有している。カップ体2内には、基板、たとえばウエハWの裏面側中央部を吸引吸着して水平に保持する回転保持部材としてのスピンチャック11が昇降自在、かつ鉛直軸回りに回転自在に設けられている。スピンチャック11はシャフト12を介して回転駆動機構13と接続されており、スピンチャック11がウエハWを保持した状態で回転駆動機構13によって、昇降及び回転可能なように構成されている。
まず、実施の形態にかかる塗布方法の説明に入る前に、いくつかの塗布方法について発明者らが実験した結果について説明する。これらの実験は、処理液としてレジスト液、溶剤としてプリウェット処理に使用される当該レジスト液の溶剤(RRC)を用いた例である。
2 カップ体
3 外カップ
4 内カップ
6 仕切り板
7 液受け部
8 排液管
9 排気空間
10 排気管
11 スピンチャック
12 シャフト
13 回転駆動機構
21 ノズルアーム
22 供給ノズル
23 レール
31 供給路
32 ラインミキサ
33 混合ブロック
35 レジスト液系供給路
36 溶剤系供給路
37、39 ベローズポンプ
38 レジスト液供給源
40 溶剤供給源
51 制御装置
C 筐体
S 空間
W ウエハ
Claims (10)
- 基板に処理液を供給し、スピンコーティング法によって基板に前記処理液を塗布する塗布方法であって、
前記処理液よりも表面張力が小さい前記処理液の溶剤を、前記処理液の供給開始と同時かまたは前記処理液の供給開始よりも遅れて、前記処理液に混合して前記基板に供給し、
前記処理液の前記基板への供給停止よりも前に、前記溶剤の前記処理液への混合を終了する、塗布方法。 - 基板に処理液を供給し、スピンコーティング法によって基板に前記処理液を塗布する塗布方法であって、
前記処理液よりも表面張力が小さい前記処理液の溶剤を、前記処理液の供給開始と同時かまたは前記処理液の供給開始よりも遅れて、前記処理液に混合して前記基板に供給し、
前記溶剤の前記処理液への混合を開始して終了するまでの間は、前記処理液を連続して供給する、塗布方法。 - 前記溶剤の前記処理液の混合時間は、前記処理液の供給時間の1/2~2/3である、請求項1または2のいずれか一項に記載の塗布方法。
- 前記溶剤の前記処理液の混合割合は、前記処理液の3~50%である、請求項1~3のいずれか一項に記載の塗布方法。
- 前記溶剤の前記処理液へ混合する期間における中間時点から終了するまでの間に、前記溶剤の前記処理液に対する混合割合を下げる、請求項1~4のいずれか一項に記載の塗布方法。
- 前記処理液は、粘度が3cP~100cPのレジスト液である、請求項1~5のいずれか一項に記載の塗布方法。
- 前記溶剤は、IPA、またはIPAよりも揮発性が低い溶剤である、請求項1~6のいずれか一項に記載の塗布方法。
- 前記溶剤は、PGMEA、またはMIBCである、請求項1~7のいずれか一項に記載の塗布方法。
- 基板に処理液を供給し、スピンコーティング法によって基板に前記処理液を塗布するように構成された塗布装置であって、
前記基板を回転可能に保持する回転保持部材と、
前記回転保持部材に保持された前記基板に対して前記処理液を供給する供給ノズルと、
前記処理液よりも表面張力が小さい前記処理液の溶剤を、前記処理液の供給開始と同時かまたは前記処理液の供給開始よりも遅れて、前記処理液に混合して前記基板に供給するように前記塗布装置を制御するように制御部と、を有し、
前記制御部は、前記供給ノズルから前記基板に対して前記処理液を連続して供給した状態のまま前記溶剤の前記処理液に対する混合割合を調整し、前記処理液の供給停止時を含む処理液供給の後半の時間帯で前記溶剤を前記処理液に混合しないように前記塗布装置を制御するように構成されている、塗布装置。 - 基板に処理液を供給し、スピンコーティング法によって基板に前記処理液を塗布するように構成された塗布装置であって、
前記基板を回転可能に保持する回転保持部材と、
前記回転保持部材に保持された前記基板に対して前記処理液を供給する供給ノズルと、
前記処理液よりも表面張力が小さい前記処理液の溶剤を、前記処理液の供給開始と同時かまたは前記処理液の供給開始よりも遅れて、前記処理液に混合して前記基板に供給するように前記塗布装置を制御するように制御部と、を有し、
前記溶剤の前記処理液への混合を開始して終了するまでの間は、前記処理液を連続して供給する、塗布装置。
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JP2019125439 | 2019-07-04 | ||
JP2019125439 | 2019-07-04 | ||
PCT/JP2020/024990 WO2021002269A1 (ja) | 2019-07-04 | 2020-06-25 | 塗布方法及び塗布装置 |
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JPWO2021002269A1 JPWO2021002269A1 (ja) | 2021-01-07 |
JP7170138B2 true JP7170138B2 (ja) | 2022-11-11 |
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US (1) | US20220371047A1 (ja) |
JP (1) | JP7170138B2 (ja) |
KR (1) | KR20220027168A (ja) |
CN (1) | CN114025885B (ja) |
TW (1) | TW202116420A (ja) |
WO (1) | WO2021002269A1 (ja) |
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JP2019046850A (ja) | 2017-08-30 | 2019-03-22 | 株式会社Screenホールディングス | 基板処理装置および基板処理方法 |
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JPH05259063A (ja) * | 1992-03-10 | 1993-10-08 | Kawasaki Steel Corp | 半導体基板のスピンコーティング方法 |
JP3410342B2 (ja) * | 1997-01-31 | 2003-05-26 | 東京エレクトロン株式会社 | 塗布装置 |
TW442336B (en) * | 1997-08-19 | 2001-06-23 | Tokyo Electron Ltd | Film forming method |
JP2008066351A (ja) * | 2006-09-05 | 2008-03-21 | Dainippon Screen Mfg Co Ltd | 基板処理装置 |
JP4762098B2 (ja) * | 2006-09-28 | 2011-08-31 | 大日本スクリーン製造株式会社 | 基板処理装置および基板処理方法 |
JP5091764B2 (ja) * | 2008-05-20 | 2012-12-05 | 東京エレクトロン株式会社 | 塗布処理方法、プログラム、コンピュータ記憶媒体及び塗布処理装置 |
JP5173900B2 (ja) | 2009-03-12 | 2013-04-03 | 東京エレクトロン株式会社 | レジスト塗布方法 |
JP6104836B2 (ja) * | 2014-03-13 | 2017-03-29 | 東京エレクトロン株式会社 | 分離再生装置および基板処理装置 |
JP5886935B1 (ja) * | 2014-12-11 | 2016-03-16 | 東京エレクトロン株式会社 | 塗布処理方法、コンピュータ記憶媒体及び塗布処理装置 |
US10317793B2 (en) * | 2017-03-03 | 2019-06-11 | Canon Kabushiki Kaisha | Substrate pretreatment compositions for nanoimprint lithography |
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Publication number | Priority date | Publication date | Assignee | Title |
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JP2019046850A (ja) | 2017-08-30 | 2019-03-22 | 株式会社Screenホールディングス | 基板処理装置および基板処理方法 |
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