JP7168355B2 - 半導体加工装置および半導体加工装置を較正する方法 - Google Patents
半導体加工装置および半導体加工装置を較正する方法 Download PDFInfo
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Description
Claims (42)
- 反応チャンバであって、
垂直側壁によって接続する上方チャンバ壁および下方チャンバ壁であって、前記チャンバ壁は、上流入口フランジおよび下流出口フランジによって接合され、前記チャンバの縦方向は、前記入口フランジから前記出口フランジへ延在する、上方チャンバ壁および下方チャンバ壁と、
少なくとも前記上方チャンバ壁の外表面上に提供される複数のリブであって、前記チャンバの前記縦方向に対し横方向に配向する、複数のリブと、を備える、反応チャンバと、
前記反応チャンバの上方に配置される、少なくとも一つの発熱体配列と、
前記少なくとも一つの発熱体配列に連結し、前記少なくとも一つの発熱体配列の位置を、前記複数のリブの位置に対して、制御可能なように調整するよう構成される、少なくとも一つの可変位置決めデバイスと、を備える、半導体加工装置。 - 前記少なくとも一つの発熱体配列は、複数の放射発熱灯を備える、請求項1に記載の装置。
- 前記複数の放射発熱灯が、前記チャンバの前記縦方向と実質的に平行に配置される細長い管型からなる、請求項2に記載の装置。
- 前記複数の放射発熱灯が、前記チャンバの前記縦方向と実質的に垂直に配置される細長い管型からなる、請求項2に記載の装置。
- 前記少なくとも一つの可変位置決めデバイスが、前記少なくとも一つの発熱体配列の前記位置を、前記反応チャンバの前記縦方向に対して実質的な平行方向に、制御可能なように調整するよう構成される、請求項1に記載の装置。
- 前記少なくとも一つの可変位置決めデバイスが、前記少なくとも一つの発熱体配列の前記位置を、前記反応チャンバの前記縦方向に対して実質的な垂直方向に、制御可能なように調整するよう構成される、請求項1に記載の装置。
- 前記少なくとも一つの可変位置決めデバイスが、前記少なくとも一つの発熱体配列の高さを、前記反応チャンバの前記上方チャンバ壁の前記位置に対して、制御可能なように調整するよう構成される、請求項1に記載の装置。
- 前記少なくとも一つの発熱体配列が、少なくとも二つの可変位置決めデバイスに連結される、請求項1に記載の装置。
- 前記少なくとも一つの発熱体配列が、少なくとも三つの可変位置決めデバイスに連結される、請求項1に記載の装置。
- 前記少なくとも一つの発熱体配列の下方にある前記反応チャンバ内に配置される基板支持体であって、少なくとも一つの基板を支持するように構成される、基板支持体をさらに備え、
前記基板支持体は、中心軸を有し、その周りを回転する、請求項1に記載の装置。 - 前記少なくとも一つの発熱体配列が、前記少なくとも一つの基板の表面全体で、温度均一性の差が1.5℃未満になるように構成される、請求項10に記載の装置。
- 前記少なくとも一つの発熱体配列が、前記少なくとも一つの基板の表面全体で、温度均一性の差が0.4℃未満となるように構成される、請求項10に記載の装置。
- 前記少なくとも一つの発熱体配列が、前記少なくとも一つの基板の表面全体で、温度均一性の差が0.25℃未満となるように構成される、請求項10に記載の装置。
- 前記少なくとも一つの可変位置決めデバイスは、前記少なくとも一つの発熱体配列が、約2センチメートル以下で変位するように構成される、請求項1に記載の装置。
- 前記反応チャンバは、修復反応チャンバを備える、請求項1に記載の装置。
- 前記少なくとも一つの発熱体配列に隣接して配置される、複数の放物線反射鏡を備える、一体成形の反射鏡をさらに備える、請求項1に記載の装置。
- 前記反応チャンバの下方に配置される、発熱体のさらなる配列をさらに備える、請求項1に記載の装置。
- 前記少なくとも一つの発熱体配列は、上方発熱筐体の中に配置され、前記上方発熱筐体は、一つ以上のヒンジ機構によって反応チャンバ筐体に接続する、請求項1に記載の装置。
- 前記一つ以上のヒンジ機構は、前記反応チャンバ筐体に固定位置で接続する、請求項18に記載の装置。
- 前記一つ以上のヒンジ機構は、前記反応チャンバに対して前記上方発熱筐体を上下させるように構成され、前記一つ以上のヒンジ機構のうちの少なくとも一つは、前記複数のリブに対して0.25ミリメートル未満の位置公差で、下げた位置に前記上方発熱筐体を再配置するように、さらに構成される、請求項19に記載の装置。
- 前記複数の放射発熱灯は、互いに実質的に平行かつ隣接して配置される、細長い管型からなり、個々の前記放射発熱灯間の距離は、調整可能である、請求項2に記載の装置。
- 反応チャンバを提供することであって、
垂直側壁によって接続する上方チャンバ壁および下方チャンバ壁であって、前記チャンバ壁は、上流入口フランジおよび下流出口フランジによって接合され、前記反応チャンバの縦方向は、前記入口フランジから前記出口フランジへ延在する、上方チャンバ壁および下方チャンバ壁と、
少なくとも前記上方チャンバ壁の外表面上に提供される複数のリブであって、前記反応チャンバの前記縦方向に対し横方向に配向する、複数のリブと、を備える、反応チャンバを提供することと、
前記反応チャンバの上方に配置される、少なくとも一つの発熱体配列を提供することと、
前記発熱体配列の位置を、前記複数のリブの位置に対して、制御可能なように調整するよう、前記少なくとも一つの発熱体配列に連結される、少なくとも一つの可変位置決めデバイスを調整することと、を含む、半導体加工装置を較正する方法。 - 修復反応チャンバを備えるように、前記反応チャンバを選択することを、さらに含む、請求項22に記載の方法。
- 複数の放射発熱灯を備えるように、前記少なくとも一つの発熱体配列を選択することをさらに含む、請求項22に記載の方法。
- 前記複数の放射発熱灯が、前記反応チャンバの前記縦方向と実質的に平行に配置される細長い管型からなる、請求項24に記載の方法。
- 前記複数の放射発熱灯が、前記反応チャンバの前記縦方向と実質的に垂直に配置される細長い管型からなる、請求項24に記載の方法。
- 前記少なくとも一つの発熱体配列の前記位置を、前記反応チャンバの前記縦方向に対して実質的な平行方向に、制御可能なように調整するよう、前記少なくとも一つの可変位置決めデバイスを選択することをさらに含む、請求項24に記載の方法。
- 前記少なくとも一つの発熱体配列の前記位置を、前記反応チャンバの前記縦方向に対して実質的な垂直方向に、制御可能なように調整するよう、前記少なくとも一つの可変位置決めデバイスを選択することをさらに含む、請求項24に記載の方法。
- 前記少なくとも一つの発熱体配列の高さを、前記反応チャンバの前記上方チャンバ壁の前記位置に対して、制御可能なように調整するよう、前記少なくとも一つの可変位置決めデバイスを選択することをさらに含む、請求項24に記載の方法。
- 前記少なくとも一つの発熱体配列が、少なくとも二つの可変位置決めデバイスに連結される、請求項24に記載の方法。
- 前記少なくとも一つの発熱体配列が、少なくとも三つの可変位置決めデバイスに連結される、請求項24に記載の方法。
- 前記少なくとも一つの発熱体配列の下方にある、前記反応チャンバ内に配置される基板支持体を提供することであって、前記基板支持体は、少なくとも一つの基板を支持するように構成される、ことをさらに含み、
前記基板支持体は、中心軸を有し、その周りを回転する、請求項24に記載の方法。 - 前記少なくとも一つの発熱体配列が、前記少なくとも一つの基板の表面全体で、温度均一性の差が1.5℃未満となるように構成される、請求項32に記載の方法。
- 前記少なくとも一つの発熱体配列が、前記少なくとも一つの基板の表面全体で、温度均一性の差が0.4℃未満となるように構成される、請求項32に記載の方法。
- 前記少なくとも一つの発熱体配列が、前記少なくとも一つの基板の表面全体で、温度均一性の差が0.25℃未満となるように構成される、請求項32に記載の方法。
- 前記少なくとも一つの発熱体配列は、約2センチメートル以下で変位するように、前記少なくとも一つの可変位置決めデバイスを選択することをさらに含む、請求項22に記載の方法。
- 前記少なくとも一つの発熱体配列に隣接して配置される、複数の放物線セグメントを備える、一体成形の反射鏡を提供することをさらに含む、請求項22に記載の方法。
- 上方発熱筐体の中に配置されるように、前記少なくとも一つの発熱体配列を選択することと、前記上方発熱筐体を、一つ以上のヒンジ機構によって反応チャンバ筐体に接続することと、をさらに含む、請求項22に記載の方法。
- 前記反応チャンバ筐体に固定位置で接続するように、前記一つ以上のヒンジ機構を選択することをさらに含む、請求項38に記載の方法。
- 前記反応チャンバに対して前記上方発熱筐体を上下させることによって、前記上方発熱筐体を再配置することをさらに含み、前記上方発熱筐体を再配置することは、前記複数のリブに対して0.25mm未満の位置公差まで、下げた位置に前記上方発熱筐体を再配置することを含む、請求項39に記載の方法。
- 前記複数の放射発熱灯は、互いに実質的に平行かつ隣接して配置される、細長い管型からなり、個々の前記放射発熱灯間の距離は、調整可能である、請求項24に記載の方法。
- 前記入口フランジから前記複数のリブ各々までの距離を測定することと、
前記複数のリブ各々の公称位置からの逸脱距離を計算することと、
前記複数のリブの平均逸脱距離を計算することと、
前記平均逸脱距離と等しい量だけ、前記少なくとも一つの発熱体配列に連結される、前記少なくとも一つの可変位置決めデバイスの前記位置を調整することと、をさらに含む、請求項22に記載の方法。
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