WO2021019867A1 - チップ部品、チップ部品の製造方法、および電子機器の製造方法 - Google Patents

チップ部品、チップ部品の製造方法、および電子機器の製造方法 Download PDF

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Publication number
WO2021019867A1
WO2021019867A1 PCT/JP2020/019343 JP2020019343W WO2021019867A1 WO 2021019867 A1 WO2021019867 A1 WO 2021019867A1 JP 2020019343 W JP2020019343 W JP 2020019343W WO 2021019867 A1 WO2021019867 A1 WO 2021019867A1
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WO
WIPO (PCT)
Prior art keywords
electrode
joint
chip component
chip
joint portion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2020/019343
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English (en)
French (fr)
Japanese (ja)
Inventor
田邊　剛
徹也 川添
岡本　拓也
佳洋 柴田
佐々木　俊介
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP2021536618A priority Critical patent/JP7166464B2/ja
Priority to CN202080052169.5A priority patent/CN114145080B/zh
Publication of WO2021019867A1 publication Critical patent/WO2021019867A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C1/00—Details
    • H01C1/14—Terminals or tapping points specially adapted for resistors; Arrangements of terminals or tapping points on resistors
    • H01C1/142—Terminals or tapping points specially adapted for resistors; Arrangements of terminals or tapping points on resistors the terminals or tapping points being coated on the resistive element
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C1/00—Details
    • H01C1/14—Terminals or tapping points specially adapted for resistors; Arrangements of terminals or tapping points on resistors
    • H01C1/148—Terminals or tapping points specially adapted for resistors; Arrangements of terminals or tapping points on resistors the terminals embracing or surrounding the resistive element
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/28—Apparatus or processes specially adapted for manufacturing resistors adapted for applying terminals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
    • H01G2/02—Mountings
    • H01G2/06—Mountings specially adapted for mounting on a printed-circuit support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals
    • H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/30—Stacked capacitors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/328—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by welding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering

Definitions

  • This disclosure relates to chip parts, manufacturing methods of chip parts, and manufacturing methods of electronic devices.
  • Electronic devices are required to be smaller and more sophisticated. Along with this, miniaturization is also required for electronic components soldered and mounted on printed wiring boards in electronic devices. The miniaturized electronic components are mounted at a relatively high density.
  • each electrode portion of the electronic component is pre-soldered to form a soldered portion, and the printed wiring board is formed.
  • a method of arranging each soldered portion on each electrode portion of the above and further melting each soldered portion in a far-infrared furnace is disclosed.
  • each soldered portion is formed by soldering to each electrode portion, it is possible to make the shape of each soldered portion formed on one electronic component uniform. Have difficulty. Therefore, when each soldered portion is arranged on each electrode portion of the printed wiring board, the contact state between each soldered portion and each electrode portion of the printed wiring board becomes non-uniform, and the timing at which each soldered portion melts. Is also non-uniform. In this case, the solder joint between the electronic component and the printed wiring board is liable to have a joint defect such as a displacement of the position of the electronic component with respect to the printed wiring board and so-called chip standing.
  • a main object of the present disclosure is to provide a chip component and a method for manufacturing the same, which can suppress the occurrence of joint failure of the solder joint between the electronic component and the printed wiring board as compared with the chip component used in the conventional mounting method. is there.
  • Another object of the present disclosure is to provide a method for manufacturing an electric device capable of suppressing the occurrence of a joint failure of a solder joint portion between an electronic component and a printed wiring board as compared with a conventional mounting method.
  • the chip component according to the present disclosure includes an electronic component including a first electrode, a second electrode arranged at a distance from the first electrode in the first direction, and a first joint portion bonded to the first electrode. , A second joint portion bonded to the second electrode is provided.
  • the materials constituting the first joint and the second joint include solder.
  • the first joint has a first protruding portion that protrudes with respect to the first electrode in the second direction intersecting the first direction.
  • the second joint has a second protruding portion that protrudes with respect to the second electrode in the second direction.
  • a chip component capable of suppressing the occurrence of a bonding defect at a solder joint portion between an electronic component and a printed wiring board as compared with a chip component used in a conventional mounting method, and a method for manufacturing the chip component. Further, it is possible to provide a method for manufacturing an electric device capable of suppressing the occurrence of a joint failure of a solder joint portion between an electronic component and a printed wiring board as compared with a conventional mounting method.
  • FIG. It is a perspective view which shows the chip part which concerns on Embodiment 1.
  • FIG. It is sectional drawing of the chip part shown in FIG. It is sectional drawing which shows one process of the manufacturing method of the chip part shown in FIG. It is sectional drawing which shows one step after the process shown in FIG. 3 of the manufacturing method of a chip part shown in FIG. It is sectional drawing which shows one step after the process shown in FIG. 4 of the manufacturing method of the chip part shown in FIG. It is sectional drawing which shows one step after the process shown in FIG. 5 of the manufacturing method of the chip part shown in FIG. It is sectional drawing which shows one step after the process shown in FIG. 6 of the manufacturing method of a chip part shown in FIG. It is sectional drawing which shows the electronic device which concerns on Embodiment 1.
  • FIG. It is sectional drawing which shows one step of the manufacturing method of the electronic device shown in FIG. It is sectional drawing which shows one step after the process shown in FIG. 9 of the manufacturing method of the electronic device shown in FIG. It is sectional drawing which shows one step after the process shown in FIG. 10 of the manufacturing method of the electronic device shown in FIG. It is sectional drawing which shows the chip part which concerns on Embodiment 2. It is sectional drawing which shows one step of the manufacturing method of the chip component shown in FIG. It is sectional drawing which shows one step after the process shown in FIG. 13 of the manufacturing method of a chip part shown in FIG. It is sectional drawing which shows one step after the process shown in FIG. 14 of the manufacturing method of a chip part shown in FIG.
  • the chip component 1 according to the first embodiment includes an electronic component 10 and a first joint portion 21 and a second joint portion 22, which are integrally formed. Is.
  • the electronic component 10 includes a first electrode 11, a second electrode 12, and a non-electrode portion 13.
  • the first electrode 11 and the second electrode 12 are arranged so as to be spaced apart from each other in the first direction A.
  • the first electrode 11 and the second electrode 12 form, for example, both ends of the electronic component 10 in the first direction A.
  • the material constituting the first electrode 11 and the second electrode 12 is a conductive material and includes, for example, copper (Cu).
  • the material constituting the non-electrode portion 13 is, for example, a material having a lower conductivity than the material constituting the first electrode 11 and the second electrode 12.
  • the first electrode 11 faces the second direction B, faces the first surface 11A extending along the first direction A and the third direction C, and faces the first direction A, and faces the second direction B and the second direction B. It has a second surface 11B extending along the third direction C.
  • the second direction B is the direction that intersects the first direction A
  • the third direction C is the direction that intersects the first direction A and the second direction B.
  • the first direction A, the second direction B, and the third direction C are, for example, orthogonal to each other.
  • the second direction B is, for example, a vertical direction.
  • the second electrode 12 faces the second direction B, faces the third surface 12A extending along the first direction A and the third direction C, and faces the first direction A, and faces the second direction B and the second direction B. It has a fourth surface 12B extending along the third direction C.
  • the third surface 12A is arranged on the same plane as the first surface 11A, for example.
  • the fourth surface 12B faces the side opposite to the second surface 11B in the first direction A.
  • the electronic component 10 may have any configuration as long as it is a surface mount electronic component having the above configuration, and is, for example, a ceramic capacitor.
  • the material constituting the non-electrode portion 13 is a ceramic dielectric, for example, barium titanate (BaTIO 3 ), calcium titanate (CaTIO 3 ), strontium titanate (SrTiO 3 ), and calcium zirconate (CaZrO). Includes at least one of 3 ).
  • the electronic component 10 may be configured as a resistor.
  • the first joint portion 21 is joined to the first electrode 11.
  • the first joint portion 21 is joined to at least a part of the first surface 11A and the second surface 11B.
