CN114145080B - 芯片部件、芯片部件的制造方法以及电子设备的制造方法 - Google Patents

芯片部件、芯片部件的制造方法以及电子设备的制造方法 Download PDF

Info

Publication number
CN114145080B
CN114145080B CN202080052169.5A CN202080052169A CN114145080B CN 114145080 B CN114145080 B CN 114145080B CN 202080052169 A CN202080052169 A CN 202080052169A CN 114145080 B CN114145080 B CN 114145080B
Authority
CN
China
Prior art keywords
electrode
bonding
chip component
joint
protruding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202080052169.5A
Other languages
English (en)
Chinese (zh)
Other versions
CN114145080A (zh
Inventor
田边刚
川添彻也
冈本拓也
柴田佳洋
佐佐木俊介
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Publication of CN114145080A publication Critical patent/CN114145080A/zh
Application granted granted Critical
Publication of CN114145080B publication Critical patent/CN114145080B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C1/00—Details
    • H01C1/14—Terminals or tapping points specially adapted for resistors; Arrangements of terminals or tapping points on resistors
    • H01C1/142—Terminals or tapping points specially adapted for resistors; Arrangements of terminals or tapping points on resistors the terminals or tapping points being coated on the resistive element
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C1/00—Details
    • H01C1/14—Terminals or tapping points specially adapted for resistors; Arrangements of terminals or tapping points on resistors
    • H01C1/148—Terminals or tapping points specially adapted for resistors; Arrangements of terminals or tapping points on resistors the terminals embracing or surrounding the resistive element
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/28—Apparatus or processes specially adapted for manufacturing resistors adapted for applying terminals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
    • H01G2/02—Mountings
    • H01G2/06—Mountings specially adapted for mounting on a printed-circuit support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals
    • H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/30—Stacked capacitors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/328—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by welding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Details Of Resistors (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Ceramic Capacitors (AREA)
CN202080052169.5A 2019-07-30 2020-05-14 芯片部件、芯片部件的制造方法以及电子设备的制造方法 Active CN114145080B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019139451 2019-07-30
JP2019-139451 2019-07-30
PCT/JP2020/019343 WO2021019867A1 (ja) 2019-07-30 2020-05-14 チップ部品、チップ部品の製造方法、および電子機器の製造方法

Publications (2)

Publication Number Publication Date
CN114145080A CN114145080A (zh) 2022-03-04
CN114145080B true CN114145080B (zh) 2024-05-28

Family

ID=74228432

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202080052169.5A Active CN114145080B (zh) 2019-07-30 2020-05-14 芯片部件、芯片部件的制造方法以及电子设备的制造方法

Country Status (3)

Country Link
JP (1) JP7166464B2 (https=)
CN (1) CN114145080B (https=)
WO (1) WO2021019867A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11641717B2 (en) * 2021-08-30 2023-05-02 International Business Machines Corporation Soldering of end chip components in series
JP7698599B2 (ja) * 2022-03-30 2025-06-25 株式会社村田製作所 チップ型電子部品の製造方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003152325A (ja) * 2001-11-13 2003-05-23 Matsushita Electric Ind Co Ltd チップ状電子部品の半田付け方法及びペースト半田形状
CN1449029A (zh) * 2002-03-29 2003-10-15 株式会社日立制作所 电路基板和电子机器，以及其制造方法
CN102779813A (zh) * 2011-05-12 2012-11-14 株式会社东芝 半导体装置及其制造方法以及采用它的半导体模块

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004296936A (ja) * 2003-03-27 2004-10-21 Kyocera Corp セラミック電子部品
JP2006221690A (ja) * 2005-02-08 2006-08-24 Alps Electric Co Ltd 磁気ヘッドアッセンブリの半田ボール接合方法
JP2010147406A (ja) * 2008-12-22 2010-07-01 Tdk Corp 電子部品の製造方法
TWI367697B (en) * 2009-08-17 2012-07-01 Nan Ya Printed Circuit Board Printed circuit board and fabrication method thereof
JP2013251493A (ja) * 2012-06-04 2013-12-12 Toshiba Corp 素子モジュール
CN104604344B (zh) * 2012-09-07 2019-04-16 三菱电机株式会社 功率半导体装置
US10283271B2 (en) * 2014-01-17 2019-05-07 Kyocera Corporation Laminated electronic component and laminated electronic component mounting structure

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003152325A (ja) * 2001-11-13 2003-05-23 Matsushita Electric Ind Co Ltd チップ状電子部品の半田付け方法及びペースト半田形状
CN1449029A (zh) * 2002-03-29 2003-10-15 株式会社日立制作所 电路基板和电子机器，以及其制造方法
CN102779813A (zh) * 2011-05-12 2012-11-14 株式会社东芝 半导体装置及其制造方法以及采用它的半导体模块

Also Published As

Publication number Publication date
JPWO2021019867A1 (https=) 2021-02-04
JP7166464B2 (ja) 2022-11-07
WO2021019867A1 (ja) 2021-02-04
CN114145080A (zh) 2022-03-04

Similar Documents

Publication Publication Date Title
US8338715B2 (en) PCB with soldering pad projections forming fillet solder joints and method of production thereof
CN109859948B (zh) 陶瓷电子部件
JP4356581B2 (ja) 電子部品実装方法
CN114145080B (zh) 芯片部件、芯片部件的制造方法以及电子设备的制造方法
JP2010212318A (ja) プリント配線基板および部品実装構造体
JP4263765B1 (ja) 電子部品ハンダ付け方法
JP2020141066A (ja) プリント配線板および電子機器
US20060049238A1 (en) Solderable structures and methods for soldering
JP2002223062A (ja) プリント配線基板のパッド形状
JP2017092270A (ja) 半導体装置
JP2003152003A (ja) 構造体、及び、その構造体を用いた実装方法
JPH0349211A (ja) 電子部品
JP4026267B2 (ja) 電子部品の実装構造及び実装方法
CN206231042U (zh) 金属掩模
JP4381657B2 (ja) 回路基板および電子部品実装方法
JP7648484B2 (ja) 金属端子付き電子部品、接続構造体、及び接続構造体の製造方法
JP7597037B2 (ja) 電子部品実装用基体、電子部品実装体およびその製造方法、ならびに電子機器
JP2010087232A (ja) 電子部品および電子部品用基板ならびにそれらの製造方法
JP2006066811A (ja) はんだ印刷用マスク、部品実装方法
US20100038123A1 (en) Board unit and manufacturing method for the same
JPH0435917B2 (https=)
JP2007305904A (ja) 電極端子の固定構造およびその固定方法
JP2005064379A (ja) 配線基板およびその製造方法
JP2020205313A (ja) 電子部品および電子回路モジュールの製造方法
JP2007173616A (ja) 電子部品搭載用基板および電子装置

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant