JP7166464B2 - チップ部品、チップ部品の製造方法、および電子機器の製造方法 - Google Patents

チップ部品、チップ部品の製造方法、および電子機器の製造方法 Download PDF

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Publication number
JP7166464B2
JP7166464B2 JP2021536618A JP2021536618A JP7166464B2 JP 7166464 B2 JP7166464 B2 JP 7166464B2 JP 2021536618 A JP2021536618 A JP 2021536618A JP 2021536618 A JP2021536618 A JP 2021536618A JP 7166464 B2 JP7166464 B2 JP 7166464B2
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JP
Japan
Prior art keywords
electrode
joint
chip component
joint portion
chip
Prior art date
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Application number
JP2021536618A
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English (en)
Japanese (ja)
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JPWO2021019867A1 (https=
JPWO2021019867A5 (https=
Inventor
剛 田邊
徹也 川添
拓也 岡本
佳洋 柴田
俊介 佐々木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Publication of JPWO2021019867A1 publication Critical patent/JPWO2021019867A1/ja
Publication of JPWO2021019867A5 publication Critical patent/JPWO2021019867A5/ja
Application granted granted Critical
Publication of JP7166464B2 publication Critical patent/JP7166464B2/ja
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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C1/00—Details
    • H01C1/14—Terminals or tapping points specially adapted for resistors; Arrangements of terminals or tapping points on resistors
    • H01C1/142—Terminals or tapping points specially adapted for resistors; Arrangements of terminals or tapping points on resistors the terminals or tapping points being coated on the resistive element
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C1/00—Details
    • H01C1/14—Terminals or tapping points specially adapted for resistors; Arrangements of terminals or tapping points on resistors
    • H01C1/148—Terminals or tapping points specially adapted for resistors; Arrangements of terminals or tapping points on resistors the terminals embracing or surrounding the resistive element
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/28—Apparatus or processes specially adapted for manufacturing resistors adapted for applying terminals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
    • H01G2/02—Mountings
    • H01G2/06—Mountings specially adapted for mounting on a printed-circuit support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals
    • H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/30—Stacked capacitors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/328—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by welding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Details Of Resistors (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Ceramic Capacitors (AREA)
JP2021536618A 2019-07-30 2020-05-14 チップ部品、チップ部品の製造方法、および電子機器の製造方法 Active JP7166464B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019139451 2019-07-30
JP2019139451 2019-07-30
PCT/JP2020/019343 WO2021019867A1 (ja) 2019-07-30 2020-05-14 チップ部品、チップ部品の製造方法、および電子機器の製造方法

Publications (3)

Publication Number Publication Date
JPWO2021019867A1 JPWO2021019867A1 (https=) 2021-02-04
JPWO2021019867A5 JPWO2021019867A5 (https=) 2022-02-09
JP7166464B2 true JP7166464B2 (ja) 2022-11-07

Family

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Family Applications (1)

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JP2021536618A Active JP7166464B2 (ja) 2019-07-30 2020-05-14 チップ部品、チップ部品の製造方法、および電子機器の製造方法

Country Status (3)

Country Link
JP (1) JP7166464B2 (https=)
CN (1) CN114145080B (https=)
WO (1) WO2021019867A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11641717B2 (en) * 2021-08-30 2023-05-02 International Business Machines Corporation Soldering of end chip components in series
JP7698599B2 (ja) * 2022-03-30 2025-06-25 株式会社村田製作所 チップ型電子部品の製造方法

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004296936A (ja) 2003-03-27 2004-10-21 Kyocera Corp セラミック電子部品
JP2006221690A (ja) 2005-02-08 2006-08-24 Alps Electric Co Ltd 磁気ヘッドアッセンブリの半田ボール接合方法
JP2010147406A (ja) 2008-12-22 2010-07-01 Tdk Corp 電子部品の製造方法
JP2011040720A (ja) 2009-08-17 2011-02-24 Nan Ya Printed Circuit Board Corp プリント回路基板及びその製造方法
WO2014038066A1 (ja) 2012-09-07 2014-03-13 三菱電機株式会社 パワー半導体装置
WO2015108151A1 (ja) 2014-01-17 2015-07-23 京セラ株式会社 積層型電子部品およびその実装構造体

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003152325A (ja) * 2001-11-13 2003-05-23 Matsushita Electric Ind Co Ltd チップ状電子部品の半田付け方法及びペースト半田形状
JP2003298220A (ja) * 2002-03-29 2003-10-17 Hitachi Ltd 回路基板および電子機器、およびそれらの製造方法
JP2012238725A (ja) * 2011-05-12 2012-12-06 Toshiba Corp 半導体装置とその製造方法、およびそれを用いた半導体モジュール
JP2013251493A (ja) * 2012-06-04 2013-12-12 Toshiba Corp 素子モジュール

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004296936A (ja) 2003-03-27 2004-10-21 Kyocera Corp セラミック電子部品
JP2006221690A (ja) 2005-02-08 2006-08-24 Alps Electric Co Ltd 磁気ヘッドアッセンブリの半田ボール接合方法
JP2010147406A (ja) 2008-12-22 2010-07-01 Tdk Corp 電子部品の製造方法
JP2011040720A (ja) 2009-08-17 2011-02-24 Nan Ya Printed Circuit Board Corp プリント回路基板及びその製造方法
WO2014038066A1 (ja) 2012-09-07 2014-03-13 三菱電機株式会社 パワー半導体装置
WO2015108151A1 (ja) 2014-01-17 2015-07-23 京セラ株式会社 積層型電子部品およびその実装構造体

Also Published As

Publication number Publication date
JPWO2021019867A1 (https=) 2021-02-04
WO2021019867A1 (ja) 2021-02-04
CN114145080A (zh) 2022-03-04
CN114145080B (zh) 2024-05-28

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