  • the first joint portion 21 is joined to, for example, the entire first surface 11A and a part of the second surface 11B.
  • the material constituting the first joint portion 21 includes solder.
  • the first joint portion 21 has a first protruding portion 21A that protrudes from the first surface 11A of the first electrode 11 in the second direction B.
  • the first protruding portion 21A is arranged in a region that does not overlap with the first electrode 11 in the second direction B and a first portion 21C that is arranged in a region that overlaps with the first electrode 11 in the second direction B. It has a second portion 21D protruding from the second surface 11B of the first electrode 11 in the first direction A.
  • the first portion 21C and the second portion 21D are connected to each other and are configured as one.
  • the first joint portion 21 includes, for example, a portion that does not protrude from the first electrode 11 in the second direction B, in other words, a third portion 21B that is arranged so as to overlap the first electrode 11 in the first direction A. I have more.
  • the third portion 21B protrudes from the second surface 11B of the first electrode 11 in the first direction A.
  • the first protruding portion 21A and the third portion 21B are connected to each other and are configured as one.
  • the third portion 21B is joined to a region located on the first surface 11A side of the center of the second surface 11B in the second direction B, for example.
  • the top portion 21T of the first joint portion 21 having the longest distance from the first surface 11A in the second direction B is included in the first protruding portion 21A.
  • the top portion 21T is included in the first portion 21C of the first protruding portion 21A.
  • the outermost peripheral surface of the first protruding portion 21A when viewed from the third direction C is a curved surface.
  • the top portion 21T of the first protruding portion 21A is formed so as to make line contact with the plane.
  • the first protruding portion 21A makes line contact with the plane.
  • the first protruding portion 21A is configured as a part of a cylindrical body extending along the third direction C.
  • the second joint portion 22 is joined to the second electrode 12.
  • the second joint portion 22 is joined to at least a part of the third surface 12A and the fourth surface 12B.
  • the second joint portion 22 is joined to, for example, the entire third surface 12A and a part of the fourth surface 12B.
  • the material constituting the second joint portion 22 includes solder.
  • the second joint portion 22 has a second protruding portion 22A that protrudes from the third surface 12A of the second electrode 12 in the second direction B.
  • the second protruding portion 22A is arranged in a region that does not overlap with the second electrode 12 in the second direction B and a fourth portion 22C that is arranged in a region that overlaps with the second electrode 12 in the second direction B.
  • It has a fifth portion 22D protruding from the fourth surface 12B of the second electrode 12 in the first direction A.
  • the fourth portion 22C and the fifth portion 22D are connected to each other and are configured as one.
  • the second joint 22 includes, for example, a portion that does not protrude from the second electrode 12 in the second direction B, in other words, a sixth portion 22B that is arranged so as to overlap the second electrode 12 in the first direction A. I have more.
  • the sixth portion 22B protrudes from the fourth surface 12B of the second electrode 12 in the first direction A.
  • the second protruding portion 22A and the sixth portion 22B are connected to each other and are configured as one.
  • the sixth portion 22B is joined to a region located on the third surface 12A side of the center of the fourth surface 12B in the second direction B, for example.
  • the top portion 22T of the second joint portion 22 having the longest distance from the third surface 12A in the second direction B is included in the second protruding portion 22A.
  • the top 22T is included in the fourth portion 22C of the second protruding portion 22A.
  • the outermost outer peripheral surface of the second protruding portion 22A is a curved surface.
  • the top portion 22T of the second protruding portion 22A is formed so as to make line contact with the plane.
  • the second protruding portion 22A is configured as a part of a cylindrical body extending along the third direction C.
  • the height h1 of the first protruding portion 21A with respect to the first surface 11A of the first electrode 11 in the second direction B is the third surface of the second electrode 12. It is equal to the height h2 of the second protruding portion 22A with respect to 12A in the second direction B.
  • the distance L1 in the first direction A between the top portion 21T of the first protruding portion 21A and the top portion 22T of the second protruding portion 22A is between the first electrode 11 and the second electrode 12.
  • the shortest distance L2 in the first direction A in other words, the width of the first direction A of the non-electrode portion 13 or more.
  • the distance L1 is the longest distance L3 in the first direction A between the first electrode 11 and the second electrode 12, in other words, the second surface 11B of the first electrode 11 and the fourth surface 12B of the second electrode 12.
  • the shortest distance between them in the first direction A is as follows. From a different point of view, the top 21T overlaps the first surface 11A of the first electrode 11 in the second direction B, and the top 22T overlaps the third surface 12A of the second electrode 12 in the second direction B.
  • the first joint portion 21 and the second joint portion 22 pass through the center between the first electrode 11 and the second electrode 12 in the first direction A. It is formed symmetrically with respect to the center line CL extending along the second direction B.
  • the outer lines of the first joint portion 21 and the second joint portion 22 are formed, for example, in a substantially arc shape.
  • the cross-sectional shape of the chip component 1 perpendicular to the third direction C is constant regardless of the position of the cross section in the third direction C, for example.
  • the material constituting the first joint portion 21 and the second joint portion 22 is, for example, lead-free solder.
  • the materials constituting the first joint portion 21 and the second joint portion 22 include, for example, tin (Sn), silver (Ag), and copper (Cu), and the alloy composition thereof is, for example, Sn-3.0% Ag-. It is 0.5% Cu.
  • the material constituting the first joint portion 21 and the second joint portion 22 may be any solder material, for example, Ag, Cu, bismuth (Bi), indium (In), antimony (Sb), and lead. A solder material in which at least one of (Pb) is added to Sn may be used.
  • the first joint portion 21 and the second joint portion 22 are formed, for example, by melting the mixture of the solder material and the flux and then cooling the mixture (details will be described later).
  • the size of the electronic component 10 is not particularly limited, but is, for example, 0603 (the length of the first direction A (the distance L3) is 0.6 mm and the length of the third direction C is 0.3 mm), 0201. (The length of the first direction A is 0.2 mm and the length of the third direction C is 0.1 mm), 1005 (The length of the first direction A is 1.0 mm and the length of the third direction C is 0. 5 mm), or 1608 (the length of the first direction A is 1.6 mm and the length of the third direction C is 0.8 mm).
  • the chip component 1 shown in FIGS. 1 and 2 is manufactured by the method for manufacturing the chip component shown in FIGS. 3 to 7.
  • the first joint portion 21 and the second joint portion 22 are formed by screen printing using a mold 101 and a mask 102.
  • the second direction B of the electronic component 10 is the vertical direction
  • the first direction A and the third direction C of the electronic component 10 are the directions intersecting the vertical direction.
  • the mold 101 and the mask 102 shown in FIG. 3 are prepared (first step).
  • the mold 101 has an upper surface 101A.
  • the upper surface 101A is a plane extending along a direction intersecting the vertical direction.
  • the first direction A and the second direction B of the electronic component 10 in the fourth step and the fifth step (details will be described later) in which the electronic component 10 is arranged on the mold 101.
  • the third direction C will be described.
  • the mold 101 is formed with a first recess 201 and a second recess 202 that are recessed with respect to the upper surface 101A.
  • the first recess 201 and the second recess 202 of the mold 101 are for molding the joining material described later into the first joining portion 21 and the second joining portion 22 of the chip component 1.
  • the first recess 201 and the second recess 202 are spaced apart from each other in the first direction A.
  • the depth of the first recess 201 is equal to the height h1 of the first joint 21 of the chip component 1.
  • the depth of the second recess 202 is equal to the height h2 of the second joint 22 of the chip component 1.
  • the length of the first recess 201 and the second recess 202 in the third direction C is, for example, equal to the length of the first electrode 11 and the second electrode 12 in the third direction C.
  • the depth of the first recess 201 is equal to the depth of the second recess 202.
  • the first recess 201 and the second recess 202 are formed symmetrically with respect to the center line CL2 extending along the second direction B through the center between the first recess 201 and the second recess 202 in the first direction A. ing.
  • the length of the first direction A between the center of the first recess 201 and the center of the second recess 202 in the first direction A is equal to the distance L1 in the chip component 1.
  • the mask 102 has a lower surface 102A in contact with the upper surface 101A of the mold 101 and an upper surface 102B located on the opposite side of the lower surface 102A.
  • the lower surface 102A and the upper surface 102B are planes extending along the first direction A and the third direction C.
  • the mask 102 is formed with a first through hole 203 and a second through hole 204 extending from the lower surface 102A to the upper surface 102B.
  • the first through hole 203 is formed so as to be connected to the first recess 201 in the second direction B.
  • the second through hole 204 is formed so as to be connected to the second recess 202 in the second direction B.
  • the width of the first through hole 203 is equal to, for example, the width of the first recess 201.
  • the width of the second through hole 204 is equal to, for example, the width of the second recess 202.
  • the width of the first through hole 203 and the second through hole 204 in the third direction C is equal to, for example, the length of the first electrode 11 and the second electrode 12 in the third direction C.
  • the first through hole 203 and the second through hole 204 are formed symmetrically with respect to the center line CL2.
  • the material constituting the mask 102 includes, for example, stainless steel (SUS).
  • the mask 102 is, for example, a metal mask.
  • the thickness of the mask 102 in other words, the length of each of the first through hole 203 and the second through hole 204 in the second direction B is, for example, 100 ⁇ m.
  • the joining material 23 (first joining material) to be the first joining portion 21 is supplied to the inside of the first recess 201 and the first through hole 203 by screen printing. Further, the joining material 24 (second joining material) to be the second joining portion 22 is supplied to the inside of the second recess 202 and the second through hole 204 by screen printing (second step).
  • the joining material 23 is filled inside the first recess 201 and the first through hole 203 without any gap.
  • the joining material 24 is filled inside the second recess 202 and the second through hole 204 without any gap.
  • the upper surfaces of the joining materials 23 and 24 are flush with, for example, the upper surface 102B of the mask 102.
  • the bonding material 23 is, for example, a mixture of a plurality of solder balls 25 and a flux 26.
  • the bonding material 24 is, for example, a mixture of a plurality of solder balls 27 and a flux 28.
  • the material constituting the solder balls 25 and 27 is, for example, lead-free solder.
  • the materials constituting the solder balls 25 and 27 include, for example, Sn, Ag, and Cu, and the alloy composition of these is, for example, Sn-3.0% Ag-0.5% Cu.
  • the outer diameter of each of the solder balls 25 and 27 is, for example, 30 ⁇ m.
  • the sum of the volumes of each solder ball 25 is larger than the volume of the first recess 201.
  • the sum of the volumes of each solder ball 27 is larger than the volume of the second recess 202.
  • the material constituting the fluxes 26 and 28 contains rosin.
  • the fluxes 36 and 28 fill the gaps between the plurality of solder balls 25 and 27.
  • the mask 102 is pulled away from the mold 101.
  • the joining materials 23 and 24 project in the second direction B with respect to the mold 101.
  • the height of the bonding material 23 with respect to the mold 101 in the second direction B is equal to the height of the bonding material 24 with respect to the mold 101 in the second direction B.
  • the electronic component 10 is prepared (third step).
  • the electronic component 10 is arranged on the upper surface 101A of the mold 101 (fourth step).
  • the electronic component 10 is positioned with respect to the mold 101 and the joining materials 23 and 24 so that the center line CL of the electronic component 10 overlaps the center line CL2 of the mold 101 when viewed from the third direction C.
  • the first electrode 11 of the electronic component 10 is arranged on a part of the first recess 201 located on the second recess 202 side in the first direction A.
  • the bonding material 23 is arranged inside the electronic component 10 with respect to the second surface 11B in the first direction A and overlaps with the first electrode 11 in the second direction B. It has a portion that is arranged and a portion that is arranged outside the electronic component 10 from the second surface 11B in the first direction A and is arranged so as not to overlap with the first electrode 11 in the second direction B. doing.
  • the second electrode 12 of the electronic component 10 is arranged on a part of the second recess 202 located on the first recess 201 side in the first direction A.
  • the bonding material 24 is arranged inside the electronic component 10 in the first direction A with respect to the fourth surface 12B and overlaps with the second electrode 12 in the second direction B. It has a portion that is arranged and a portion that is arranged outside the electronic component 10 from the fourth surface 12B in the first direction A and is arranged so as not to overlap with the second electrode 12 in the second direction B. doing.
  • the first surface 11A of the first electrode 11 comes into contact with the upper surface of a part of the bonding material 23 located on the bonding material 24 side in the first direction A.
  • the third surface 12A of the second electrode 12 comes into contact with the upper surface of a part of the bonding material 24 located on the bonding material 23 side in the first direction A.
  • the lower surface of the non-electrode portion 13 of the electronic component 10 that is, the surface connected to the first surface 11A of the first electrode 11 and the third surface 12A of the second electrode 12, comes into contact with the upper surface 102B of the mask 102.
  • the non-electrode portion 13 of the electronic component 10 is arranged between the joining material 23 and the joining material 24 in the first direction A, and is arranged at a distance from the upper surface 101A of the mold 101 in the second direction B.
  • the first joint portion 21 and the second joint portion 22 are formed from the joint materials 23 and 24 (fifth step).
  • the bonding materials 23 and 24 are heated and melted.
  • the heating can be carried out by any method, but is carried out, for example, by charging the entire mold 101, the electronic component 10 and the joining materials 23 and 24 shown in FIG. 6 into the reflow furnace and heating them. Will be done.
  • the heating temperature is higher than the melting point of the materials constituting the bonding materials 23 and 24 and is a temperature that the electronic component 10 can withstand, for example, 250 ° C. By the above heating, the entire solder balls 25, 27 and the fluxes 26, 28 are melted.
  • the electronic component 10 is subjected to the action of gravity and descends until the non-electrode portion 13 comes into contact with the upper surface 101A of the mold 101.
  • a part of the molten bonding material 23 wets and spreads on the second surface 11B of the first electrode 11.
  • a part of the molten bonding material 24 wets and spreads on the fourth surface 12B of the second electrode 12.
  • the portion where the bonding material 23 before melting is arranged inside the electronic component 10 with respect to the second surface 11B in the first direction A and is arranged so as to overlap the first electrode 11 in the second direction B. And because it has a portion that is arranged outside the electronic component 10 with respect to the second surface 11B in the first direction A and is arranged so as not to overlap with the first electrode 11 in the second direction B.
  • the molten bonding material 23 easily wets and spreads on the second surface 11B of the first electrode 11.
  • a portion in which the bonding material 24 before melting is arranged inside the electronic component 10 with respect to the fourth surface 12B in the first direction A and is arranged so as to overlap the second electrode 12 in the second direction B.
  • the molten bonding material 24 easily wets and spreads on the fourth surface 12B of the second electrode 12.
  • the joining materials 23 and 24 are melted and then cooled.
  • the cooling can be carried out by any method, but is carried out, for example, by removing the entire mold 101, the electronic component 10, and the joining materials 23 and 24 from the reflow furnace.
  • a chip component 1 including the electronic component 10 the first joint portion 21 formed of the bonding material 23, and the second joint portion 22 formed of the bonding material 24 is manufactured. Will be done.
  • the chip component 1 is removed from the mold 101.
  • the electronic device 3 according to the first embodiment is manufactured by mounting the chip component 1 according to the first embodiment on a printed wiring board 2. As shown in FIG. 8, the electronic device 3 includes an electronic component 10, a printed wiring board 2, and a third joint 41 and a fourth joint 42.
  • the printed wiring board 2 includes a dielectric substrate and wiring patterns formed on the surface and inside of the dielectric substrate.
  • the dielectric substrate has an upper surface 2A.
  • the upper surface 2A is a plane extending along the first direction A and the third direction C.
