JP7155455B2 - Ｖｃｓｅｌモジュール - Google Patents

Ｖｃｓｅｌモジュール Download PDF

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Publication number
JP7155455B2
JP7155455B2 JP2022516276A JP2022516276A JP7155455B2 JP 7155455 B2 JP7155455 B2 JP 7155455B2 JP 2022516276 A JP2022516276 A JP 2022516276A JP 2022516276 A JP2022516276 A JP 2022516276A JP 7155455 B2 JP7155455 B2 JP 7155455B2
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JP
Japan
Prior art keywords
vcsel
terminal
electrode
semiconductor device
module
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JP2022516276A
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English (en)
Japanese (ja)
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JPWO2021261496A5 (https=
JPWO2021261496A1 (https=
Inventor
貴 秋山
仁 内村
健志 相原
博昭 原
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Citizen Electronics Co Ltd
Citizen Watch Co Ltd
Original Assignee
Citizen Electronics Co Ltd
Citizen Watch Co Ltd
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Application filed by Citizen Electronics Co Ltd, Citizen Watch Co Ltd filed Critical Citizen Electronics Co Ltd
Publication of JPWO2021261496A1 publication Critical patent/JPWO2021261496A1/ja
Publication of JPWO2021261496A5 publication Critical patent/JPWO2021261496A5/ja
Priority to JP2022161135A priority Critical patent/JP7628993B2/ja
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Publication of JP7155455B2 publication Critical patent/JP7155455B2/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0239—Combinations of electrical or optical elements
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
    • G01S17/00—Systems using the reflection or reradiation of electromagnetic waves other than radio waves, e.g. lidar systems
    • G01S17/02—Systems using the reflection of electromagnetic waves other than radio waves
    • G01S17/06—Systems determining position data of a target
    • G01S17/08—Systems determining position data of a target for measuring distance only
    • G01S17/10—Systems determining position data of a target for measuring distance only using transmission of interrupted, pulse-modulated waves
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
    • G01S7/00—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00
    • G01S7/48—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00 of systems according to group G01S17/00
    • G01S7/483—Details of pulse systems
    • G01S7/484—Transmitters
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/023—Mount members, e.g. sub-mount members
    • H01S5/02325—Mechanically integrated components on mount members or optical micro-benches
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0233—Mounting configuration of laser chips
    • H01S5/02345—Wire-bonding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/024—Arrangements for thermal management
    • H01S5/02469—Passive cooling, e.g. where heat is removed by the housing as a whole or by a heat pipe without any active cooling element like a TEC
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/04—Processes or apparatus for excitation, e.g. pumping, e.g. by electron beams
    • H01S5/042—Electrical excitation ; Circuits therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/04—Processes or apparatus for excitation, e.g. pumping, e.g. by electron beams
    • H01S5/042—Electrical excitation ; Circuits therefor
    • H01S5/0425—Electrodes, e.g. characterised by the structure
    • H01S5/04256—Electrodes, e.g. characterised by the structure characterised by the configuration
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/04—Processes or apparatus for excitation, e.g. pumping, e.g. by electron beams
    • H01S5/042—Electrical excitation ; Circuits therefor
    • H01S5/0428—Electrical excitation ; Circuits therefor for applying pulses to the laser
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/06—Arrangements for controlling the laser output parameters, e.g. by operating on the active medium
    • H01S5/062—Arrangements for controlling the laser output parameters, e.g. by operating on the active medium by varying the potential of the electrodes
    • H01S5/06226—Modulation at ultra-high frequencies
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
    • H01S5/42—Arrays of surface emitting lasers
    • H01S5/423—Arrays of surface emitting lasers having a vertical cavity
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/10—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
    • H01S5/18—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities
    • H01S5/183—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities having only vertical cavities, e.g. vertical cavity surface-emitting lasers [VCSEL]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5445—Dispositions of bond wires being orthogonal to a side surface of the chip, e.g. parallel arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/732—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between stacked chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/752—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between stacked chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Radar, Positioning & Navigation (AREA)
  • Remote Sensing (AREA)
  • Semiconductor Lasers (AREA)
JP2022516276A 2020-06-22 2021-06-22 Ｖｃｓｅｌモジュール Active JP7155455B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2022161135A JP7628993B2 (ja) 2020-06-22 2022-10-05 Ｖｃｓｅｌモジュール

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2020107020 2020-06-22
JP2020107020 2020-06-22
JP2021052423 2021-03-25
JP2021052423 2021-03-25
PCT/JP2021/023664 WO2021261496A1 (ja) 2020-06-22 2021-06-22 Ｖｃｓｅｌモジュール

Related Child Applications (1)

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JP2022161135A Division JP7628993B2 (ja) 2020-06-22 2022-10-05 Ｖｃｓｅｌモジュール

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JPWO2021261496A1 JPWO2021261496A1 (https=) 2021-12-30
JPWO2021261496A5 JPWO2021261496A5 (https=) 2022-06-10
JP7155455B2 true JP7155455B2 (ja) 2022-10-18

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US (1) US20240243546A1 (https=)
JP (2) JP7155455B2 (https=)
CN (1) CN115943533A (https=)
WO (1) WO2021261496A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116316052A (zh) * 2023-03-22 2023-06-23 宁波飞芯电子科技有限公司 垂直腔面发射激光器、探测设备及探测系统

Citations (10)

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Publication number Priority date Publication date Assignee Title
JP2010531546A (ja) 2007-06-27 2010-09-24 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ 光センサ・モジュール及びその製造方法
JP2012037276A (ja) 2010-08-04 2012-02-23 Sharp Corp 光学式測距装置
WO2014017256A1 (ja) 2012-07-24 2014-01-30 シャープ株式会社 光学式測距装置および電子機器
WO2018100082A1 (en) 2016-11-30 2018-06-07 Sony Semiconductor Solutions Corporation Apparatus and method
US20180278011A1 (en) 2017-03-23 2018-09-27 Infineon Technologies Ag Laser diode module
JP2019158693A (ja) 2018-03-15 2019-09-19 株式会社リコー 受光装置、物体検出装置、距離測定装置、移動体装置、ノイズ計測方法、物体検出方法及び距離測定方法
US20200006271A1 (en) 2018-07-02 2020-01-02 Taiwan Semiconductor Manufacturing Co., Ltd. Structures for bonding a group iii-v device to a substrate
WO2020044817A1 (ja) 2018-08-31 2020-03-05 ソニーセミコンダクタソリューションズ株式会社 光源装置、検出方法、センシングモジュール
WO2020054257A1 (ja) 2018-09-11 2020-03-19 ソニーセミコンダクタソリューションズ株式会社 光源装置、センシングモジュール
US20200185875A1 (en) 2018-12-06 2020-06-11 Finisar Corporation Optoelectronic assembly

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JPH06203403A (ja) * 1992-10-22 1994-07-22 Matsushita Electron Corp 半導体レーザ装置および光ピックアップ装置
JPH06237016A (ja) * 1993-02-09 1994-08-23 Matsushita Electric Ind Co Ltd 光ファイバモジュールおよびその製造方法
JP3831631B2 (ja) * 2000-09-29 2006-10-11 三洋電機株式会社 受光素子及びそれを備える光半導体装置
JP2004031456A (ja) * 2002-06-21 2004-01-29 Fujitsu Ltd 光インタコネクション装置及びインタコネクションモジュール
CN1947267A (zh) * 2004-04-21 2007-04-11 松下电器产业株式会社 发光元件驱动用半导体芯片、发光装置以及照明装置
JP5034368B2 (ja) * 2006-08-17 2012-09-26 富士ゼロックス株式会社 高周波特性が改善された表面発光型半導体レーザ素子
JP2009008721A (ja) * 2007-06-26 2009-01-15 Fuji Xerox Co Ltd 光モジュール、光電気複合基板、光信号伝送装置及び画像形成装置
JP2009105240A (ja) * 2007-10-24 2009-05-14 Fuji Xerox Co Ltd 半導体発光装置
US8488921B2 (en) * 2010-07-16 2013-07-16 International Business Machines Corporation Packaged multicore fiber optical transceiver module
JP5952101B2 (ja) * 2012-06-20 2016-07-13 日本特殊陶業株式会社 光電気混載ユニット、素子搭載モジュール
JP6280002B2 (ja) * 2014-08-22 2018-02-14 浜松ホトニクス株式会社 測距方法及び測距装置
EP3764487A4 (en) * 2018-03-08 2021-12-01 Kyocera Corporation SUBSTRATE FOR THE ASSEMBLY OF A LIGHT EMITTING ELEMENT AND LIGHT EMITTING DEVICE
JP2021114556A (ja) * 2020-01-20 2021-08-05 ソニーセミコンダクタソリューションズ株式会社 発光装置およびその製造方法

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010531546A (ja) 2007-06-27 2010-09-24 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ 光センサ・モジュール及びその製造方法
JP2012037276A (ja) 2010-08-04 2012-02-23 Sharp Corp 光学式測距装置
WO2014017256A1 (ja) 2012-07-24 2014-01-30 シャープ株式会社 光学式測距装置および電子機器
WO2018100082A1 (en) 2016-11-30 2018-06-07 Sony Semiconductor Solutions Corporation Apparatus and method
US20180278011A1 (en) 2017-03-23 2018-09-27 Infineon Technologies Ag Laser diode module
JP2019158693A (ja) 2018-03-15 2019-09-19 株式会社リコー 受光装置、物体検出装置、距離測定装置、移動体装置、ノイズ計測方法、物体検出方法及び距離測定方法
US20200006271A1 (en) 2018-07-02 2020-01-02 Taiwan Semiconductor Manufacturing Co., Ltd. Structures for bonding a group iii-v device to a substrate
WO2020044817A1 (ja) 2018-08-31 2020-03-05 ソニーセミコンダクタソリューションズ株式会社 光源装置、検出方法、センシングモジュール
WO2020054257A1 (ja) 2018-09-11 2020-03-19 ソニーセミコンダクタソリューションズ株式会社 光源装置、センシングモジュール
US20200185875A1 (en) 2018-12-06 2020-06-11 Finisar Corporation Optoelectronic assembly

Also Published As

Publication number Publication date
CN115943533A (zh) 2023-04-07
WO2021261496A1 (ja) 2021-12-30
US20240243546A1 (en) 2024-07-18
JP7628993B2 (ja) 2025-02-12
JPWO2021261496A1 (https=) 2021-12-30
JP2022179619A (ja) 2022-12-02

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