  • the printed wiring board 2 is formed on the upper surface 2A, and includes a third electrode 31 and a fourth electrode 32 that form a part of the wiring pattern.
  • the third electrode 31 and the fourth electrode 32 are arranged at intervals from each other in the first direction A.
  • the material constituting the third electrode 31 and the fourth electrode 32 is a conductive material and includes, for example, Cu.
  • the third electrode 31 has a surface in contact with the upper surface 2A and a ninth surface 31A located on the side opposite to the surface.
  • the fourth electrode 32 has a surface in contact with the upper surface 2A and a tenth surface 32A located on the side opposite to the surface.
  • the height of the third electrode 31 in the second direction B with respect to the upper surface 2A is equal to, for example, the height of the fourth electrode 32 with respect to the upper surface 2A in the second direction B.
  • the first electrode 11 of the electronic component 10 is arranged so as to overlap the third electrode 31 in the second direction B.
  • the second electrode 12 of the electronic component 10 is arranged so as to overlap the fourth electrode 32 in the second direction B.
  • the center line CL extends along the second direction B through the center between the third electrode 31 and the fourth electrode 32 in the first direction A. It is arranged so as to overlap with.
  • the third joint portion 41 is joined to the first electrode 11 and the third electrode 31.
  • the third joint portion 41 is joined to, for example, the entire first surface 11A, the entire second surface 11B, and the entire ninth surface 31A.
  • the fourth joint portion 42 is joined to the second electrode 12 and the fourth electrode 32.
  • the fourth joint portion 42 is joined to, for example, the entire third surface 12A, the entire fourth surface 12B, and the entire tenth surface 32A.
  • the third joint portion 41 and the fourth joint portion 42 are formed symmetrically with respect to the center line CL3.
  • the material constituting the third joint portion 41 and the fourth joint portion 42 includes solder.
  • the third joint 41 is formed of the first joint 21 of the chip component 1 and the flux 33 described later.
  • the fourth joint 42 is formed of the second joint 22 of the chip component 1 and the flux 34 described later.
  • the electronic device 3 shown in FIG. 8 is manufactured by the manufacturing method of the electronic device 3 shown in FIGS. 9 and 10.
  • the chip component 1 and the printed wiring board 2 shown in FIG. 9 are prepared (7th step).
  • a third electrode 31 and a fourth electrode 32 are formed on the printed wiring board 2.
  • the flux 33 is formed on the third electrode 31 of the printed wiring board 2, and the flux 34 is formed on the fourth electrode 32.
  • the flux 33 is formed so as to cover, for example, the third electrode 31.
  • the flux 34 is formed so as to cover, for example, the fourth electrode 32.
  • the chip component 1 is arranged on the printed wiring board 2 shown in FIG. 10 (8th step).
  • the chip component 1 is positioned with respect to the printed wiring board 2 so that the center line CL overlaps the center line CL3 when viewed from the third direction C.
  • the first junction 21 is arranged on the third electrode 31 and the flux 33.
  • the second junction 22 is arranged on the fourth electrode 32 and the flux 34.
  • the first joint portion 21 to the third joint portion 41 are formed, and the second joint portion 22 to the fourth joint portion 42 are formed (9th step).
  • the first joint portion 21, the second joint portion 22, the flux 33, and the flux 34 are heated and melted.
  • the heating can be carried out by any method, for example, when the nozzle 300 blows hot air onto the first joint portion 21, the second joint portion 22, the flux 33, and the flux 34 as shown in FIG. , Will be implemented.
  • the nozzle 300 is arranged on the side opposite to the printed wiring board 2 with respect to the electronic component 10, for example.
  • the heating temperature is higher than the melting points of the materials constituting the first joint portion 21, the second joint portion 22, the flux 33, and the flux 34, and is a temperature that the electronic component 10 can withstand, for example, 250 ° C.
  • the first joint portion 21, the second joint portion 22, the flux 33, and the entire flux 34 are melted.
  • a part of the melted first joint portion 21 wets and spreads on the second surface 11B of the first electrode 11.
  • a part of the melted second joint portion 22 wets and spreads on the fourth surface 12B of the second electrode 12.
  • the first joint portion 21 and the second joint portion 22 are melted and then cooled.
  • the cooling can be carried out by any method, but is carried out, for example, by stopping the heating by the nozzle 300.
  • the printed wiring board 2 As a result, as shown in FIG. 8, from the electronic component 10, the printed wiring board 2, the third joint 41 formed from the first joint 21 and the flux 33, the second joint 22 and the flux 34.
  • An electronic device 3 including the formed fourth joint 42 is manufactured.
  • each soldered portion for joining with each electrode of the printed wiring board is joined to each electrode of the electronic component by soldering. Therefore, each soldered portion of the comparative example does not protrude toward the printed wiring board side with respect to each electrode of the electronic component, and the shape of the soldered portion bonded to the first electrode and the solder bonded to the second electrode. It is difficult to improve the uniformity with the shape of the attached portion.
  • each soldered portion and each electrode of the printed wiring board are in contact with each other is likely to vary.
  • the soldered portion joined to the first electrode is in contact with the third electrode of the printed wiring board.
  • the soldered portion joined to the second electrode may not be in contact with the fourth electrode of the printed wiring board. If the soldered parts are heated in such a state, the timing at which each soldered part melts varies, and the electronic components are displaced from the position where they should be originally arranged, or the electronic components stand up and one of the electrodes is printed. Problems such as not being joined to the wiring board (joining failure) may occur. Such poor bonding is particularly likely to occur in miniaturized electronic components.
  • the chip component 1 includes an electronic component 10, a first joint portion 21, and a second joint portion 22.
  • the material constituting the first joint portion 21 and the second joint portion 22 includes solder.
  • the first joint portion 21 has a first protruding portion 21A that protrudes with respect to the first electrode 11 in the second direction B that intersects the first direction A.
  • the second joint 22 has a second protruding portion 22A that protrudes with respect to the second electrode 12 in the second direction B. Therefore, the first joint portion 21 and the second joint portion 22 of the chip component 1 can come into contact with the third electrode 31 and the fourth electrode 32 more reliably than the soldered portions of the above comparative example.
  • the first joint portion 21 and the second joint portion 22 of the chip component 1 can come into contact with the third electrode 31 and the fourth electrode 32. Therefore, when the first joint portion 21 and the second joint portion 22 are melted in the manufacturing method of the electronic device 3, the variation in the timing at which the first joint portion 21 and the second joint portion 22 are melted is that of the above comparative example. Is more suppressed than. That is, according to the chip component 1, it is possible to suppress the occurrence of joint defects such as deviation of the electronic component 10 and rising of the electronic component in the electronic device 3.
  • first joint portion 21 including the first protruding portion 21A and the second joint portion 22 including the second protruding portion 22A can be easily manufactured by using the mold 101. Therefore, the chip component 1 can be manufactured relatively easily. Further, the uniformity between the shape of the first joint portion 21 and the shape of the second joint portion 22 is higher than the uniformity of each soldered portion of the above comparative example formed by soldering without using the mold 101. Has been done. Further, the uniformity of the shapes of the first joint portion 21 and the second joint portion 22 among the plurality of chip parts 1 manufactured by using the same mold 101 is such that each soldering between the plurality of comparative examples. It is higher than the uniformity of the part.
  • the height h1 of the first protruding portion 21A with respect to the first electrode 11 in the second direction B is the height h1 of the second protruding portion 22A with respect to the second electrode 12 in the second direction B. Equal to height h2.
  • the chip component 1 is suitable for a chip component in which the upper surfaces of the third electrode 31 and the fourth electrode 32 are joined to the printed wiring board 2 arranged on the same plane.
  • the first joint portion 21 and the second joint portion 22 pass through the center between the first electrode 11 and the second electrode 12 in the first direction A and are in the second direction. It is formed symmetrically with respect to the center line CL extending along B.
  • the third joint portion 41 and the fourth joint portion 42 of the electronic device 3 manufactured by using such a chip component 1 can be formed symmetrically with respect to the center line CL. Therefore, the joining reliability of the third joining portion 41 and the fourth joining portion 42 in the electronic device 3 is higher than that of the conventional electronic device manufactured by using the above comparative example.
  • the outermost peripheral surfaces of the first protruding portion 21A and the second protruding portion 22A viewed from the third direction C are curved surfaces. More specifically, when the first protruding portion 21A and the second protruding portion 22A are arranged on a plane extending along the first direction A and the third direction C, the first protruding portion 21A and the second protruding portion 21A and the second protruding portion 22A are arranged. Each of the portions 22A is formed so as to make point contact or line contact with the plane.
  • the plane region in contact with the plane in the first protruding portion 21A and the plane in the second protruding portion 22A If each of the first protruding portion 21A and the second protruding portion 22A comes into surface contact with the plane, the plane region in contact with the plane in the first protruding portion 21A and the plane in the second protruding portion 22A. If the planar region in contact with the surface forms the same surface, the uniformity is enhanced. On the other hand, when each of the first protruding portion 21A and the second protruding portion 22A makes line contact with the plane, the linear region in contact with the plane in the first protruding portion 21A and the plane in the second protruding portion 22A. The uniformity is enhanced when the linear regions in contact are parallel.
  • the top portion 21T of the first protruding portion 21A in the second direction B is arranged so as to overlap the first electrode 11 in the second direction B. Further, the top portion 22T of the second protruding portion 22A in the second direction B is arranged so as to overlap the second electrode 12 in the second direction B.
  • the top 21T is arranged inside the electronic component 10 with respect to the second surface 11B
  • the top 22T is arranged inside the electronic component 10 with respect to the fourth surface 12B.
  • the surface tensions of the melted first joint portion 21 and the second joint portion 22 act on the electronic component 10.
  • the surface tension of the melted first joint portion 21 cancels out the surface tension of the melted second joint portion 22.
  • the surface tension of the melted first joint portion 21 acts on the electronic component 10.
  • the surface tension (hereinafter referred to as the second surface tension) acting on the bonding material wet and spread on the second surface 11B of the molten first bonding portion 21 is the electronic component 10 with respect to the upper surface 2A of the printed wiring board 2. It acts to reduce the angle formed by the second surface 11B of the above.
  • the second surface tension acts to cause so-called chip standing.
  • the surface tension (hereinafter referred to as the first surface tension) acting on the bonding material wet and spread on the first surface 11A of the molten first bonding portion 21 acts to suppress the chip standing.
  • the second joint portion 22 when the difference between the surface tension and the first surface tension is less than the force required to cause the tip standing, the tip standing is suppressed.
  • the top portion 21T of the first protruding portion 21A in the second direction B is arranged so as to overlap the first electrode 11 in the second direction B, and the second The top portion 22T of the second protruding portion 22A in the direction B is arranged so as to overlap the second electrode 12 in the second direction B.
  • the first surface is compared with the case where the top 21T is arranged outside the electronic component 10 than the second surface 11B. Since the amount of the bonding material wet and spread on 11A increases, the first surface tension increases. Therefore, the difference between the second surface tension and the first surface tension in the former case is smaller than the difference between the second surface tension and the first surface tension in the latter case. As a result, according to the chip component 1, it is possible to suppress the occurrence of the rise of the electronic component 10 in the electronic device 3. The same effect as described above is also obtained when the top portion 22T is arranged so as to overlap the second electrode 12 in the second direction B.
  • the first joint portion including the first protruding portion 21A is used from the joining materials 23 and 24 arranged inside the first recess 201 and the second recess 202 by using the mold 101.
  • the second joint 22 including the 21 and the second protruding portion 22A is easily formed.
  • the variation in the shapes of the first joint portion 21 and the second joint portion 22 among the plurality of chip parts 1 manufactured by the method for manufacturing the chip parts 1 is the above-mentioned manufactured by soldering using a soldering iron. Compared with that of the comparative example, it is reduced.
  • each of the joining materials 23 and 24 contains a mixture of a solder ball and a flux. In this way, even when a natural oxide film is formed on the surfaces of the first electrode 11 and the second electrode 12 of the electronic component 10, the first joint portion 21 is a predetermined region in the first electrode 11. Is surely formed.
  • the first protruding portion 21A of the first joint portion 21 is connected to the third electrode 31, and the second protruding portion 22A of the second joint portion 22 is second.
  • the first joint portion 21 and the second joint portion 22 are melted. Therefore, the variation in the timing at which the first joint portion 21 and the second joint portion 22 melt is suppressed as compared with that in the above comparative example, and the timing at which the first joint portion 21 melts is the timing at which the second joint portion 22 melts. Can be equal to timing.
  • the electronic component 10 is displaced from the position where it should be originally arranged, or the electronic component stands up and one of the electrodes is raised. The occurrence of poor joining such as not being joined to the printed wiring board is suppressed.
  • the chip component 4 according to the second embodiment has basically the same configuration as the chip component 1 according to the first embodiment, but has the first joint portion 21 and the second joint portion 22. It differs from the chip component 1 in that the first joint portion 51 and the second joint portion 52 are provided instead of the chip component 1.
  • the first joint portion 51 has basically the same structure as the first joint portion 21, but is different from the first joint portion 21 in that it is formed of a solder ball 61 and a flux 63.
  • the second joint 52 has basically the same structure as the second joint 22, but differs from the second joint 22 in that it is formed of the solder balls 62 and the flux 64.
  • the chip component 4 is manufactured by the manufacturing method of the chip component 1 shown in FIGS. 13 to 15.
  • the first joint portion 51 and the second joint portion 52 are formed by using the mold 101.
  • the solder balls 61 and the flux 63 form the first bonding material
  • the solder balls 62 and the flux 64 form the second bonding material.
  • the mold 101 shown in FIG. 13 is prepared (first step).
  • the mold 101 has the same configuration as the mold 101 shown in FIG.
  • the solder balls 61 are supplied to the inside of the first recess 201 of the mold 101
  • the solder balls 62 are supplied to the inside of the second recess 202 of the mold 101 (second step).
  • the outer diameters of the solder balls 61 and 62 are equal to or greater than the width of the first electrode 11 and the second electrode 12 in the first direction A and equal to or less than the width of the first recess 201 and the second recess 202 in the first direction A. It is 0.2 mm.
  • the volume of each solder ball 61 is larger than the volume of the first recess 201.
  • the volume of the solder ball 62 is larger than the volume of the second recess 202.
  • the material constituting the solder balls 61 and 62 is, for example, lead-free solder.
  • the materials constituting the solder balls 61 and 62 include, for example, Sn, Ag, and Cu, and the alloy composition of these is, for example, Sn-3.0% Ag-0.5% Cu.
  • a plurality of solder balls 61 and 62 may be supplied to each of the first recess 201 and the second recess 202.
  • the plurality of solder balls 61 are not arranged side by side in the first direction A, for example, but are arranged side by side only in the third direction C.
  • the plurality of solder balls 62 are not arranged side by side in the first direction A, but are arranged side by side only in the third direction C.
  • the electronic component 10 is prepared (third step).
  • the flux 63 is applied to the first electrode 11 of the electronic component 10, and the flux 64 is applied to the second electrode 12 of the electronic component 10 (sixth step).
  • the region to which the flux 63 is applied in the first electrode 11 includes a region to be joined to the first joint portion 51 in the first electrode 11 of the chip component 4.
  • the region to which the flux 64 is applied in the second electrode 12 includes a region to be joined to the second joint portion 52 in the second electrode 12 of the chip component 4.
  • the region to which the flux 63 is applied includes, for example, the entire first surface 11A of the first electrode 11, and a part of the second surface 11B located on the first surface 11A side in the second direction B.
  • the region to which the flux 64 is applied includes, for example, the entire third surface 12A of the second electrode 12 and a part of the fourth surface 12B located on the third surface 12A side in the second direction B.
  • the method of applying the fluxes 63 and 64 is not particularly limited, but is, for example, transfer using a transfer device. Each part of the flux 63 and 64 may be applied on the non-electrode portion 13. As a result, the electronic component 10 shown in FIG. 14 is formed.
  • the electronic component 10 subjected to the sixth step is arranged on the solder balls 61 and 62 (fourth step).
  • the flux 63 comes into contact with the solder balls 61
  • the flux 64 comes into contact with the solder balls 62.
  • the first joint portion 21 and the second joint portion 22 are formed from the solder balls 61, 62 and the flux 63, 64 (fifth step).
  • the solder balls 61, 62 and the flux 63, 64 are heated and melted.
  • the heating can be performed by any method.
  • the mold 101, the electronic component 10, the solder balls 61, 62, and the flux 63, 64 shown in FIG. 14 are all charged into the reflow furnace and heated. By doing so.
  • the heating temperature is higher than the melting point of the materials constituting the solder balls 61 and 62 and is a temperature that the electronic component 10 can withstand, for example, 250 ° C.
  • the entire solder balls 61, 62 and the flux 63, 64 are melted.
  • the electronic component 10 descends until the non-electrode portion 13 comes into contact with the upper surface 101A of the mold 101.
  • a part of the molten solder ball 61 and the flux 63 wets and spreads on the second surface 11B of the first electrode 11.
  • a part of the molten solder ball 62 and the flux 64 wets and spreads on the fourth surface 12B of the second electrode 12.
  • the solder balls 61, 62 and the flux 63, 64 are melted and then cooled.
  • the cooling can be carried out by any method, for example, by taking out the entire mold 101, the electronic component 10, the solder balls 61, 62 and the flux 63, 64 from the reflow furnace. As a result, as shown in FIG. 15, the electronic component 10, the first joint portion 51 formed of the solder balls 61 and the flux 63, and the second joint portion 52 formed of the solder balls 62 and the flux 64 are formed.
  • the chip component 4 to be provided is manufactured. After that, the chip component 4 is removed from the mold 101.
  • the fluxes 63 and 64 may be applied on the solder balls 61 and 62 arranged inside the first recess 201 and the second recess 202 of the mold 101. As shown in FIG. 16, the flux 63 and 64 may be applied so as to cover the entire surface of the solder balls 61 and 62 exposed from the mold 101, for example.
  • the chip component 4 has basically the same configuration as the chip component 1, the same effect as that of the chip component 1 can be obtained.
  • the flux is applied to the first joint portion in the first electrode 11 and the second electrode 12.
  • the 21 and the second joint 22 are formed on the region to be formed.
  • the flux is formed on the solder balls 61 and 62.
  • the chip component 5 according to the third embodiment has basically the same configuration as the chip component 1 according to the first embodiment, but has the first joint portion 21 and the second joint portion 22. It differs from the chip component 1 in that it includes a first joint portion 71 and a second joint portion 72 instead of the chip component 1.
  • the first joint portion 71 has basically the same configuration as the first joint portion 21, but is different from the first joint portion 21 in that it is formed of the chip solder 81 and the flux 83.
  • the second joint portion 72 has basically the same configuration as the second joint portion 22, but differs from the second joint portion 22 in that it is formed of the chip solder 82 and the flux 84.
  • the chip component 5 is manufactured by the manufacturing method of the chip component 5 shown in FIGS. 18 to 20.
  • the first joint portion 71 and the second joint portion 72 are formed by using the mold 101.
  • the chip solder 81 and the flux 83 constitute the first bonding material
  • the chip solder 82 and the flux 84 constitute the second bonding material.
  • the mold 101 and the chip solders 81 and 82 shown in FIG. 18 are prepared.
  • the mold 101 has the same configuration as the mold 101 shown in FIG.
  • the chip solder 81 is arranged on the first recess 201 of the mold 101, and the chip solder 82 is arranged on the second recess 202 of the mold 101.
  • the volume of the chip solder 81 is larger than the volume of the first recess 201.
  • the volume of the chip solder 82 is larger than the volume of the second recess 202.
  • the chip solder 81 is arranged so as to close the first recess 201, for example.
  • the width of the first direction A of the chip solder 81 is wider than the width of the first direction A of the first recess 201, for example.
  • the width of the chip solder 81 in the third direction C is, for example, wider than the width of the first recess 201 in the third direction C.
  • the chip solder 82 is arranged so as to close the second recess 202.
  • the width of the chip solder 82 in the first direction A is wider than the width of the second recess 202 in the first direction.
  • the width of the chip solder 82 in the third direction C is wider than the width of the second recess 202 in the third direction.
  • the material constituting the chip solders 81 and 82 is, for example, lead-free solder.
  • the materials constituting the solder balls 61 and 62 include, for example, Sn, Ag, and Cu, and the alloy composition of these is, for example, Sn-3.0% Ag-0.5% Cu.
  • At least one chip solder 81 is arranged on one first recess 201, but for example, a plurality of chip solder 81 may be arranged. In this case, the plurality of chip solders 81 are arranged side by side in, for example, the third direction C.
  • at least one chip solder 82 may be arranged on one second recess 202, but for example, a plurality of chip solders 82 may be arranged. In this case, the plurality of chip solders 82 are arranged side by side in, for example, the third direction C.
  • the electronic component 10 is prepared, and the electronic component 10 is further arranged on the chip solders 81 and 82.
  • the electronic component 10 has the same configuration as the electronic component 10 prepared in, for example, the manufacturing method of the chip component 4.
  • Flux 83 is applied to the first electrode 11 of the prepared electronic component 10.
  • the flux 84 is applied to the second electrode 12 of the prepared electronic component 10.
  • the region to which the flux 83 is applied on the first electrode 11 of the prepared electronic component 10 includes a region to be joined to the first joint portion 71 on the first electrode 11 of the chip component 5.
  • the region to which the flux 84 is applied in the second electrode 12 of the prepared electronic component 10 includes a region to be bonded to the second joint portion 72 in the second electrode 12 of the chip component 5.
  • the region to which the flux 83 is applied includes, for example, the entire first surface 11A of the first electrode 11, and a part of the second surface 11B located on the first surface 11A side in the second direction B.
  • the region to which the flux 84 is applied includes, for example, the entire third surface 12A of the second electrode 12 and a part of the fourth surface 12B located on the third surface 12A side in the second direction B.
  • the method of applying the fluxes 83 and 84 is not particularly limited, but is, for example, transfer using a transfer device. Each part of the flux 63 and 64 may be applied on the non-electrode portion 13.
  • the chip solder 81, 82 and the flux 83, 84 are heated and melted.
  • the heating can be carried out by any method.
  • the mold 101, the electronic component 10, the chip solders 81 and 82 and the fluxs 83 and 84 shown in FIG. 19 are all charged into the reflow furnace and heated. By doing so.
  • the heating temperature is higher than the melting point of the materials constituting the chip solders 81 and 82 and is a temperature that the electronic component 10 can withstand, for example, 250 ° C.
  • the entire chip solder 81, 82 and the flux 83, 84 are melted.
  • a part of the melt of the chip solder 81 and the flux 83 flows into the inside of the first recess 201 and fills it, and the rest of the melt of the chip solder 81 and the flux 83 is the first electrode 11. It spreads wet on the first surface 11A and the second surface 11B.
  • a part of the melt of the chip solder 82 and the flux 84 flows into the inside of the second recess 202 and fills the inside, and the rest of the melt of the chip solder 82 and the flux 84 is the second electrode 12. It spreads wet on the third surface 12A and the fourth surface 12B.
  • the electronic component 10 descends until the non-electrode portion 13 comes into contact with the upper surface 101A of the mold 101.
  • a part of the molten chip solder 81 and the flux 83 wets and spreads on the second surface 11B of the first electrode 11.
  • a part of the molten chip solder 82 and the flux 84 wets and spreads on the fourth surface 12B of the second electrode 12.
  • the chip solder 81, 82 and the flux 83, 84 are melted and then cooled.
  • the cooling can be carried out by any method, but is carried out, for example, by taking out the entire mold 101, the electronic component 10, the chip solders 81, 82 and the flux 83, 84 from the reflow furnace.
  • the electronic component 10 the first joint portion 71 formed of the chip solder 81 and the flux 83, and the second joint portion 72 formed of the chip solder 82 and the flux 84 are formed.
  • the chip component 5 to be provided is manufactured. After that, the chip component 5 is removed from the mold 101.
  • the fluxes 83 and 84 may be applied on the chip solders 81 and 82 arranged on the first recess 201 and the second recess 202 of the mold 101.
  • the chip component 5 has basically the same configuration as the chip component 1, the same effect as that of the chip component 1 can be obtained.
  • the flux is applied to the first joint portion in the first electrode 11 and the second electrode 12.
  • the 21 and the second joint 22 are formed on the region to be formed.
  • flux is formed on the chip solders 81 and 82.
  • the chip component 6 according to the fourth embodiment has basically the same configuration as the chip component 1 according to the first embodiment, but has the first joint portion 21 and the second joint portion 22. It differs from the chip component 1 in that the first joint portion 91 and the second joint portion 92 are provided instead of the chip component 1.
  • the first joint portion 91 is different from the first joint portion 21 in that it is not joined to the second surface 11B of the first electrode 11.
  • the first joint portion 91 is joined only to, for example, the first surface 11A.
  • the second joint portion 92 is different from the first joint portion 21 in that it is not joined to the fourth surface 12B of the second electrode 12.
  • the second joint portion 92 is joined only to, for example, the third surface 12A.
  • the joining of the first joining portion 91 and the first electrode 11 and the joining of the second joining portion 92 and the second electrode 12 are carried out by an ultrasonic joining method.
  • the joining of the first joining portion 91 and the first electrode 11 and the joining of the second joining portion 92 and the second electrode 12 are carried out without using flux.
  • the solder balls constitute the first bonding material or the second bonding material.
  • the above-mentioned electronic component 10 and solder balls 61 and 62 are prepared. Next, while pressing the first electrode 11 and the solder ball 61 of the electronic component 10 in the second direction B, ultrasonic vibration is applied to them. Similarly, while pressing the second electrode 12 and the solder ball 62 of the electronic component 10 in the second direction B, ultrasonic vibration is applied to them. As a result, the chip component 6 is manufactured without using flux.
  • the chip component 6 Since the chip component 6 has basically the same configuration as the chip component 1, the same effect as that of the chip component 1 can be obtained.
  • each of the first bonding material and the second bonding material is made of solder balls, and in the fourth step, the solder balls are ultrasonically bonded to the first electrode 11 or the second electrode 12. To. Therefore, the manufacturing method of the chip component 6 does not require the flux used in each of the manufacturing methods of the chip parts 1, 4 and 5.
  • the first protruding portion 21A makes point contact with the plane. It may be provided in.
  • the second protruding portion 22A may be provided so as to make point contact with the plane. ..
  • the number of points in contact with the plane in the first protruding portion 21A and the number of points in contact with the plane in the second protruding portion 22A may be any number of 1 or more.
  • the first protruding portion 21A and the second protruding portion 22A may have a part of at least one spherical body or a part of at least one ellipsoid.
  • the first protruding portion 21A and the second protruding portion 22A are each part of a plurality of spherical bodies arranged side by side in the third direction C, or one of each of a plurality of ellipsoids arranged side by side in the third direction C. It may have a part.
  • the first recess 201 and the second recess 202 of the mold 101 are provided so that the first joint 21 and the second joint 22 including the first protruding portion 21A and the second protruding portion 22A as described above are formed. Has been done.
  • the chip components 1 and 4 to 6 have the above-mentioned configurations, the occurrence of joint failure at the solder joint between the electronic component and the printed wiring board is suppressed as compared with the chip component used in the conventional mounting method. it can. Therefore, other configurations of the chip components 1, 4 to 6, for example, the configurations of the chip components 1, 4 to 6 in the cross section perpendicular to the first direction A, and the like are not particularly limited as long as they are compatible with the above-described configurations.
  • the first electrode 11 shown in FIG. 1 faces the third direction C, and has a fifth surface 11C extending along the first direction A and the second direction B, and a fifth surface 11C in the third direction C. It also has a sixth surface 11D facing away from it.
  • the second electrode 12 faces the third direction C, and faces the seventh surface 12C extending along the first direction A and the second direction B and the side opposite to the seventh surface 12C in the third direction C. It also has an eighth surface 12D.
  • the first joint portion 21 and the second joint portion 22 are not formed on the fifth surface 11C, the sixth surface 11D, the seventh surface 12C, and the eighth surface 12D. It is not limited to this.
  • the first joint portion 21 and the second joint portion 22 may be formed on the fifth surface 11C, the sixth surface 11D, the seventh surface 12C, and the eighth surface 12D.
  • FIG. 22 is a cross-sectional view perpendicular to the first direction A of the modified example of the chip component 1, and is a cross-sectional view passing through the first portion 21C of the first protruding portion 21A of the first electrode 11 and the first joint portion 21. .. As shown in FIG. 22, the first joint portion 21 is joined to, for example, a part of each of the fifth surface 11C and the sixth surface 11D in addition to the first surface 11A and the second surface 11B.
  • the first protruding portion 21A is arranged in a region that does not overlap with the first electrode 11 in the second direction B, and is on the fifth surface 11C of the first electrode 11 in the third direction C.
  • the seventh portion 21E protruding with respect to the seventh portion 21E is arranged in a region that does not overlap with the first electrode 11 in the second direction B, and protrudes from the sixth surface 11D of the first electrode 11 in the third direction C. It also has an eighth portion 21F.
  • the first joint 21 further has a ninth portion 21G arranged on the fifth surface 11C in the third direction C and a tenth portion 21H arranged on the sixth surface 11D in the third direction C. doing.
  • the first portion 21C, the seventh portion 21E, the eighth portion 21F, the ninth portion 21G, and the tenth portion 21H are integrally configured.
  • the top portion 21T of the first joint portion 21 is formed only in a region overlapping the first electrode 11 in, for example, the second direction B.
  • the top portion 21T of the first joint portion 21 may be formed so as to extend from the inside to the outside with respect to the fifth surface 11C and the sixth surface 11D of the first electrode 11 in the third direction C.
  • the chip component 1 shown in FIG. 22 is manufactured by using the mold 101 shown in FIG. 22.
  • the length of the first recess 201 of the mold 101 in the third direction C is longer than, for example, the length of the first electrode 11 and the second electrode 12 in the third direction C.
  • the chip component 1 shown in FIG. 22 has basically the same configuration as the chip component 1 shown in FIGS. 1 and 2, it has the same effect as the chip component 1 shown in FIGS. 1 and 2. Can play. Further, according to the chip component 1 shown in FIG. 22, when the first joint portion 21 and the second joint portion 22 are melted in the manufacturing method of the electronic device 3, one of the melted first joint portions 21 is formed. The portion wets and spreads on the fifth surface 11C of the first electrode 11, and the other part wets and spreads on the sixth surface 11D of the first electrode 11. Therefore, the bonding strength between the electronic component 10 of the electronic device 3 manufactured by using the chip component 1 shown in FIG. 22 and the printed wiring board 2 is the electronic device manufactured by using the chip component 1 shown in FIG. It is higher than the joint strength between the electronic component 10 of 3 and the printed wiring board 2.
  • FIG. 23 is a cross-sectional view perpendicular to the first direction A of another modified example of the chip component 1 and passes through the first portion 21C of the first protruding portion 21A of the first electrode 11 and the first joint portion 21. Is.
  • the first protruding portion 21A points to the plane. It may be provided so as to come into contact with each other.
  • the number of points in contact with the plane in the first protruding portion 21A is a plurality.
  • the second joint portion 22 of the chip component 1 shown in FIGS. 22 and 23 has, for example, the same configuration as the first joint portion 21.
  • the chip component 7 according to the fifth embodiment has basically the same configuration as the chip component 1 according to the first embodiment, but the first joint portion 21 is in the second direction B. It differs from the chip component 1 in that it is joined to a region located on the first surface 11A side with respect to the center of the second surface 11B and a region located on the side opposite to the first surface 11A with respect to the center. .. Similarly, in the chip component 7, the region where the second joint 22 is located on the first surface 11A side with respect to the center of the second surface 11B in the second direction B and the region opposite to the first surface 11A with respect to the center. It differs from the chip component 1 in that it is joined to a region located on the side.
  • first joint portion 21 has a portion arranged above the center of the second surface 11B of the first electrode 11 in the second direction B.
  • the second joint portion 22 has a portion arranged above the center of the fourth surface 12B of the second electrode 12 in the second direction B.
  • the first joint portion 21 is joined to the entire surface of the second surface 11B, and the second joint portion 22 is joined to the entire surface of the fourth surface 12B.
  • each of the first joint portion 21 and the second joint portion 22 is first in the third direction C in addition to the first direction A and the second direction B. It differs from the chip component 1 in that it protrudes from the electrode 11 or the second electrode 12.
  • the first joint portion 21 has a portion that protrudes from the first electrode 11 in the third direction C.
  • the first protruding portion 21A has a portion protruding from the first electrode 11 in the third direction C.
  • a part of the portion of the first joint portion 21 arranged above the center of the second surface 11B of the first electrode 11 in the second direction B projects with respect to the first electrode 11 in the third direction C. ing.
  • the second joint portion 22 has a portion that protrudes from the second electrode 12 in the third direction C.
  • the second protruding portion 22A has a portion protruding with respect to the second electrode 12 in the third direction C.
  • a part of the portion of the second joint 22 arranged above the center of the fourth surface 12B of the second electrode 12 in the second direction B projects with respect to the second electrode 12 in the third direction C. ing.
  • the first electrode 11 faces the third direction C, and faces the fifth surface 11C extending along the first direction A and the second direction B and the side opposite to the fifth surface 11C in the third direction C. It also has a sixth surface 11D.
  • the second electrode 12 faces the third direction C, and faces the seventh surface 12C extending along the first direction A and the second direction B and the side opposite to the seventh surface 12C in the third direction C. It also has an eighth surface 12D.
  • the first joint portion 21 and the second joint portion 22 are formed on the fifth surface 11C, the sixth surface 11D, the seventh surface 12C, and the eighth surface 12D.
  • the top portion 21T of the first joint portion 21 is formed only in a region that does not overlap with the first electrode 11 in, for example, the second direction B.
  • the top portion 22T of the second joint portion 22 is formed only in a region that does not overlap with the second electrode 12 in, for example, the second direction B.
  • the chip component 7 is manufactured by the manufacturing method of the chip component 7 shown in FIGS. 26 to 28.
  • the first joint portion 21 and the second joint portion 22 are formed by using the mold 101.
  • the joining material 23 constitutes the first joining material
  • the joining material 24 constitutes the second joining material.
  • the mold 101 has basically the same configuration as the mold 101 shown in FIG. 26.
  • the joining material 23 is supplied to the first recess 201 and the joining material 24 is supplied to the second recess 202 by the dispenser 400.
  • the bonding material 23 is also supplied above the center of the second surface 11B in the second direction B.
  • the bonding material 24 is also supplied above the center of the fourth surface 12B in the second direction B.
  • the joining material 23 and the joining material 24 are heated and melted.
  • the heating can be carried out by any method, but is carried out by being charged into a reflow furnace and heated, for example, as in other embodiments.
  • the bonding material 23 flows into the inside of the first recess 201 and fills it, and the remaining portion of the bonding material 23 wets and spreads on the first surface 11A and the second surface 11B of the first electrode 11.
  • a part of the bonding material 24 flows into and fills the inside of the second recess 202, and the rest of the bonding material 24 wets and spreads on the third surface 12A and the fourth surface 12B of the second electrode 12. ..
  • the joining material 23 and the joining material 24 are melted and then cooled.
  • the cooling can be carried out by any method, but is carried out, for example, by being taken out of the reflow furnace, as in other embodiments.
  • the chip component 7 including the electronic component 10 the first junction 21 formed of the bonding material 23, and the second junction 22 formed of the bonding material 24 is manufactured. Will be done. After that, the chip component 7 is removed from the mold 101.
  • the electronic device according to the fifth embodiment shown in FIG. 29 is manufactured.
  • the chip component 7 has basically the same configuration as the chip component 1, the same effect as that of the chip component 1 can be obtained.
  • each part of the second surface 11B and the fourth surface 12B is exposed without getting wet with solder, the storage environment of the chip component 1 is tentatively bad and the above-mentioned exposed portion is oxidized.
  • the third joint 41 and the fourth joint 42 are above the second surface 11B and the fourth surface 12B as shown in FIGS. 30 and 31. There is a possibility that it will not get wet.
  • each of the first joint portion 21 and the second joint portion 22 projects outward from each side of the electronic component 10 in the first direction A and the second direction B.
  • the electronic component 10 is manufactured from a chip component 1 that does not project outward from each side.
  • the first joint portion 21 has a portion arranged above the center of the second surface 11B in the second direction B
  • the second joint portion 22 is the second. It has a portion arranged above the center of the fourth surface 12B in the direction B. Therefore, in the electronic device shown in FIG. 29 in which the chip component 7 is mounted on the printed wiring board 2, the third joint portion 41 is compared with the electronic device 3 in which the chip component 1 is mounted on the printed wiring board 2. And each of the fourth joints 42 is reliably wetted and spread over the entire surface of each of the second surface 11B and the fourth surface 12B. Therefore, according to the chip component 7, oxidation of the second surface 11B and the fourth surface 12B is suppressed regardless of the storage environment. That is, the chip component 7 is excellent in storability.
  • each of the first joint portion 21 and the second joint portion 22 of the chip component 7 is outside each side of the electronic component 10 in the third direction C in addition to the first direction A and the second direction B. It has a protruding part. Therefore, the volumes of the third joint portion 41 and the fourth joint portion 42 of the electronic device shown in FIG. 29 are equal to or larger than the volumes of the third joint portion 41 and the fourth joint portion 42 of the electronic device shown in FIGS. Can be done. As a result, the shortest distance d1 between the end of the second electrode 12 of the chip component 7 and the third joint 41 shown in FIG. 29 is the second electrode 12 of the chip component shown in FIGS. 30 and 31. It is longer than the shortest distance d2 between the end portion and the third joint portion 41.
  • the electronic device shown in FIG. 29 reaches the breakage. Is longer than the time until the above-mentioned fracture occurs in the electronic devices shown in FIGS. 30 and 31. As a result, the life of the solder joint in the electronic device shown in FIG. 29 is longer than that in the electronic device shown in FIGS. 30 and 31.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Details Of Resistors (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Ceramic Capacitors (AREA)
PCT/JP2020/019343 2019-07-30 2020-05-14 チップ部品、チップ部品の製造方法、および電子機器の製造方法 Ceased WO2021019867A1 (ja)

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CN202080052169.5A CN114145080B (zh) 2019-07-30 2020-05-14 芯片部件、芯片部件的制造方法以及电子设备的制造方法

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JP2011040720A (ja) * 2009-08-17 2011-02-24 Nan Ya Printed Circuit Board Corp プリント回路基板及びその製造方法
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JP2010147406A (ja) * 2008-12-22 2010-07-01 Tdk Corp 電子部品の製造方法
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JP2011040720A (ja) * 2009-08-17 2011-02-24 Nan Ya Printed Circuit Board Corp プリント回路基板及びその製造方法
WO2015108151A1 (ja) * 2014-01-17 2015-07-23 京セラ株式会社 積層型電子部品およびその実装構造体

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CN114145080B (zh) 2024-05-28

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